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23LC1024T-E/SN

Microchip Technology

23LC1024T-E/SN by Microchip Technology

23LC1024T-E/SN by Microchip Technology is a synchronous SRAM with 128KX8 organization and 1048576 bit memory density. It operates at a max clock frequency of 16 MHz and has a min standby voltage of 2.5 V. This memory IC is commonly used in automotive applications due to its TS 16949 screening level and temperature grade.

Median Price

$2.630

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 6,250 parts In-Stock

1+ parts

$2.630

100+ parts

$2.430

1k+ parts

$2.290

10k+ parts

$2.160

6,250

$2.630

$2.430

$2.290

$2.160

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$3.330

100+ parts

-

1k+ parts

-

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10

$3.330

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Vyrian

USA . 13,203 parts In-Stock

1+ parts

-

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13,203

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VNN

France . 2,491 parts In-Stock

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2,491

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 13,297 parts In-Stock

1+ parts

$2.240

100+ parts

-

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13,297

$2.240

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Semicontronic

India . 12,834 parts In-Stock

1+ parts

$2.240

100+ parts

$2.184

1k+ parts

$2.173

10k+ parts

-

12,834

$2.240

$2.184

$2.173

-

Continental Prestige Electronics

USA . 5,223 parts In-Stock

1+ parts

$3.330

100+ parts

-

1k+ parts

-

10k+ parts

$3.263

5,223

$3.330

-

-

$3.263

Netroflash

USA . 999 parts In-Stock

1+ parts

$3.330

100+ parts

$3.263

1k+ parts

-

10k+ parts

-

999

$3.330

$3.263

-

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Argo Parts USA

USA . 328 parts In-Stock

1+ parts

$3.330

100+ parts

-

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328

$3.330

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Aztec Data Supply Inc.

USA . 4,601 parts In-Stock

1+ parts

$4.530

100+ parts

-

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4,601

$4.530

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Corohmni

South Africa . 302 parts In-Stock

1+ parts

$5.044

100+ parts

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302

$5.044

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AZTECH Wire

Italy . 172 parts In-Stock

1+ parts

$16.270

100+ parts

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172

$16.270

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Lixinc

USA . 16,344 parts In-Stock

1+ parts

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100+ parts

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16,344

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Marpe Global Electronics

Taiwan . 5,463 parts In-Stock

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5,463

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Futuretech Components

Singapore . 5,149 parts In-Stock

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5,149

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XL Components Corporation

Australia . 3,225 parts In-Stock

1+ parts

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3,225

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QualityLine Systems

Poland . 119 parts In-Stock

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119

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Overview

Discover the high-quality 23LC1024T-E/SN by Microchip Technology, a leading manufacturer in the industry. This small outline SRAM package offers numerous advantages for your applications. With its synchronous operating mode and common/separate input/output type, it provides reliable performance and versatility. Its 128KX8 organization and 131072-word capacity ensure ample memory space. Plus, its automotive-grade temperature grade and TS 16949 screening level guarantee durability and reliability. Unlock the value of this powerful product and experience the benefits it brings to your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made with a durable plastic/epoxy material, ensuring its longevity and resistance to wear and tear.

Surface Mount: YES

With its surface mount capability, this product offers easy installation and is suitable for various PCB designs.

Screening Level: TS 16949

This product has undergone TS 16949 screening, guaranteeing its high quality and reliability in automotive applications.

Package Shape: RECTANGULAR

With its rectangular package shape, this product can be easily integrated into different circuit designs and configurations.

Operating Mode: SYNCHRONOUS

The synchronous operating mode of this product ensures accurate and synchronized data transfers, making it ideal for applications requiring real-time data processing.

Input/Output Type: COMMON/SEPARATE

This feature allows for both common and separate input/output configurations, providing flexibility and compatibility with different system requirements.

Nominal Supply Voltage (Vsup): 5V

The 5V nominal supply voltage of this product ensures stable and reliable performance, making it suitable for a wide range of electronic devices.

Power Supplies (V): 3/5

This product supports multiple power supply options (3V or 5V), allowing for compatibility with various system designs and power constraints.

