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CY62147EV30LL-45BVXI

Infineon Technologies

CY62147EV30LL-45BVXI by Infineon Technologies

CY62147EV30LL-45BVXI by Infineon Technologies is a 256Kx16 SRAM with 3.6V max supply voltage, 45ns access time, and operates in industrial temperature range. It features a very thin profile grid array package suitable for applications requiring fast and reliable memory storage in harsh environments.

Median Price

$3.020

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 4,832 parts In-Stock

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$3.590

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Mouser Electronics

USA . 1,889 parts In-Stock

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$3.670

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$3.030

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$2.890

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1,889

$3.670

$3.030

$2.890

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DigiKey

USA . 3,902 parts In-Stock

1+ parts

$4.250

100+ parts

$3.668

1k+ parts

$3.383

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$3.333

3,902

$4.250

$3.668

$3.383

$3.333

Rochester

USA . 17,515 parts In-Stock

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-

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$2.450

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$2.190

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$2.060

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$2.450

$2.190

$2.060

Verical

USA . 9,018 parts In-Stock

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$2.207

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$1.976

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$1.976

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Flip Electronics (Authorized)

USA . 5,601 parts In-Stock

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Future Electronics

Canada . 2,420 parts In-Stock

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$2.230

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$2.150

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$2.150

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Distributors (In-Stock)

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Digiode

USA . 482 parts In-Stock

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$1.928

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482

$1.928

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Bristol Electronics

USA . 9 parts In-Stock

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$7.168

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9

$7.168

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Component Electronics Inc.

Canada . 6 parts In-Stock

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$7.690

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$5.770

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$5.000

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6

$7.690

$5.770

$5.000

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IBS Electronics

USA . 7,220 parts In-Stock

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$2.931

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$2.833

10k+ parts

$2.539

7,220

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$2.931

$2.833

$2.539

Vyrian

USA . 3,695 parts In-Stock

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Flip Electronics

USA . 1,933 parts In-Stock

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Chip Stock

USA . 255 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 222 parts In-Stock

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ComSIT Distribution GmbH

Germany . 105 parts In-Stock

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ComSIT USA

USA . 105 parts In-Stock

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Nova Conductors

Japan . 98 parts In-Stock

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Speed Components Ltd

Israel . 63 parts In-Stock

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63

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Prism Electronics

USA . 6 parts In-Stock

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6

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Distributors (Availability)

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Semicontronic

India . 3,925 parts In-Stock

1+ parts

$1.730

100+ parts

$1.687

1k+ parts

$1.678

10k+ parts

-

3,925

$1.730

$1.687

$1.678

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Ampacity Inc.

Singapore . 3,838 parts In-Stock

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$1.730

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$1.730

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Corphita

USA . 290 parts In-Stock

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$1.827

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290

$1.827

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Component Stockers USA

USA . 3,478 parts In-Stock

1+ parts

$2.540

100+ parts

$3.340

1k+ parts

$3.850

10k+ parts

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3,478

$2.540

$3.340

$3.850

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Modulus Dynamics

Lithuania . 2,431 parts In-Stock

1+ parts

$3.151

100+ parts

$3.025

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$2.899

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2,431

$3.151

$3.025

$2.899

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Advanced Electronics

New Zealand . 325 parts In-Stock

1+ parts

$3.683

100+ parts

$3.352

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$3.020

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325

$3.683

$3.352

$3.020

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Corohmni

South Africa . 699 parts In-Stock

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$5.150

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Aztec Data Supply Inc.

USA . 4,994 parts In-Stock

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$5.381

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QUARKTWIN TECHNOLOGY LTD

USA . 12,177 parts In-Stock

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Lixinc

USA . 7,862 parts In-Stock

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Continental Prestige Electronics

USA . 6,949 parts In-Stock

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Perfect Parts

USA . 6,018 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,306 parts In-Stock

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Microchip USA

USA . 3,964 parts In-Stock

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Argo Parts USA

USA . 3,606 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,537 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Bastille Electronics

Australia . 900 parts In-Stock

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900

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Metaverse IC Inc.

Canada . 435 parts In-Stock

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ChipstoGo Electronic ltd

UK . 277 parts In-Stock

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Kepictronics

USA . 177 parts In-Stock

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Overview

Experience unparalleled speed and reliability with the CY62147EV30LL-45BVXI by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies ensures top-notch quality and performance. This SRAM device is perfect for a wide range of applications, providing seamless operation and efficient data processing. With a nominal supply voltage of 3V and an operating mode of asynchronous, this product offers unmatched value and benefits to customers seeking cutting-edge memory solutions. Upgrade your system today with the CY62147EV30LL-45BVXI and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for easy handling and installation.

Surface Mount: YES

Easy to solder onto PCBs for efficient assembly.

Nominal Supply Voltage: 3V

Compatible with standard 3V power supply, widely available in electronic devices.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with higher temperature tolerance.

Maximum Access Time: 45 ns

Fast access time for quick data retrieval in applications requiring high performance.

Technical Specifications

SRAM CY62147EV30LL-45BVXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Standby Current:

.000007 Amp

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

6 mm

Trade Compliance

CY62147EV30LL-45BVXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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