Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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23LC1024T-E/SN by Microchip Technology is a synchronous SRAM with 128KX8 organization and 1048576 bit memory density. It operates at a max clock frequency of 16 MHz and has a min standby voltage of 2.5 V. This memory IC is commonly used in automotive applications due to its TS 16949 screening level and temperature grade.
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This product is made with a durable plastic/epoxy material, ensuring its longevity and resistance to wear and tear.
With its surface mount capability, this product offers easy installation and is suitable for various PCB designs.
This product has undergone TS 16949 screening, guaranteeing its high quality and reliability in automotive applications.
With its rectangular package shape, this product can be easily integrated into different circuit designs and configurations.
The synchronous operating mode of this product ensures accurate and synchronized data transfers, making it ideal for applications requiring real-time data processing.
This feature allows for both common and separate input/output configurations, providing flexibility and compatibility with different system requirements.
The 5V nominal supply voltage of this product ensures stable and reliable performance, making it suitable for a wide range of electronic devices.
This product supports multiple power supply options (3V or 5V), allowing for compatibility with various system designs and power constraints.
With 8 terminals, this product offers a compact form factor and easy integration into circuit designs with limited space.
The small outline package style of this product makes it suitable for space-constrained applications, providing efficient use of board real estate.
This product can operate reliably at high temperatures up to 125°C, making it suitable for challenging environments.
The 128KX8 organization of this product allows for a large memory capacity and efficient data storage, making it suitable for applications requiring extensive data handling.
The 3-STATE output characteristics of this product enable efficient bus sharing and reduce contention issues in multi-master systems.
With a minimum standby voltage of 2.5V, this product offers energy-saving capabilities and is suitable for power-sensitive applications.
This product can operate reliably even in harsh cold environments down to -40°C, ensuring its performance in extreme conditions.
The matte tin terminal finish enhances the solderability and durability of this product, ensuring reliable connections during installation.
With dual terminal positions, this product provides flexibility in circuit board layout and offers easy accessibility during assembly and testing.
With a compact maximum seated height of 1.75 mm, this product can be integrated into low-profile applications without sacrificing performance.
The maximum clock frequency of 16 MHz allows for quick and efficient data processing, making this product suitable for high-speed applications.
This product's slim width of 3.9 mm enables it to fit into compact circuit designs and reduces space requirements.
With a minimum supply voltage of 2.5V, this product can operate efficiently even in low voltage conditions, making it suitable for battery-powered devices.
The peak reflow temperature of 260°C ensures proper soldering during assembly, guaranteeing reliable connections and performance.
The compact length of 4.9 mm allows for easy integration into circuit designs with limited space availability.
Designed for automotive applications, this product meets the stringent temperature requirements and reliability standards in the automotive industry.
Built using CMOS technology, this product offers low power consumption, high noise immunity, and compatibility with a wide range of electronic devices.
This product follows a serial data transfer protocol, allowing for efficient and compact data transmission, making it suitable for applications with limited pin count.
The gull wing terminal form of this product provides secure and reliable solder connections, ensuring its performance and longevity.
With a maximum supply current of 10 mA, this product offers low power consumption, making it suitable for energy-efficient designs.
The large number of words (131072) this product can store ensures sufficient memory capacity for data-intensive applications.
With a memory width of 8 bits, this product can handle and process data efficiently, making it suitable for various computational tasks.
The terminal pitch of 1.27 mm provides reliable connectivity and compatibility with standard PCB design guidelines.
This product utilizes a 128K word code, enabling efficient addressing and data retrieval for effective data storage and retrieval.
With a maximum supply voltage of 5.5V, this product offers flexibility and compatibility with different power supply requirements.
With a memory density of 1048576 bits, this product provides ample storage capacity for data-intensive applications, ensuring efficient data handling and processing.
This product is a standard SRAM (Static Random-Access Memory) integrated circuit, offering reliable and fast data storage capabilities for various applications.
