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CY7C1011DV33-10BVXI

Infineon Technologies

CY7C1011DV33-10BVXI by Infineon Technologies

Infineon's CY7C1011DV33-10BVXI is a 128Kx16 SRAM with 3.3V supply, 10ns access time, and 85°C max temp. Ideal for industrial applications requiring fast and reliable memory storage in a compact grid array package.

Median Price

$4.332

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 51 parts In-Stock

1+ parts

$2.050

100+ parts

-

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51

$2.050

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-

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Arrow

USA . 935 parts In-Stock

1+ parts

$2.188

100+ parts

$2.085

1k+ parts

$1.966

10k+ parts

-

935

$2.188

$2.085

$1.966

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Adafruit Industries

USA . 150 parts In-Stock

1+ parts

$4.164

100+ parts

$3.831

1k+ parts

$3.590

10k+ parts

-

150

$4.164

$3.831

$3.590

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Mouser Electronics

USA . 865 parts In-Stock

1+ parts

$7.470

100+ parts

$6.430

1k+ parts

$5.910

10k+ parts

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865

$7.470

$6.430

$5.910

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Rochester

USA . 37,662 parts In-Stock

1+ parts

-

100+ parts

$3.990

1k+ parts

$3.570

10k+ parts

$3.360

37,662

-

$3.990

$3.570

$3.360

DigiKey

USA . 37,662 parts In-Stock

1+ parts

-

100+ parts

$4.760

1k+ parts

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37,662

-

$4.760

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Verical

USA . 20,510 parts In-Stock

1+ parts

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100+ parts

$4.987

1k+ parts

$4.463

10k+ parts

$4.200

20,510

-

$4.987

$4.463

$4.200

Flip Electronics (Authorized)

USA . 3,551 parts In-Stock

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3,551

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RS (Exports)

UK . 3 parts In-Stock

1+ parts

-

100+ parts

$4.500

1k+ parts

$4.411

10k+ parts

-

3

-

$4.500

$4.411

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 535 parts In-Stock

1+ parts

$1.948

100+ parts

-

1k+ parts

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535

$1.948

-

-

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DigiKey Marketplace

USA . 37,812 parts In-Stock

1+ parts

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37,812

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Vyrian

USA . 3,575 parts In-Stock

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3,575

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Flip Electronics

USA . 3,551 parts In-Stock

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3,551

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ACDS - Activité Composants Distribution Service

France . 839 parts In-Stock

1+ parts

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839

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

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100+ parts

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500

-

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Inventory MP

USA . 8 parts In-Stock

1+ parts

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8

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Bristol Electronics

USA . 8 parts In-Stock

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8

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,797 parts In-Stock

1+ parts

$1.740

100+ parts

-

1k+ parts

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10k+ parts

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6,797

$1.740

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-

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Corphita

USA . 219 parts In-Stock

1+ parts

$1.845

100+ parts

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219

$1.845

-

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Aztec Data Supply Inc.

USA . 63 parts In-Stock

1+ parts

$3.462

100+ parts

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63

$3.462

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Semicontronic

India . 7,057 parts In-Stock

1+ parts

$3.790

100+ parts

$3.695

1k+ parts

$3.676

10k+ parts

-

7,057

$3.790

$3.695

$3.676

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Modulus Dynamics

Lithuania . 45 parts In-Stock

1+ parts

$3.834

100+ parts

$3.681

1k+ parts

$3.527

10k+ parts

-

45

$3.834

$3.681

$3.527

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Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$4.164

100+ parts

$3.831

1k+ parts

$3.590

10k+ parts

-

150

$4.164

$3.831

$3.590

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Corohmni

South Africa . 144 parts In-Stock

1+ parts

$4.373

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144

$4.373

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QUARKTWIN TECHNOLOGY LTD

USA . 12,671 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,080 parts In-Stock

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Continental Prestige Electronics

USA . 5,429 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,720 parts In-Stock

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4,720

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Argo Parts USA

USA . 4,128 parts In-Stock

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Perfect Parts

USA . 3,469 parts In-Stock

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3,469

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Cyclops Electronics Ltd (Excess)

UK . 839 parts In-Stock

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839

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Kepictronics

USA . 89 parts In-Stock

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89

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Overview

Experience unparalleled performance and reliability with the CY7C1011DV33-10BVXI by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality with their SRAM products. This versatile memory device is perfect for a wide range of applications, offering fast access times and low power consumption. Say goodbye to slow loading times and hello to seamless operation with this innovative product. Upgrade your systems today and discover the incredible value and benefits that the CY7C1011DV33-10BVXI has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material that is ideal for electronic components.

Surface Mount: YES

Easy to install and suitable for compact designs.

Operating Mode: ASYNCHRONOUS

Allows for independent operation of the device without needing synchronization.

Nominal Supply Voltage / Vsup (V): 3.3

Standard voltage supply for many electronic applications.

Output Characteristics: 3-STATE

Ability to have three different output states, adding versatility to the product.

Technology: CMOS

Low power consumption and high noise immunity, making it efficient and reliable.

Memory IC Type: STANDARD SRAM

Reliable and fast memory technology for various applications.

Maximum Access Time: 10 ns

Quick access time ensures fast data retrieval and processing.

Technical Specifications

SRAM CY7C1011DV33-10BVXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

10 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Standby Current:

.01 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

90 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

6 mm

Trade Compliance

CY7C1011DV33-10BVXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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