Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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23LC1024-E/SN by Microchip is a 128KX8 SRAM with 131072 words, operating at 16 MHz. It has a supply voltage range of 2.5V to 5.5V and operates in automotive temperatures (-40 to 125 °C). Ideal for applications requiring fast synchronous memory access in compact designs.
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QUARKTWIN TECHNOLOGY LTD
Authorized Procurement Solutions
Continental Prestige Electronics
RGB Technical Solutions
Argo Parts USA
Lixinc
Eastek
Aranea Global
PLASTIC/EPOXY - This lightweight and durable material makes the product ideal for various applications.
YES - Allows for easy and efficient installation on circuit boards.
TS 16949 - Ensures high quality and reliability of the product.
RECTANGULAR - Provides a compact design for space-saving installation.
SYNCHRONOUS - Offers synchronized operation for improved performance.
COMMON/SEPARATE - Provides flexibility in the connection setup.
5 - Works well within standard voltage ranges for compatibility.
3/5 - Offers compatibility with different power supply options.
8 - Provides sufficient connectivity for various configurations.
SMALL OUTLINE - Ideal for applications with limited space availability.
125 °C - Ensures reliability in high-temperature environments.
128KX8 - Provides a good balance of memory capacity and data width.
3-STATE - Offers multiple output options for versatile applications.
2.5 V - Ensures low power consumption in standby mode.
40 °C - Suitable for use in extreme temperature conditions.
MATTE TIN - Provides a durable finish for long-term use.
DUAL - Allows for easy installation and connection options.
1.75 mm - Ideal for applications with height restrictions.
16 MHz - Provides high-speed operation for efficient performance.
3.9 mm - Compact design for space-saving installations.
2.5 V - Ensures compatibility with lower voltage systems.
40 - Can withstand peak reflow temperatures for soldering.
260 - Withstands high-temperature reflow processes.
4.9 mm - Compact size for space-efficient installations.
AUTOMOTIVE - Suitable for automotive applications with temperature variations.
CMOS - Offers low power consumption and high noise immunity.
SERIAL - Suitable for applications requiring serial data transmission.
GULL WING - Provides secure terminal connections for reliability.
10 mA - Allows for efficient power usage.
131072 words - Offers ample memory capacity for storing data.
8 - Ideal for applications requiring data width of 8 bits.
1.27 mm - Provides standard spacing for easy connections.
128K - Indicates the memory capacity in words.
5.5 V - Ensures compatibility with higher voltage systems.
1048576 bit - Provides a high-density memory solution.
STANDARD SRAM - Offers standard SRAM memory capabilities.
0.00002 Amp - Ensures low power consumption in standby mode.
SRAM 23LC1024-E/SN attributes and parameters. Explore more SRAM devices from Microchip Technology
Maximum Clock Frequency (fCLK):
Input/Output Type:
JESD-30 Code:
JESD-609 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Ports:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Output Enable:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Screening Level:
Maximum Seated Height:
Maximum Standby Current:
Minimum Standby Voltage:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
23LC1024-E/SN Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
PCN Design/Specification - 23A1024/23LC1024 20/Jul/2022 Die/Moulding Material Chg 21/Jun/2016
PCN Packaging - Label and Packing Changes 23/Sep/2015 Packing Changes 10/Oct/2016
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
BAV99
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32H743IIT6
STMicroelectronics
STM32H743IIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications due to its wide temperature range (-40°C to 85°C) and various connectivity options (CAN, I2C, UART, USB).
FDLL4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Weitron Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58-360
Tri-star Electronics International
CONNECTOR ACCESSORY; Material: COPPER ALLOY; MIL Conformity: YES; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; MIL-Connector Accessory Name: CONTACT; Terminal Type: CRIMP;
Secos
1N4148
NXP Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
2N2222A
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
AT90CAN128-16AU
AT90CAN128-16AU by Microchip Technology is a microcontroller with 8-bit data RAM and 16-bit address bus width. It operates at a max clock frequency of 16 MHz, making it suitable for industrial applications requiring low power mode and connectivity options like CAN, SPI, and USART. With 53 I/O lines and 8-channel 10-bit ADCs, this microcontroller offers versatile peripheral support for various embedded systems.
