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CY62158EV30LL-45BVXI

Infineon Technologies

CY62158EV30LL-45BVXI by Infineon Technologies

Infineon's CY62158EV30LL-45BVXI is a 1MX8 SRAM with 3.6V max supply, 45ns access time, and 85°C operating temp. Ideal for industrial applications requiring fast, low-power memory solutions in a compact grid array package.

Median Price

$4.276

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 305 parts In-Stock

1+ parts

$3.991

100+ parts

$3.630

1k+ parts

$3.558

10k+ parts

$3.389

305

$3.991

$3.630

$3.558

$3.389

Chip1Stop

Japan . 2,400 parts In-Stock

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$4.560

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$4.560

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Mouser Electronics

USA . 1,289 parts In-Stock

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$5.200

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$4.170

1k+ parts

$3.810

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1,289

$5.200

$4.170

$3.810

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DigiKey

USA . 265 parts In-Stock

1+ parts

$6.020

100+ parts

$5.187

1k+ parts

$4.780

10k+ parts

$4.709

265

$6.020

$5.187

$4.780

$4.709

Flip Electronics (Authorized)

USA . 9,694 parts In-Stock

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Verical

USA . 305 parts In-Stock

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$3.630

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$3.558

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$3.389

305

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$3.630

$3.558

$3.389

Rochester

USA . 40 parts In-Stock

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$3.520

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$3.150

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$2.960

40

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$3.150

$2.960

Distributors (In-Stock)

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Digiode

USA . 25 parts In-Stock

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$3.247

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$3.247

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Greenchips

USA . 960 parts In-Stock

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$3.407

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$3.244

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$3.090

10k+ parts

$2.789

960

$3.407

$3.244

$3.090

$2.789

Nova Conductors

Japan . 53 parts In-Stock

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$20.540

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Flip Electronics

USA . 7,582 parts In-Stock

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Cogito LLC

Ukraine . 4,800 parts In-Stock

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Vyrian

USA . 3,157 parts In-Stock

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SIE Connect GmbH - GreenChips

Germany . 1,063 parts In-Stock

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Sensible Micro Corp

USA . 960 parts In-Stock

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960

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Rebound Electronics

UK . 358 parts In-Stock

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ComSIT Distribution GmbH

Germany . 207 parts In-Stock

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ComSIT USA

USA . 207 parts In-Stock

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Goldney Electronics S.L.

Spain . 159 parts In-Stock

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Prism Electronics

USA . 15 parts In-Stock

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Semi Source

USA . 10 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 10 parts In-Stock

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Bristol Electronics

USA . 7 parts In-Stock

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Atlantic Semiconductor

USA . 7 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 236 parts In-Stock

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$2.275

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$2.275

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Semicontronic

India . 3,313 parts In-Stock

1+ parts

$2.910

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$2.837

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$2.823

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3,313

$2.910

$2.837

$2.823

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Ampacity Inc.

Singapore . 3,167 parts In-Stock

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$2.910

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Corphita

USA . 831 parts In-Stock

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$3.076

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Aztec Data Supply Inc.

USA . 4,350 parts In-Stock

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$5.402

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$5.402

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Modulus Dynamics

Lithuania . 3,840 parts In-Stock

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$5.562

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$5.340

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$5.117

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$5.562

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Continental Prestige Electronics

USA . 635 parts In-Stock

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$5.850

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$5.733

635

$5.850

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$5.733

Netroflash

USA . 100 parts In-Stock

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$20.540

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Microchip USA

USA . 2,251 parts In-Stock

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$23.940

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Lixinc

USA . 11,860 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,519 parts In-Stock

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Perfect Parts

USA . 6,360 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,346 parts In-Stock

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Kepictronics

USA . 3,919 parts In-Stock

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Argo Parts USA

USA . 2,667 parts In-Stock

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Futuretech Components

Singapore . 2,400 parts In-Stock

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Advanced Electronics

New Zealand . 57 parts In-Stock

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Overview

Unlock the power of reliable memory with the CY62158EV30LL-45BVXI from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality SRAM products like this one for industrial applications. With a wide operating temperature range and low power consumption, this versatile memory module offers exceptional value to customers seeking high performance and durability. Trust Infineon to provide cutting-edge technology that meets your memory needs effortlessly. Elevate your projects with the CY62158EV30LL-45BVXI today.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

Durable and lightweight material for safe packaging and protection of the SRAM.

Nominal Supply Voltage / Vsup (V) - 3

Optimal supply voltage for efficient performance and reliability of the SRAM.

Memory Density - 8388608 bit

High memory density allows for storing a large amount of data in a compact space, ideal for high-performance applications.

Maximum Operating Temperature - 85 °C

Wide temperature range tolerance ensures stable operation even in demanding environmental conditions.

Output Enable - YES

Ability to control output enables flexibility in data access and management.

Technology - CMOS

CMOS technology offers low power consumption, high speed, and noise immunity for efficient data processing.

Technical Specifications

SRAM CY62158EV30LL-45BVXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

48

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX8

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Standby Current:

.000008 Amp

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

6 mm

Trade Compliance

CY62158EV30LL-45BVXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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