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CY62128EV30LL-45ZXIT

Infineon Technologies

CY62128EV30LL-45ZXIT by Infineon Technologies

Infineon Technologies' CY62128EV30LL-45ZXIT is a 128KX8 SRAM with a package shape of rectangular and surface mount capability. It operates asynchronously at a nominal voltage of 3V and has a max access time of 45 ns. This memory IC is commonly used in industrial applications due to its small outline, thin profile package style and wide temperature range (up to 85°C).

Median Price

$2.260

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 54 parts In-Stock

1+ parts

$1.230

100+ parts

$1.230

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$1.230

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54

$1.230

$1.230

$1.230

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Arrow

USA . 1,248 parts In-Stock

1+ parts

$1.302

100+ parts

$1.252

1k+ parts

$1.146

10k+ parts

-

1,248

$1.302

$1.252

$1.146

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Chip1Stop

Japan . 113 parts In-Stock

1+ parts

$2.120

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113

$2.120

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DigiKey

USA . 3,765 parts In-Stock

1+ parts

$2.400

100+ parts

$2.085

1k+ parts

$1.971

10k+ parts

$1.819

3,765

$2.400

$2.085

$1.971

$1.819

Mouser Electronics

USA . 1,740 parts In-Stock

1+ parts

$2.400

100+ parts

$2.070

1k+ parts

$1.830

10k+ parts

$1.650

1,740

$2.400

$2.070

$1.830

$1.650

Element14

Singapore . 148 parts In-Stock

1+ parts

$4.262

100+ parts

$3.374

1k+ parts

$2.769

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148

$4.262

$3.374

$2.769

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Farnell

UK . 148 parts In-Stock

1+ parts

$4.655

100+ parts

$3.303

1k+ parts

$3.160

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148

$4.655

$3.303

$3.160

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Flip Electronics (Authorized)

USA . 45,020 parts In-Stock

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45,020

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Verical

USA . 1,248 parts In-Stock

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-

100+ parts

$1.252

1k+ parts

$1.146

10k+ parts

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1,248

-

$1.252

$1.146

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$3.190

100+ parts

-

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100

$3.190

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-

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Digiode

USA . 957 parts In-Stock

1+ parts

$3.246

100+ parts

-

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957

$3.246

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Flip Electronics

USA . 178,520 parts In-Stock

1+ parts

-

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178,520

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Vyrian

USA . 5,609 parts In-Stock

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5,609

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Chip Stock

USA . 3,510 parts In-Stock

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3,510

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Sensible Micro Corp

USA . 1,920 parts In-Stock

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1,920

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Cyclops Electronics Ltd

UK . 1,065 parts In-Stock

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1,065

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Standard Data Resources

USA . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,944 parts In-Stock

1+ parts

$2.280

100+ parts

-

1k+ parts

-

10k+ parts

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5,944

$2.280

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-

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Semicontronic

India . 5,549 parts In-Stock

1+ parts

$2.280

100+ parts

$2.223

1k+ parts

$2.212

10k+ parts

-

5,549

$2.280

$2.223

$2.212

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Corphita

USA . 508 parts In-Stock

1+ parts

$3.075

100+ parts

-

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508

$3.075

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Argo Parts USA

USA . 2,970 parts In-Stock

1+ parts

$3.190

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2,970

$3.190

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Modulus Dynamics

Lithuania . 6,363 parts In-Stock

1+ parts

$3.412

100+ parts

$3.276

1k+ parts

$3.139

10k+ parts

-

6,363

$3.412

$3.276

$3.139

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Component Stockers USA

USA . 5,563 parts In-Stock

1+ parts

$3.800

100+ parts

$2.990

1k+ parts

$2.560

10k+ parts

-

5,563

$3.800

$2.990

$2.560

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Continental Prestige Electronics

USA . 148 parts In-Stock

1+ parts

$4.030

100+ parts

$2.860

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148

$4.030

$2.860

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Aztec Data Supply Inc.

USA . 3,718 parts In-Stock

1+ parts

$4.729

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3,718

$4.729

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Corohmni

South Africa . 207 parts In-Stock

1+ parts

$4.786

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207

$4.786

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A-Z Elektronik GmbH

Germany . 6,153 parts In-Stock

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6,153

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Lixinc

USA . 5,969 parts In-Stock

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5,969

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Alle Elektronik GmbH

Germany . 4,102 parts In-Stock

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4,102

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

$3.126

1k+ parts

$3.031

10k+ parts

$2.967

2,000

-

$3.126

$3.031

$2.967

Perfect Parts

USA . 923 parts In-Stock

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923

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Overview

Discover the power of the CY62128EV30LL-45ZXIT by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies is known for its exceptional quality and innovation. The CY62128EV30LL-45ZXIT is a remarkable SRAM that offers countless advantages and benefits. With its compact design and versatile functionality, this product is perfect for a wide range of applications. Whether you're looking to enhance your electronic devices or optimize your system's performance, the CY62128EV30LL-45ZXIT delivers outstanding value and reliability. Experience the difference today and unlock a world of possibilities with Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the SRAM, ensuring reliable performance.

Surface Mount: YES

Allows for easy installation and space-saving on circuit boards.

Nominal Supply Voltage / Vsup (V): 3

Offers a standard voltage level for efficient and stable operation.

Operating Mode: ASYNCHRONOUS

Enables independent operation without the need for synchronization signals, enhancing flexibility in usage.

Output Characteristics: 3-STATE

Allows the output pins to be in three states (high, low, and high-impedance), providing versatility in interfacing with other components.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments where temperature variations can occur, ensuring reliable performance under harsh conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it energy-efficient and reliable.

Memory IC Type: STANDARD SRAM

Being a standard SRAM, it offers fast access times and non-volatile storage, ideal for applications requiring quick data retrieval and retention.

Technical Specifications

SRAM CY62128EV30LL-45ZXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

18.4 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.000003 Amp

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

16 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

8 mm

Trade Compliance

CY62128EV30LL-45ZXIT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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