Thinking Electronic Industrial
LL4148
SPC TECHNOLOGY/ MULTICOMP
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
RK73H2ATTD10R0F
Koa Speer Electronics
RK73H2ATTD10R0F by Koa Speer Electronics is a 0805 SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.25 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V.
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
USB3320C-EZK-TR
Microchip Technology's USB3320C-EZK-TR is a Bus Controller IC with 32 terminals, operating at 1.6-2V. It supports USB bus compatibility, clock frequency up to 60MHz, and CMOS technology. Ideal for applications requiring Universal Serial Bus peripherals in compact designs with low power consumption.
International Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMMBT2222ALT1G
Onsemi
SMMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, 0.6A IC, and 40V VCE. It has a hFE of 75, fT of 300MHz, and operates up to 150°C. Ideal for small signal applications in automotive electronics due to AEC-Q101 compliance.
General Semiconductor
DS1225Y-200-IND
Dallas Semiconductor
DS1225Y-200-IND by Dallas Semiconductor is an 8Kx8 SRAM with 65536-bit memory density. It operates at 5V, has a max access time of 200ns, and is designed for industrial applications. The package style is in-line with through-hole terminals and a temperature range of -40 to 85°C.
71V124SA15PHGI
Integrated Device Technology
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: TSOP2; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
CY7C1059DV33-10ZSXI
Cypress Semiconductor
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Width: 10.16 mm;
CY14V104NA-BA45XI
Infineon's CY14V104NA-BA45XI is a 256Kx16 SRAM with 3.3V nominal voltage, operating at -40 to 85°C. It features asynchronous mode, common I/O type, and 45ns access time. Ideal for industrial applications requiring non-volatile memory with parallel interface and output enable functionality.
71321LA25PFGI
Renesas Electronics
Renesas Electronics' 71321LA25PFGI is a 2Kx8 MULTI-PORT SRAM with 25ns access time, operating at 5V. Suitable for industrial applications, it features a low profile flatpack package and operates in asynchronous mode with common I/O type.
5962-8855206YA
Teledyne E2v (uk)
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Qualification: Qualified;
IDT7130LA25JGI8
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: QCCJ; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 5;
CY62128ELL-45ZAXIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;
CY62168DV30LL-55BVI
CY62168DV30LL-55BVI by Cypress is a 2MX8 SRAM with 3V supply, 55ns access time, and 16777216-bit memory density. Ideal for industrial applications requiring fast, common I/O asynchronous operation in a compact grid array package.
CY62148ELL-45ZSXIT
Infineon's CY62148ELL-45ZSXIT is a 512Kx8 SRAM with 45ns access time, operating at 5V. It features a small outline package, industrial temperature grade, and common I/O type. Ideal for applications requiring fast and reliable memory storage in industrial environments.
DS1220Y-200IND
Maxim Integrated
DS1220Y-200IND by Maxim Integrated is a 2Kx8 SRAM module with 16384-bit memory density. It operates at 5V, has an access time of 200ns, and is designed for industrial applications. The package style is microelectronic assembly with dual terminal position and tin lead finish.
5962-8685924YA
Matra Mhs
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 22; Package Shape: RECTANGULAR; Memory Density: 65536 bit; Operating Mode: ASYNCHRONOUS;
DS1230Y-100
NON-VOLATILE SRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
CY7C1051DV33-10ZSXIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;
IS62WV102416DBLL-45TLI-TR
Integrated Silicon Solution
IS62WV102416DBLL-45TLI-TR by Integrated Silicon Solution is a 1MX16 SRAM with 1048576 words and 16-bit memory width. Operating at an industrial temperature grade of -40 to 85 °C, it offers a max access time of 45 ns. Ideal for applications requiring fast and reliable data storage in harsh environments.