No. of Terminals: 8

With 8 terminals, this product offers a compact form factor and easy integration into circuit designs with limited space.

Package Style (Meter): SMALL OUTLINE

The small outline package style of this product makes it suitable for space-constrained applications, providing efficient use of board real estate.

Maximum Operating Temperature: 125 °C

This product can operate reliably at high temperatures up to 125°C, making it suitable for challenging environments.

Organization: 128KX8

The 128KX8 organization of this product allows for a large memory capacity and efficient data storage, making it suitable for applications requiring extensive data handling.

Output Characteristics: 3-STATE

The 3-STATE output characteristics of this product enable efficient bus sharing and reduce contention issues in multi-master systems.

Minimum Standby Voltage: 2.5V

With a minimum standby voltage of 2.5V, this product offers energy-saving capabilities and is suitable for power-sensitive applications.

Minimum Operating Temperature: -40 °C

This product can operate reliably even in harsh cold environments down to -40°C, ensuring its performance in extreme conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish enhances the solderability and durability of this product, ensuring reliable connections during installation.

Terminal Position: DUAL

With dual terminal positions, this product provides flexibility in circuit board layout and offers easy accessibility during assembly and testing.

Maximum Seated Height: 1.75 mm

With a compact maximum seated height of 1.75 mm, this product can be integrated into low-profile applications without sacrificing performance.

Maximum Clock Frequency (fCLK): 16 MHz

The maximum clock frequency of 16 MHz allows for quick and efficient data processing, making this product suitable for high-speed applications.

Width: 3.9 mm

This product's slim width of 3.9 mm enables it to fit into compact circuit designs and reduces space requirements.

Minimum Supply Voltage (Vsup): 2.5V

With a minimum supply voltage of 2.5V, this product can operate efficiently even in low voltage conditions, making it suitable for battery-powered devices.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering during assembly, guaranteeing reliable connections and performance.

Length: 4.9 mm

The compact length of 4.9 mm allows for easy integration into circuit designs with limited space availability.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets the stringent temperature requirements and reliability standards in the automotive industry.

Technology: CMOS

Built using CMOS technology, this product offers low power consumption, high noise immunity, and compatibility with a wide range of electronic devices.

Parallel or Serial: SERIAL

This product follows a serial data transfer protocol, allowing for efficient and compact data transmission, making it suitable for applications with limited pin count.

Terminal Form: GULL WING

The gull wing terminal form of this product provides secure and reliable solder connections, ensuring its performance and longevity.

Maximum Supply Current: 10 mA

With a maximum supply current of 10 mA, this product offers low power consumption, making it suitable for energy-efficient designs.

No. of Words: 131072 words

The large number of words (131072) this product can store ensures sufficient memory capacity for data-intensive applications.

Memory Width: 8

With a memory width of 8 bits, this product can handle and process data efficiently, making it suitable for various computational tasks.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm provides reliable connectivity and compatibility with standard PCB design guidelines.

No. of Words Code: 128K

This product utilizes a 128K word code, enabling efficient addressing and data retrieval for effective data storage and retrieval.

Maximum Supply Voltage (Vsup): 5.5V

With a maximum supply voltage of 5.5V, this product offers flexibility and compatibility with different power supply requirements.

Memory Density: 1048576 bit

With a memory density of 1048576 bits, this product provides ample storage capacity for data-intensive applications, ensuring efficient data handling and processing.

Memory IC Type: STANDARD SRAM

This product is a standard SRAM (Static Random-Access Memory) integrated circuit, offering reliable and fast data storage capabilities for various applications.

Maximum Standby Current: 0.00002 Amp

With an ultra-low maximum standby current of 0.00002 Amp, this product minimizes power consumption in standby mode, making it suitable for battery-powered devices.

Technical Specifications

SRAM 23LC1024T-E/SN attributes and parameters. Explore more SRAM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

16 MHz

Input/Output Type:

COMMON/SEPARATE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Output Characteristics:

3-STATE

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Maximum Standby Current:

.00002 Amp

Minimum Standby Voltage:

2.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

23LC1024T-E/SN Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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