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CY7C1041G-10ZSXIT

Infineon Technologies

CY7C1041G-10ZSXIT by Infineon Technologies

Infineon's CY7C1041G-10ZSXIT is a 256Kx16 SRAM with 100MHz clock frequency, 10ns access time, and 3-state output. It operates at -40 to 85°C, suitable for high-speed applications like networking equipment and industrial automation systems. The memory IC features a small outline package with dual terminals and Gull Wing form factor.

Median Price

$6.240

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,595 parts In-Stock

1+ parts

$6.240

100+ parts

$5.371

1k+ parts

$4.942

10k+ parts

$4.816

1,595

$6.240

$5.371

$4.942

$4.816

Mouser Electronics

USA . 845 parts In-Stock

1+ parts

$6.240

100+ parts

$5.380

1k+ parts

$4.940

10k+ parts

-

845

$6.240

$5.380

$4.940

-

Flip Electronics (Authorized)

USA . 14,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,000

-

-

-

-

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.859

10k+ parts

-

2,000

-

-

$3.859

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 301 parts In-Stock

1+ parts

$7.030

100+ parts

-

1k+ parts

-

10k+ parts

-

301

$7.030

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$7.419

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$7.419

-

-

-

Bristol Electronics

USA . 108 parts In-Stock

1+ parts

$9.632

100+ parts

$4.173

1k+ parts

-

10k+ parts

-

108

$9.632

$4.173

-

-

Chip Stock

USA . 16,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,500

-

-

-

-

Flip Electronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Vyrian

USA . 4,423 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,423

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 6,393 parts In-Stock

1+ parts

$3.320

100+ parts

-

1k+ parts

-

10k+ parts

-

6,393

$3.320

-

-

-

Ampacity Inc.

Singapore . 4,443 parts In-Stock

1+ parts

$3.720

100+ parts

-

1k+ parts

-

10k+ parts

-

4,443

$3.720

-

-

-

Semicontronic

India . 4,319 parts In-Stock

1+ parts

$3.720

100+ parts

$3.627

1k+ parts

$3.608

10k+ parts

-

4,319

$3.720

$3.627

$3.608

-

Modulus Dynamics

Lithuania . 367 parts In-Stock

1+ parts

$3.826

100+ parts

$3.673

1k+ parts

$3.520

10k+ parts

-

367

$3.826

$3.673

$3.520

-

Corohmni

South Africa . 730 parts In-Stock

1+ parts

$4.085

100+ parts

-

1k+ parts

-

10k+ parts

-

730

$4.085

-

-

-

Corphita

USA . 227 parts In-Stock

1+ parts

$6.660

100+ parts

-

1k+ parts

-

10k+ parts

-

227

$6.660

-

-

-

Component Stockers USA

USA . 2,688 parts In-Stock

1+ parts

$6.960

100+ parts

$5.610

1k+ parts

$4.990

10k+ parts

-

2,688

$6.960

$5.610

$4.990

-

Continental Prestige Electronics

USA . 6,430 parts In-Stock

1+ parts

$7.419

100+ parts

-

1k+ parts

-

10k+ parts

$7.270

6,430

$7.419

-

-

$7.270

Netroflash

USA . 100 parts In-Stock

1+ parts

$7.419

100+ parts

-

1k+ parts

$7.048

10k+ parts

$6.899

100

$7.419

-

$7.048

$6.899

QUARKTWIN TECHNOLOGY LTD

USA . 15,557 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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15,557

-

-

-

-

Futuretech Components

Singapore . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Argo Parts USA

USA . 4,597 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,597

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Overview

Unlock unparalleled performance and reliability with the CY7C1041G-10ZSXIT by Infineon Technologies. As a leading manufacturer of high-quality SRAM products, Infineon Technologies sets the standard for excellence in the industry. This versatile memory device is perfect for a wide range of applications, offering customers the value, benefits, and advantages they need to stay ahead of the competition. Experience seamless operation, superior efficiency, and unmatched durability with the CY7C1041G-10ZSXIT - the ultimate choice for your memory needs.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protects the internal components, making it suitable for various applications.

Surface Mount:

YES - This feature allows for easy installation and space-saving on PCBs, making it ideal for compact designs.

Package Shape:

RECTANGULAR - The rectangular shape fits well in standardized designs, ensuring compatibility with existing equipment.