CY14B108M-ZSP45XIT
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: TSOP2; Package Shape: RECTANGULAR; Package Equivalence Code: TSOP54,.46,32;
IDT71V416S10PHGI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; No. of Functions: 1;
CY62158EV30LL-45BVXIT
Infineon's CY62158EV30LL-45BVXIT is a 1MX8 SRAM with 3.6V max supply voltage, 45ns access time, and 85°C operating temp. Ideal for industrial applications requiring high-speed memory in a compact GRID ARRAY package with very thin profile and fine pitch terminals.
5962-8855203YA
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 32; Package Code: QCCN; Package Shape: RECTANGULAR; Technology: CMOS;
M5M51008DVP-70H
Mitsubishi Electric
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: TSOP1; Package Shape: RECTANGULAR; Qualification: Not Qualified;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
23LC1024-I/SN
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
23LC1024T-I/SN
23LC1024T-I/SN by Microchip Technology is a 128Kx8 SRAM with 20MHz clock frequency, operating at -40 to 85°C. It has a serial interface, 1.27mm terminal pitch, and consumes max 10mA supply current. Ideal for industrial applications requiring fast synchronous memory access in a compact package.
23LC1024T-I/ST
23LC1024T-I/ST by Microchip Technology is a 128KX8 SRAM with 131072 words, operating at 20 MHz. It has a supply voltage range of 2.5V to 5.5V and operates in industrial temperatures from -40°C to 85°C. Ideal for applications requiring fast synchronous memory access in compact designs.
23LCV1024T-I/SN
23LCV1024T-I/SN by Microchip Technology is a 128KX8 SRAM with 131072 words, operating at 20 MHz. It has a memory density of 1048576 bit and uses SERIAL technology. Ideal for industrial applications requiring fast synchronous data storage in a compact SMALL OUTLINE package.
23LCV1024-I/SN
23LCV1024-I/SN by Microchip Technology is a 128KX8 SRAM with 3/5 V power supplies, operating at -40 to 85 °C. It features a max clock frequency of 20 MHz and offers 131072 words memory density. Ideal for industrial applications requiring small outline packages and low standby current.
23LC1024-I/ST
23LC1024-I/ST by Microchip Technology is a synchronous SRAM with an organization of 128KX8. It operates at a max clock frequency of 20 MHz and has a memory density of 1048576 bit. This memory IC type is commonly used in industrial applications requiring fast and reliable data storage.
23LC1024-I/SNVAO
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
23LCV1024-I/P
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Finish: MATTE TIN;
23LC512-I/P
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Input/Output Type: SEPARATE;
23LCV512-I/ST
23LCV512-I/ST by Microchip Technology is a 64KX8 SERIAL SRAM with 20 MHz fCLK, -40 to 85 °C temp range. Ideal for industrial applications requiring low standby current and common I/O type in a small outline package.
23LC512-I/SN
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;
23LCV1024-I/ST
23LCV1024-I/ST by Microchip Technology is a 128KX8 SRAM with 20 MHz clock frequency, operating at -40 to 85 °C. It has separate I/O, 3-STATE output, and uses 0.65 mm terminal pitch. Ideal for industrial applications requiring high-speed synchronous memory in a small outline package.
23LCV512-I/SN
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
23LC1024T-E/SN
23LC1024T-E/SN by Microchip Technology is a synchronous SRAM with 128KX8 organization and 1048576 bit memory density. It operates at a max clock frequency of 16 MHz and has a min standby voltage of 2.5 V. This memory IC is commonly used in automotive applications due to its TS 16949 screening level and temperature grade.
23LC1024-I/P
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 20 MHz;
23LC512-I/ST
23LC512-I/ST by Microchip Technology is a small outline, thin profile, shrink pitch SRAM with an organization of 64KX8. It operates synchronously at a max clock frequency of 20 MHz and has a memory density of 524288 bits. This memory IC is commonly used in industrial applications requiring reliable and fast data storage.
23LCV1024T-I/ST
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
23LCV512T-I/SN
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm;
23LC1024T-E/ST
STANDARD SRAM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;
23LC1024T-E/SNVAO
STANDARD SRAM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Memory Density: 1048576 bit;
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