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CY62147EV30LL-45B2XIT

Infineon Technologies

CY62147EV30LL-45B2XIT by Infineon Technologies

Infineon's CY62147EV30LL-45B2XIT is a 256Kx16 SRAM with 3.6V max supply, 45ns access time, and operates in industrial temperature range. It features a grid array package style with very thin profile and fine pitch, suitable for applications requiring fast and reliable memory storage in harsh environments.

Median Price

$5.520

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$5.520

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$5.520

-

-

-

Flip Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

Digiode

USA . 510 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

510

-

-

-

-

Vyrian

USA . 133 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

133

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 1,047 parts In-Stock

1+ parts

$2.821

100+ parts

$2.708

1k+ parts

$2.595

10k+ parts

-

1,047

$2.821

$2.708

$2.595

-

Continental Prestige Electronics

USA . 5,323 parts In-Stock

1+ parts

$5.520

100+ parts

-

1k+ parts

-

10k+ parts

$5.410

5,323

$5.520

-

-

$5.410

Netroflash

USA . 50 parts In-Stock

1+ parts

$5.520

100+ parts

-

1k+ parts

$5.244

10k+ parts

$5.134

50

$5.520

-

$5.244

$5.134

Aztec Data Supply Inc.

USA . 252 parts In-Stock

1+ parts

$5.693

100+ parts

-

1k+ parts

-

10k+ parts

-

252

$5.693

-

-

-

Corohmni

South Africa . 223 parts In-Stock

1+ parts

$5.911

100+ parts

-

1k+ parts

-

10k+ parts

-

223

$5.911

-

-

-

AZTECH Wire

Italy . 645 parts In-Stock

1+ parts

$5.999

100+ parts

-

1k+ parts

-

10k+ parts

-

645

$5.999

-

-

-

Semicontronic

India . 136 parts In-Stock

1+ parts

$15.000

100+ parts

$14.625

1k+ parts

$14.550

10k+ parts

-

136

$15.000

$14.625

$14.550

-

Ampacity Inc.

Singapore . 648 parts In-Stock

1+ parts

$19.000

100+ parts

-

1k+ parts

-

10k+ parts

-

648

$19.000

-

-

-

Argo Parts USA

USA . 4,608 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,608

-

-

-

-

Corphita

USA . 676 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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676

-

-

-

-

Robosynatics

Brazil . 150 parts In-Stock

1+ parts

-

100+ parts

$5.677

1k+ parts

$5.677

10k+ parts

$5.677

150

-

$5.677

$5.677

$5.677

Lucentia Tech

USA . 150 parts In-Stock

1+ parts

-

100+ parts

$5.677

1k+ parts

$5.677

10k+ parts

$5.677

150

-

$5.677

$5.677

$5.677

Overview

Unleash the power of cutting-edge technology with the CY62147EV30LL-45B2XIT by Infineon Technologies. This high-quality SRAM memory chip offers unparalleled performance and reliability, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this versatile memory solution delivers exceptional speed and efficiency. Upgrade your devices today with the CY62147EV30LL-45B2XIT and experience the ultimate in memory technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this SRAM lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

With surface mount capability, this SRAM can be easily integrated onto circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular package shape of this SRAM allows for easy placement and alignment on the PCB, making it suitable for mass production.

Operating Mode: ASYNCHRONOUS

Operating in asynchronous mode allows for quick and efficient data transfer, improving the overall performance of the device.

Input/Output Type: COMMON

Common input/output type simplifies the design and implementation process, making this SRAM user-friendly for engineers.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V ensures compatibility with standard power sources, making this SRAM versatile for a wide range of applications.

Technical Specifications

SRAM CY62147EV30LL-45B2XIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Standby Current:

.00002 Amp

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

6 mm

Trade Compliance

CY62147EV30LL-45B2XIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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