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CY62167EV30LL-45ZXAT

Infineon Technologies

CY62167EV30LL-45ZXAT by Infineon Technologies

Infineon's CY62167EV30LL-45ZXAT is a 1MX16 SRAM with 3.6V max supply voltage, 45ns access time, and 16-bit memory width. Ideal for industrial applications requiring fast and reliable data storage in a compact package with common I/O type and asynchronous operation mode.

Median Price

$15.767

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 55 parts In-Stock

1+ parts

$15.767

100+ parts

-

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55

$15.767

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Vyrian

USA . 1,215 parts In-Stock

1+ parts

-

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1,215

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Digiode

USA . 58 parts In-Stock

1+ parts

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58

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 59 parts In-Stock

1+ parts

$2.330

100+ parts

-

1k+ parts

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59

$2.330

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Corohmni

South Africa . 355 parts In-Stock

1+ parts

$4.637

100+ parts

-

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355

$4.637

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Modulus Dynamics

Lithuania . 2,882 parts In-Stock

1+ parts

$4.681

100+ parts

$4.494

1k+ parts

$4.307

10k+ parts

-

2,882

$4.681

$4.494

$4.307

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Andel Nordic

Denmark . 4,105 parts In-Stock

1+ parts

$6.742

100+ parts

-

1k+ parts

$6.472

10k+ parts

$6.472

4,105

$6.742

-

$6.472

$6.472

AZTECH Wire

Italy . 295 parts In-Stock

1+ parts

$9.771

100+ parts

-

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295

$9.771

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$15.452

100+ parts

-

1k+ parts

$14.834

10k+ parts

-

50

$15.452

-

$14.834

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Continental Prestige Electronics

USA . 1,683 parts In-Stock

1+ parts

$15.767

100+ parts

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1k+ parts

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10k+ parts

$15.452

1,683

$15.767

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-

$15.452

Semicontronic

India . 1,373 parts In-Stock

1+ parts

$19.000

100+ parts

$18.525

1k+ parts

$18.430

10k+ parts

-

1,373

$19.000

$18.525

$18.430

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Ampacity Inc.

Singapore . 546 parts In-Stock

1+ parts

$27.000

100+ parts

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546

$27.000

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QUARKTWIN TECHNOLOGY LTD

USA . 18,688 parts In-Stock

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18,688

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Argo Parts USA

USA . 2,832 parts In-Stock

1+ parts

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2,832

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Corphita

USA . 928 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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928

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Overview

Unlock the power of seamless data storage with the CY62167EV30LL-45ZXAT by Infineon Technologies. As a leading manufacturer of high-quality SRAM products, Infineon Technologies delivers unparalleled reliability and performance. Ideal for industrial applications, this SRAM module offers 1MX16 organization, 3-STATE output characteristics, and a fast 45 ns maximum access time. With a compact design and dual terminal position, this memory module provides customers with a cost-effective solution for their data storage needs. Trust Infineon Technologies to provide cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight package for the SRAM, making it suitable for various electronic applications.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard voltage level of 3V, ensuring compatibility with a wide range of systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures up to 85°C, making it suitable for industrial environments.

Parallel or Serial: PARALLEL

Uses a parallel interface for fast data transfer, enhancing performance in data-intensive applications.

Memory Density: 16777216 bit

Offers high memory density, allowing for storage of large amounts of data in a compact device.

Technical Specifications

SRAM CY62167EV30LL-45ZXAT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Alternate Memory Width:

8

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

18.4 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Trade Compliance

CY62167EV30LL-45ZXAT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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