Operating Mode:

ASYNCHRONOUS - The asynchronous operation allows for individual memory access without the need for synchronization, enhancing flexibility in data retrieval.

Input/Output Type:

COMMON - The common input/output type simplifies connections and integration with other devices, improving overall system compatibility.

Nominal Supply Voltage / Vsup (V):

5 - Operating at 5V ensures reliable performance and stable power supply for consistent data storage and retrieval.

No. of Terminals:

44 - The ample number of terminals enables versatile connectivity options and simplifies interfacing with other components.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE - The compact and thin profile design saves space in electronic assemblies, making it suitable for compact devices.

Maximum Operating Temperature:

85 °C - With a high operating temperature range, this product can withstand demanding environmental conditions.

Organization:

256KX16 - The organization of 256Kx16 provides a large memory capacity and efficient data handling capabilities.

Output Characteristics:

3-STATE - The 3-state output allows for multiple devices to share the same output line, enhancing system flexibility and efficiency.

Minimum Standby Voltage:

1 V - The low minimum standby voltage conserves power when the device is not in use, improving energy efficiency.

Minimum Operating Temperature:

40 °C - With a low minimum operating temperature, this product can function reliably in harsh environments and extreme conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - The durable terminal finish ensures reliable connections and corrosion resistance for long-term performance.

Terminal Position:

DUAL - The dual terminal position provides flexibility in PCB layout and simplifies installation in various orientations.

Maximum Seated Height:

1.194 mm - The low seated height saves space in vertical installations and reduces the overall footprint of the device.

Maximum Clock Frequency (fCLK):

100 MHz - Operating at a high clock frequency of 100 MHz allows for fast data access and processing speed.

Width:

10.16 mm - The compact width makes this product suitable for space-constrained applications and compact electronic designs.

Minimum Supply Voltage (Vsup):

4.5 V - With a low minimum supply voltage, this product can operate efficiently even under low power conditions.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature ensures secure soldering during assembly, preventing solder joint failure.

Length:

18.415 mm - The moderate length provides a balance between space-saving design and ease of installation in electronic assemblies.

Technology:

CMOS - Operating on CMOS technology offers low power consumption, high speed, and compatibility with a wide range of devices.

Parallel or Serial:

PARALLEL - The parallel operation allows for simultaneous data transfer, speeding up data processing and enhancing system performance.

Terminal Form:

GULL WING - The gull-wing terminal form simplifies soldering and enhances mechanical strength, ensuring reliable connections.

Maximum Supply Current:

45 mA - With a maximum supply current of 45 mA, this product operates efficiently without drawing excessive power.

No. of Words:

262144 words - Featuring a large number of words, this product offers ample memory capacity for storing and accessing data.

Memory Width:

16 - The memory width of 16 bits allows for efficient data processing and compatibility with various data formats.

Terminal Pitch:

0.8 mm - The small terminal pitch facilitates compact PCB layouts and enables high-density designs.

No. of Words Code:

256K - The 256K words code provides a standardized memory capacity, ensuring compatibility and easy integration with existing systems.

Moisture Sensitivity Level (MSL):

3 - With an MSL of 3, this product can withstand moderate levels of moisture exposure, making it suitable for a wide range of environments.

Maximum Supply Voltage (Vsup):

5.5 V - Operating at a maximum supply voltage of 5.5V ensures stable performance and protection against voltage fluctuations.

Memory Density:

4194304 bit - The high memory density of 4194304 bits offers ample storage capacity for data-intensive applications.

Memory IC Type:

STANDARD SRAM - As a standard SRAM memory IC, this product provides fast and reliable data storage and retrieval capabilities.

Output Enable:

YES - The output enable feature allows for efficient control of data output, enhancing system flexibility and functionality.

Maximum Standby Current:

0.008 Amp - With a low maximum standby current, this product conserves power in standby mode, improving energy efficiency.

Maximum Access Time:

10 ns - With a maximum access time of 10 ns, this product offers fast data retrieval and processing speed for efficient performance.

Technical Specifications

SRAM CY7C1041G-10ZSXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

10 ns

Maximum Clock Frequency (fCLK):

100 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e4

Length:

18.415 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.194 mm

Maximum Standby Current:

.008 Amp

Minimum Standby Voltage:

1 V

Maximum Supply Current:

45 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

CY7C1041G-10ZSXIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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