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CY62167EV30LL-45BVXIT

Infineon Technologies

CY62167EV30LL-45BVXIT by Infineon Technologies

CY62167EV30LL-45BVXIT by Infineon: 1MX16 SRAM with 45ns access time, operates at 3V, and has 48 terminals. Ideal for industrial applications requiring high-speed data storage in a compact form factor.

Median Price

$16.225

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,873 parts In-Stock

1+ parts

$8.280

100+ parts

$6.200

1k+ parts

$5.650

10k+ parts

-

1,873

$8.280

$6.200

$5.650

-

Newark

USA . 928 parts In-Stock

1+ parts

$16.150

100+ parts

$13.820

1k+ parts

$13.210

10k+ parts

-

928

$16.150

$13.820

$13.210

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Chip1Stop

Japan . 1,198 parts In-Stock

1+ parts

$16.300

100+ parts

-

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1,198

$16.300

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Mouser Electronics

USA . 3,102 parts In-Stock

1+ parts

$16.410

100+ parts

$14.050

1k+ parts

$13.100

10k+ parts

$11.180

3,102

$16.410

$14.050

$13.100

$11.180

DigiKey

USA . 938 parts In-Stock

1+ parts

$16.410

100+ parts

$14.044

1k+ parts

$13.238

10k+ parts

$12.572

938

$16.410

$14.044

$13.238

$12.572

Verical

USA . 17,436 parts In-Stock

1+ parts

-

100+ parts

$11.275

1k+ parts

$10.088

10k+ parts

$9.488

17,436

-

$11.275

$10.088

$9.488

Rochester

USA . 17,436 parts In-Stock

1+ parts

-

100+ parts

$9.020

1k+ parts

$8.070

10k+ parts

$7.590

17,436

-

$9.020

$8.070

$7.590

Flip Electronics (Authorized)

USA . 1,884 parts In-Stock

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1,884

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Element14

Singapore . 901 parts In-Stock

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$18.670

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901

-

$18.670

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 801 parts In-Stock

1+ parts

$9.510

100+ parts

-

1k+ parts

-

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801

$9.510

-

-

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Nova Conductors

Japan . 30 parts In-Stock

1+ parts

$12.618

100+ parts

-

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30

$12.618

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-

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Chip Stock

USA . 17,500 parts In-Stock

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17,500

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Vyrian

USA . 14,149 parts In-Stock

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14,149

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-

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Flip Electronics

USA . 6,400 parts In-Stock

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6,400

-

-

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Rutronik

Germany . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$13.360

2,000

-

-

-

$13.360

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 272 parts In-Stock

1+ parts

$4.086

100+ parts

-

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-

10k+ parts

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272

$4.086

-

-

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Modulus Dynamics

Lithuania . 858 parts In-Stock

1+ parts

$4.159

100+ parts

$3.993

1k+ parts

$3.826

10k+ parts

-

858

$4.159

$3.993

$3.826

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Advanced Electronics

New Zealand . 92 parts In-Stock

1+ parts

$5.180

100+ parts

$4.921

1k+ parts

$4.921

10k+ parts

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92

$5.180

$4.921

$4.921

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Aztec Data Supply Inc.

USA . 3,937 parts In-Stock

1+ parts

$5.830

100+ parts

-

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3,937

$5.830

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Ampacity Inc.

Singapore . 14,049 parts In-Stock

1+ parts

$6.920

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14,049

$6.920

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Corphita

USA . 678 parts In-Stock

1+ parts

$9.009

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678

$9.009

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$12.618

100+ parts

$12.365

1k+ parts

-

10k+ parts

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1,000

$12.618

$12.365

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Component Stockers USA

USA . 58,599 parts In-Stock

1+ parts

$13.100

100+ parts

$10.340

1k+ parts

$9.170

10k+ parts

$10.610

58,599

$13.100

$10.340

$9.170

$10.610

Semicontronic

India . 6,264 parts In-Stock

1+ parts

$15.060

100+ parts

$14.684

1k+ parts

$14.608

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6,264

$15.060

$14.684

$14.608

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Microchip USA

USA . 2,522 parts In-Stock

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$35.329

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2,522

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Lixinc

USA . 12,596 parts In-Stock

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Futuretech Components

Singapore . 7,879 parts In-Stock

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Perfect Parts

USA . 2,240 parts In-Stock

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2,240

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Continental Prestige Electronics

USA . 2,000 parts In-Stock

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$9.850

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2,000

-

$9.850

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RC Electronics

USA . 1,724 parts In-Stock

1+ parts

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$12.870

1k+ parts

$11.750

10k+ parts

$11.390

1,724

-

$12.870

$11.750

$11.390

Argo Parts USA

USA . 1,318 parts In-Stock

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1,318

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Robosynatics

Brazil . 950 parts In-Stock

1+ parts

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100+ parts

$0.516

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$0.516

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$0.516

950

-

$0.516

$0.516

$0.516

Lucentia Tech

USA . 950 parts In-Stock

1+ parts

-

100+ parts

$0.516

1k+ parts

$0.516

10k+ parts

$0.516

950

-

$0.516

$0.516

$0.516

Overview

Unlock the power of reliable data storage with the CY62167EV30LL-45BVXIT from Infineon Technologies. As a leading manufacturer in the industry, Infineon ensures top-notch quality and performance in their products. This SRAM device offers fast access times and low power consumption, making it ideal for a wide range of applications. Whether you're working on industrial automation, automotive electronics, or consumer electronics, this versatile memory solution provides the speed and efficiency you need. Trust Infineon for cutting-edge technology that delivers exceptional value and benefits to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring reliable performance.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving space and simplifying assembly.

Operating Mode: ASYNCHRONOUS

Allows for independent operation and data retrieval without the need for synchronization signals, enhancing flexibility.

Nominal Supply Voltage: 3V

Optimal voltage level for stable and efficient operation of the memory module.

No. of Terminals: 48

Sufficient terminals for efficient data transfer and connection within the system.

Technology: CMOS

Utilizes low power consumption and offers high-speed performance, making it energy-efficient and reliable.

Maximum Access Time: 45 ns

Provides fast access to data, enabling quick processing and response times.

Technical Specifications

SRAM CY62167EV30LL-45BVXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Alternate Memory Width:

8

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

6 mm

Trade Compliance

CY62167EV30LL-45BVXIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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