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CY7C1470V25-200BZXC

Infineon Technologies

CY7C1470V25-200BZXC by Infineon Technologies

Infineon's CY7C1470V25-200BZXC is a 2MX36 ZBT SRAM with 200 MHz clock frequency, 3 ns access time, and 75497472-bit memory density. It operates at 2.5V with synchronous mode and common I/O type. Ideal for high-speed applications requiring low profile grid array packaging.

Median Price

$133.722

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 182 parts In-Stock

1+ parts

$162.570

100+ parts

$152.820

1k+ parts

$143.060

10k+ parts

-

182

$162.570

$152.820

$143.060

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Flip Electronics (Authorized)

USA . 3,213 parts In-Stock

1+ parts

-

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3,213

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DigiKey

USA . 1,120 parts In-Stock

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1,120

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Verical

USA . 680 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$104.874

10k+ parts

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680

-

-

$104.874

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 746 parts In-Stock

1+ parts

$163.020

100+ parts

-

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746

$163.020

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-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$216.212

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10

$216.212

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Flip Electronics

USA . 3,033 parts In-Stock

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3,033

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Vyrian

USA . 712 parts In-Stock

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712

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Classic Components Corporation

USA . 10 parts In-Stock

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10

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Electronics Depot

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 5,665 parts In-Stock

1+ parts

$4.049

100+ parts

$3.887

1k+ parts

$3.725

10k+ parts

-

5,665

$4.049

$3.887

$3.725

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Ampacity Inc.

Singapore . 861 parts In-Stock

1+ parts

$145.860

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861

$145.860

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Corphita

USA . 744 parts In-Stock

1+ parts

$154.440

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744

$154.440

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Continental Prestige Electronics

USA . 2,972 parts In-Stock

1+ parts

$216.212

100+ parts

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10k+ parts

$211.888

2,972

$216.212

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$211.888

Component Stockers USA

USA . 6 parts In-Stock

1+ parts

$228.240

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6

$228.240

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Argo Parts USA

USA . 4,292 parts In-Stock

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4,292

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Netroflash

USA . 500 parts In-Stock

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$211.888

1k+ parts

$205.402

10k+ parts

$201.078

500

-

$211.888

$205.402

$201.078

A-Z Elektronik GmbH

Germany . 492 parts In-Stock

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492

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Perfect Parts

USA . 429 parts In-Stock

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429

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Overview

Elevate your electronics with the Infineon Technologies CY7C1470V25-200BZXC, a top-of-the-line ZBT SRAM memory module that offers unparalleled performance and reliability. Infineon Technologies is known for its cutting-edge technology and quality manufacturing, ensuring that this memory module is built to last. Perfect for a wide range of applications, this memory module provides lightning-fast access times and a high memory density, making it ideal for demanding tasks. Upgrade your systems today with the CY7C1470V25-200BZXC and experience the difference in speed, efficiency, and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for easy handling and protection of internal components.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and reducing assembly time.

Operating Mode: SYNCHRONOUS

Ensures precise and synchronized data transfer, ideal for applications requiring coordinated operations.

Nominal Supply Voltage / Vsup (V): 2.5

Stable supply voltage for consistent performance and reliability.

Maximum Operating Temperature: 70 °C

Can withstand high operating temperatures, suitable for various environments and conditions.

Organization: 2MX36

Optimal organization for efficient data storage and retrieval, enhancing overall system performance.

Technology: CMOS

Low power consumption and high noise immunity, making it energy-efficient and reliable.

Maximum Clock Frequency (fCLK): 200 MHz

High clock frequency for fast data processing and improved system speed.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture damage, ensuring long-term durability and performance.

Technical Specifications

SRAM CY7C1470V25-200BZXC attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

3 ns

Additional Features:

PIPELINED ARCHITECTURE

Maximum Clock Frequency (fCLK):

200 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B165

JESD-609 Code:

e1

Length:

17 mm

Memory Density:

75497472 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

165

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2MX36

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA165,11X15,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/2.5,2.5

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Minimum Standby Voltage:

2.38 V

Sub-Category:

SRAMs

Maximum Supply Current:

450 mA

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

15 mm

Trade Compliance

CY7C1470V25-200BZXC Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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