Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Infineon's CY14V104NA-BA45XIT is a 256Kx16 SRAM with 3.3V nominal voltage, operating in industrial temperature range. It features asynchronous mode, 45ns access time, and 1.8/3.3V power supplies. Ideal for applications requiring fast and reliable non-volatile memory storage in compact electronic devices.
Median Price
$34.517
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$5.150
AZTECH Wire
$8.183
Ampacity Inc.
$18.000
Semicontronic
$27.000
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Continental Prestige Electronics
Alle Elektronik GmbH
Argo Parts USA
A-Z Elektronik GmbH
Bastille Electronics
Corphita
Provides a lightweight and durable packaging for the SRAM, ensuring easy handling and protection from external elements.
Facilitates easy and efficient installation on circuit boards, saving time and effort in assembly processes.
Operates efficiently at a standard voltage level, making it compatible with various electronic systems.
Offers a sufficient number of connection points for interfacing with other components, enhancing versatility in circuit design.
Ensures reliable performance even in high-temperature environments, contributing to the overall durability of the product.
Combines the benefits of fast access times with non-volatile storage, providing a reliable and high-performance memory solution for various applications.
SRAM CY14V104NA-BA45XIT attributes and parameters. Explore more SRAM devices from Infineon Technologies
Maximum Access Time:
Input/Output Type:
JESD-30 Code:
JESD-609 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Ports:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Output Enable:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Maximum Standby Current:
Minimum Standby Voltage:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
CY14V104NA-BA45XIT Memory ICs trade compliance attributes, and parameters.
ECCN
3A991.B.2.A
ECCN Governance
EAR
HTS
8542.32.00.41
SB
8542.32.00.40
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
MMBT2907ALT1G
Rochester Electronics
PNP; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 200 MHz; Maximum Collector Current (IC): .6 A; Terminal Form: GULL WING;
2N2222A
Loras Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
STMicroelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .2 A; Transistor Application: SWITCHING;
LM358M
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
KSZ9031RNXIC
Microchip Technology
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
Dionics-usa
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
MBRS140T3G
Onsemi
MBRS140T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.6V and max output current of 1A. It operates b/w -65°C to 125°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package style. The diode's matte tin terminal finish and dual position terminals enhance its performance in surface mount configurations.
SMBJ18CA
First Components International
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Polarity: BIDIRECTIONAL; Maximum Repetitive Peak Reverse Voltage: 18 V;
BSS138
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
M39029/56-351
Defense Logistics Agency
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Mating Contacts: M39029/58-363; Removal Tool Sources: MILITARY; Alternate Contact Sources: MILITARY;
LL4148
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
GRM155R71H103KA88D
Murata Manufacturing
The Murata Manufacturing GRM155R71H103KA88D is a ceramic capacitor with 0.01uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and high reliability.
TE Connectivity
TE Connectivity's M39029/56-351 is a CRIMP contact type backshell accessory with rated voltage of 115V. It operates b/w -65 to 175 °C, suitable for MIL-C-39029/56 connectors with wire gauge ranging from 28 to 22 AWG. Ideal for military applications requiring female contacts and copper alloy material.
BAV99
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
NE555D
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Tt Electronics Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
MMBT2222ALT1G
MMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, max power dissipation of 0.3W, and hFE of 75. Ideal for switching applications, it operates b/w -55 to 150 °C with a max collector-emitter voltage of 40V. This surface-mount device has a transition frequency of 300MHz and turn-on time of 35ns.
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
SS14
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
71V416S10PHG8
Integrated Device Technology
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Surface Mount: YES;
5962-8855206YA
Teledyne E2v (uk)
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Qualification: Qualified;
CY62147EV30LL-45B2XA
Cypress Semiconductor
CY62147EV30LL-45B2XA by Cypress Semiconductor is a 256Kx16 SRAM with 3.6V max supply voltage, 45ns access time, and industrial temperature grade. It features a very thin profile grid array package for common asynchronous applications in parallel memory systems.
CY14V101NA-BA45XIT
Infineon Technologies
Infineon's CY14V101NA-BA45XIT is a 64Kx16 SRAM with 3.3V nominal voltage, operating in industrial temperature range. It features parallel technology, 45ns access time, and non-volatile memory type. Ideal for applications requiring fast and reliable data storage in harsh environments.
5962-8855203YA
Qp Semiconductor
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Organization: 32KX8;
71321LA20PFG8
Renesas Electronics
Renesas Electronics' 71321LA20PFG8 is a 2Kx8 MULTI-PORT SRAM with 20ns access time, operating at 5V. It features a low profile flatpack package and supports asynchronous operation. Ideal for applications requiring fast and reliable memory storage in commercial-grade environments.
CY62167GN30-45ZXI
Infineon's CY62167GN30-45ZXI is a 1MX16 SRAM with 16-bit memory width and 16777216 bit density. Operating at 3V, it offers fast access time of 45ns for industrial applications. With parallel interface and small outline package, it suits high-speed data processing needs.
IDT7007L20JGI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE; Terminal Form: J BEND;
CY7C1079DV33-12BAXIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Access Time: 12 ns;
71321SA35TFG8
Renesas Electronics' 71321SA35TFG8 is a 2Kx8 MULTI-PORT SRAM with 35ns access time, operating at 5V. It features a low profile flatpack package and supports asynchronous operation. Ideal for applications requiring fast and reliable memory access in commercial-grade environments.
