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CY62167EV30LL-45ZXA

Cypress Semiconductor

CY62167EV30LL-45ZXA by Cypress Semiconductor

STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

Median Price

$17.600

Lifecycle Status

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10

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1k+

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Chip1Stop

Japan . 332 parts In-Stock

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$17.600

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DigiKey

USA . 448 parts In-Stock

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$17.700

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$15.160

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$14.194

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$17.700

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Mouser Electronics

USA . 258 parts In-Stock

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$17.700

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$14.790

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$14.190

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258

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Rochester

USA . 1,066 parts In-Stock

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$9.750

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$8.720

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$8.210

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Verical

USA . 887 parts In-Stock

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$12.188

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$10.900

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$10.262

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Digiode

USA . 947 parts In-Stock

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$11.884

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Nova Conductors

Japan . 57 parts In-Stock

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$14.644

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Chip Stock

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Vyrian

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Flip Electronics

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Modulus Dynamics

Lithuania . 2,182 parts In-Stock

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$3.171

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$3.044

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$2.917

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Aztec Data Supply Inc.

USA . 450 parts In-Stock

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$3.450

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Corohmni

South Africa . 78 parts In-Stock

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$3.928

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Semicontronic

India . 521 parts In-Stock

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$10.630

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$10.364

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$10.311

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$10.630

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Ampacity Inc.

Singapore . 422 parts In-Stock

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Corphita

USA . 49 parts In-Stock

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Continental Prestige Electronics

USA . 5,909 parts In-Stock

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$14.644

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$14.351

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$16.987

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$15.628

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$14.644

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iodParts Technologies Inc.

India . 8,016 parts In-Stock

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Authorized Procurement Solutions

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Alle Elektronik GmbH

Germany . 3,845 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Microchip USA

USA . 2,452 parts In-Stock

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Argo Parts USA

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RC Electronics

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ChipstoGo Electronic ltd

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Kepictronics

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Technical Specifications

SRAM CY62167EV30LL-45ZXA attributes and parameters. Explore more SRAM devices from Cypress Semiconductor

Specs

Maximum Access Time:

45 ns

Alternate Memory Width:

8

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

18.4 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Trade Compliance

CY62167EV30LL-45ZXA Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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