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23LC1024-I/SNVAO

Microchip Technology

23LC1024-I/SNVAO by Microchip Technology

Microchip Technology's 23LC1024-I/SNVAO is a 128KX8 SRAM with synchronous operation and 3-STATE output. It operates at up to 20 MHz clock frequency, suitable for industrial applications requiring high-speed memory access. With a small outline package style and low standby current of 0.00001 Amp, it is ideal for space-constrained designs in automotive electronics.

Median Price

$3.660

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 500 parts In-Stock

1+ parts

$3.660

100+ parts

$3.380

1k+ parts

$3.200

10k+ parts

$3.010

500

$3.660

$3.380

$3.200

$3.010

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$3.050

100+ parts

-

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10

$3.050

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Vyrian

USA . 3,900 parts In-Stock

1+ parts

-

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3,900

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VNN

France . 3,041 parts In-Stock

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3,041

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,928 parts In-Stock

1+ parts

$3.050

100+ parts

-

1k+ parts

-

10k+ parts

$2.989

4,928

$3.050

-

-

$2.989

Argo Parts USA

USA . 3,470 parts In-Stock

1+ parts

$3.050

100+ parts

-

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3,470

$3.050

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Ampacity Inc.

Singapore . 253 parts In-Stock

1+ parts

$3.110

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253

$3.110

-

-

-

Semicontronic

India . 129 parts In-Stock

1+ parts

$3.110

100+ parts

$3.032

1k+ parts

$3.017

10k+ parts

-

129

$3.110

$3.032

$3.017

-

Aztec Data Supply Inc.

USA . 702 parts In-Stock

1+ parts

$3.820

100+ parts

-

1k+ parts

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702

$3.820

-

-

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$4.029

100+ parts

$3.828

1k+ parts

$3.828

10k+ parts

-

500

$4.029

$3.828

$3.828

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Corohmni

South Africa . 174 parts In-Stock

1+ parts

$4.409

100+ parts

-

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174

$4.409

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AZTECH Wire

Italy . 530 parts In-Stock

1+ parts

$10.635

100+ parts

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530

$10.635

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LMD Electronica

Estonia . 8,031 parts In-Stock

1+ parts

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8,031

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Ledger Components

France . 6,795 parts In-Stock

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6,795

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LOOK Integrated Logistics

Peru . 4,707 parts In-Stock

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4,707

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Montano Global Distributors

Canada . 4,579 parts In-Stock

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4,579

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Microchip USA

USA . 3,858 parts In-Stock

1+ parts

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3,858

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NIA Electronics

USA . 1,563 parts In-Stock

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1,563

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Bastille Electronics

Australia . 71 parts In-Stock

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71

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Overview

Enhance your electronic projects with the 23LC1024-I/SNVAO from Microchip Technology. As a leading manufacturer in the industry, Microchip ensures top-notch quality and reliability in their products. This SRAM device offers fast and synchronous operation, making it ideal for various applications. With a wide supply voltage range and low standby current, this memory IC provides exceptional value and performance. Upgrade your designs with the 23LC1024-I/SNVAO and experience the benefits of high-quality components from a trusted brand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and convenient integration onto circuit boards, saving space and reducing assembly time.

Operating Mode: SYNCHRONOUS

Enables precise timing and coordination of data transfers, ensuring efficient operation of the product.

Maximum Clock Frequency (fCLK): 20 MHz

High clock frequency allows for fast data processing and improved overall performance.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, resulting in energy-efficient and reliable operation.

Memory IC Type: STANDARD SRAM

Standard SRAM technology offers fast and reliable memory access, making it suitable for a wide range of applications.

Technical Specifications

SRAM 23LC1024-I/SNVAO attributes and parameters. Explore more SRAM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

20 MHz

Input/Output Type:

COMMON/SEPARATE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Output Characteristics:

3-STATE

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.75 mm

Maximum Standby Current:

.00001 Amp

Minimum Standby Voltage:

2.5 V

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

23LC1024-I/SNVAO Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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