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CY14E256LA-SZ25XIT

Infineon Technologies

CY14E256LA-SZ25XIT by Infineon Technologies

Infineon's CY14E256LA-SZ25XIT is a 32Kx8 SRAM with 3-STATE output, operating at 5V. It features an industrial temperature grade, parallel interface, and non-volatile memory technology. Ideal for applications requiring fast access times of up to 25ns in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 8,000 parts In-Stock

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Chip Stock

USA . 6,210 parts In-Stock

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6,210

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Vyrian

USA . 1,385 parts In-Stock

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1,385

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Digiode

USA . 621 parts In-Stock

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621

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Distributors (Availability)

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Semicontronic

India . 915 parts In-Stock

1+ parts

$1.000

100+ parts

$0.975

1k+ parts

$0.970

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915

$1.000

$0.975

$0.970

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Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$3.981

100+ parts

$3.623

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$3.264

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10

$3.981

$3.623

$3.264

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Aztec Data Supply Inc.

USA . 340 parts In-Stock

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$5.502

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340

$5.502

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AZTECH Wire

Italy . 226 parts In-Stock

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$9.559

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226

$9.559

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Modulus Dynamics

Lithuania . 5,892 parts In-Stock

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$18.430

100+ parts

$17.693

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$16.956

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$18.430

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Corohmni

South Africa . 282 parts In-Stock

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$18.430

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Ampacity Inc.

Singapore . 833 parts In-Stock

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$21.000

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Component Stockers USA

USA . 619 parts In-Stock

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$99.990

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Lixinc

USA . 12,009 parts In-Stock

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Futuretech Components

Singapore . 5,828 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 1,370 parts In-Stock

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RC Electronics

USA . 1,283 parts In-Stock

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$18.430

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$16.820

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$16.320

1,283

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$18.430

$16.820

$16.320

Continental Prestige Electronics

USA . 948 parts In-Stock

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948

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Corphita

USA . 193 parts In-Stock

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iodParts Technologies Inc.

India . 50 parts In-Stock

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Overview

Unlock the power of reliable and high-quality memory with the CY14E256LA-SZ25XIT by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers cutting-edge SRAM technology that offers unparalleled performance and versatility. Ideal for industrial applications, this non-volatile SRAM provides fast access times and low standby currents, ensuring optimal functionality in any environment. Trust Infineon Technologies to provide top-of-the-line memory solutions that elevate your systems to new heights of efficiency and reliability.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material offers a good balance of durability and cost-effectiveness, making it a practical choice for a variety of applications.

Surface Mount

YES - The surface mount design allows for easy and secure installation, making it suitable for compact electronic devices.

Package Shape

RECTANGULAR - The rectangular shape provides efficient use of space and allows for easy integration into circuit boards.

Operating Mode

ASYNCHRONOUS - The asynchronous operation ensures fast and efficient performance without the need for synchronized timing signals.

Input/Output Type

COMMON - The common input/output type simplifies connectivity and compatibility with other components in a system.

Nominal Supply Voltage / Vsup (V)

5 - The 5V supply voltage is a standard and commonly used power source, making this product versatile and widely compatible.

Power Supplies (V)

5 - With a 5V power supply, this product is easy to power and can be seamlessly integrated into existing systems.

No. of Terminals

32 - The 32 terminals provide ample connectivity options and flexibility in circuit design.

Package Style (Meter)

SMALL OUTLINE - The small outline package style helps save space and is ideal for applications where size is a critical factor.

Maximum Operating Temperature

85 °C - With a high maximum operating temperature, this product can withstand harsh environmental conditions and extended use.

Organization

32KX8 - The 32KX8 organization allows for efficient storage and retrieval of data, making it suitable for memory-intensive applications.

Output Characteristics

3-STATE - The 3-state output characteristics offer versatility in signal routing and can help reduce interference in complex circuit designs.

Minimum Standby Voltage

4.5 V - The 4.5V minimum standby voltage ensures low power consumption in standby mode, prolonging battery life in portable devices.

Technical Specifications

SRAM CY14E256LA-SZ25XIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

25 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

20.726 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

32

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP32,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.54 mm

Maximum Standby Current:

.008 Amp

Minimum Standby Voltage:

4.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

70 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

7.505 mm

Trade Compliance

CY14E256LA-SZ25XIT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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