IDT7130LA20JG8
The Renesas Electronics IDT7130LA20JG8 is a 1Kx8 CMOS SRAM chip with 3-STATE output. Operating at 5V, it offers a max access time of 20ns and memory density of 8192 bits. Ideal for applications requiring fast and reliable data storage in commercial temperature environments.
CAT24C44VI-G
Catalyst Semiconductor
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm;
AS7C34098A-12TIN
Alliance Memory
Alliance Memory's AS7C34098A-12TIN is a 256Kx16 SRAM with 3.3V supply, operating at -40 to 85°C. Featuring 12ns access time, it suits industrial applications needing fast and reliable memory solutions in a compact package style.
DS1220Y-200-IND
Dallas Semiconductor
DS1220Y-200-IND by Dallas Semiconductor is a 2Kx8 non-volatile SRAM module with 16384-bit memory density. It operates at 5V, has a max access time of 200ns, and is designed for industrial temperature grades. The package style is in-line with through-hole terminals, making it suitable for applications requiring reliable data storage in harsh environments.
CY62167EV18LL-55BVXIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 2.25 V;
CY14B116L-ZS25XI
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Seated Height: 1.194 mm;
CY7C1049G30-10VXIT
CY7C1049G30-10VXIT by Infineon is a 512Kx8 SRAM with 10ns access time, operating at 3V. It features a small outline package and is ideal for industrial applications requiring fast and reliable parallel memory storage. With a memory density of 4Mbit, it offers high performance in a compact form factor.
DS1225Y-200IND+
Maxim Integrated
DS1225Y-200IND+ by Maxim Integrated is an 8Kx8 SRAM module with 65536-bit memory density. It operates at 5V, has a max access time of 200ns, and is designed for industrial applications requiring non-volatile memory solutions.
71V124SA15PHGI
Renesas Electronics' 71V124SA15PHGI is a 128Kx8 SRAM with asynchronous operation and common I/O type. It operates at 3.3V, has a max access time of 15ns, and is suitable for industrial applications requiring fast memory access.
N01S818HAT22I
N01S818HAT22I by Onsemi is a 128KX8 SRAM with synchronous operation. It features a small outline, thin profile package and operates in industrial temperature range (-40 to 85 °C). Ideal for applications requiring high-speed memory access in compact electronic devices.
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CY14B116L-ZS25XIT
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Technology: CMOS;
Infineon's CY14B116L-ZS25XIT is a 2MX8 SRAM with 16777216-bit memory density, operating at 3V. It features an access time of 25ns and is ideal for industrial applications requiring non-volatile memory storage in a small outline package.
CY14B256LA-SZ45XIT
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Access Time: 45 ns;
Infineon's CY14B256LA-SZ45XIT is a 32Kx8 non-volatile SRAM with 262144-bit memory density. Operating at 3V, it offers fast access time of 45ns and low standby current of 0.005A. Ideal for industrial applications requiring reliable data storage in a compact package.
CY14E256LA-SZ25XI
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Output Enable: YES;
Infineon's CY14E256LA-SZ25XI is a 32Kx8 SRAM with 3-STATE output, operating at 5V. It features a small outline package and industrial temperature grade, suitable for applications requiring fast access times like industrial automation and automotive systems.
CY14B256LA-SZ45XI
Infineon's CY14B256LA-SZ45XI is a 32Kx8 SRAM with 262144-bit memory density. Operating at 3V, it offers fast access time of 45ns in industrial temperatures. Ideal for applications requiring non-volatile parallel memory with low standby current and high reliability.
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Memory Width: 8;
CY14B104NA-BA25XI
Infineon's CY14B104NA-BA25XI is a 256Kx16 SRAM with 3V nominal voltage, operating in industrial temperature range. It features asynchronous mode, 25ns access time, and non-volatile memory IC type. Ideal for applications requiring fast parallel memory access in compact electronic devices.
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Current: 70 mA;
CY14B104NA-BA25XIT
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Density: 4194304 bit;
Infineon's CY14B104NA-BA25XIT is a 256Kx16 SRAM with 3V nominal voltage. Operating asynchronously, it offers fast access time of 25ns and low standby current of 0.005Amp. Ideal for industrial applications requiring high-speed memory with non-volatile storage capabilities.
CY14E256LA-SZ25XIT
Infineon's CY14E256LA-SZ25XIT is a 32Kx8 SRAM with 3-STATE output, operating at 5V. It features an industrial temperature grade, parallel interface, and non-volatile memory technology. Ideal for applications requiring fast access times of up to 25ns in harsh environments.
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V;
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3;
CY14E256LA-SZ45XIT
Infineon's CY14E256LA-SZ45XIT is a 32Kx8 SRAM with 3-STATE output, operating at 5V. It features a small outline package, GULL WING terminals, and industrial temperature grade. Ideal for applications requiring fast access times and non-volatile memory solutions.
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
CY14B108M-ZSP45XIT
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: TSOP2; Package Shape: RECTANGULAR; Package Equivalence Code: TSOP54,.46,32;
Infineon's CY14B108M-ZSP45XIT is a 512Kx16 SRAM with 3V nominal voltage. Operating asynchronously, it offers fast access time of 45ns and low standby current of 0.01Amp. Ideal for industrial applications requiring high-speed memory with non-volatile storage capabilities.
Supply Digital Components
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