With an ultra-low maximum standby current of 0.00002 Amp, this product minimizes power consumption in standby mode, making it suitable for battery-powered devices.
SRAM 23LC1024T-E/SN attributes and parameters. Explore more SRAM devices from Microchip Technology
Maximum Clock Frequency (fCLK):
Input/Output Type:
JESD-30 Code:
JESD-609 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Ports:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Output Enable:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Screening Level:
Maximum Seated Height:
Maximum Standby Current:
Minimum Standby Voltage:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
23LC1024T-E/SN Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.51
SB
8542.32.00.50
PCN Design/Specification - 23A1024/23LC1024 20/Jul/2022 Die/Moulding Material Chg 21/Jun/2016
PCN Packaging - Packing Changes 10/Oct/2016 Reel Design Update 07/May/2015
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
SS14
Onsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Brightking
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Souriau-sunbank Connection Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body Length: 1.228 inch; Mounting Type: CABLE AND PANEL; Termination Type: CRIMP;
ULN-2803A
Sprague Electric
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
Changzhou Galaxy Century Microelectronics
STM32H743IIT6
STMicroelectronics
STM32H743IIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications due to its wide temperature range (-40°C to 85°C) and various connectivity options (CAN, I2C, UART, USB).
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
Fairchild Semiconductor
BSS138
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3.5 ohm; Maximum Drain Current (ID): .2 A; Peak Reflow Temperature (C): NOT SPECIFIED;
MURS160T3G
MURS160T3G by Onsemi is a single rectifier diode with a max output current of 2A and max repetitive peak reverse voltage of 600V. It has a fast recovery time of 0.075us, making it suitable for high voltage applications. The diode operates in temperatures ranging from -65 to 175°C, ideal for power systems requiring ultra-fast response.
LM317T
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-PSFM-T3; Adjustability: ADJUSTABLE; Package Equivalence Code: SIP3,.1TB;
BSS84PH6327XTSA2
Infineon Technologies
BSS84PH6327XTSA2 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and operates in enhancement mode. With a max drain current of 0.17A and on-resistance of 8 ohm, it offers reliable performance in small outline packages.
2N2222A
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
LL4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Baneasa S A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
Itt Cannon
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Filter Feature: NO;
1554216002
Molex
WIRE AND CABLE;
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
MBRS360T3G
MBRS360T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.63V and a max output current of 3A. It is designed for applications requiring high-speed switching and low power loss, making it suitable for use in various electronic devices.
CY62148ELL-45ZSXIT
Cypress Semiconductor
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Standby Current: .000007 Amp;
CY62168EV30LL-45BVXIT
Infineon's CY62168EV30LL-45BVXIT is a 2MX8 SRAM with 3.3V supply, 45ns access time, and 85°C operating temp. Ideal for industrial applications requiring fast, common I/O asynchronous memory in a compact grid array package.
CY7C1041G30-10BVXIT
Infineon's CY7C1041G30-10BVXIT is a 256Kx16 SRAM with 100MHz clock frequency, 10ns access time, and 3-state output. Ideal for applications requiring fast and reliable memory storage in devices like networking equipment, industrial automation systems, and telecommunications infrastructure.
CY14V116N-BZ30XI
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.4 mm;
CY62147EV30LL-45BVXI
CY62147EV30LL-45BVXI by Infineon Technologies is a 256Kx16 SRAM with 3.6V max supply voltage, 45ns access time, and operates in industrial temperature range. It features a very thin profile grid array package suitable for applications requiring fast and reliable memory storage in harsh environments.
5962-8685920YA
Micron Technology
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 22; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Technology: CMOS;
23A1024-I/P
Microchip Technology
Microchip Technology's 23A1024-I/P is a CMOS SRAM with 128KX8 organization, operating at 1.8/2V. It features synchronous operation, 20MHz clock frequency, and 131072 words capacity. Ideal for industrial applications requiring reliable memory storage in a compact IN-LINE package style.
CY7C1041GN30-10ZSXI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Surface Mount: YES;
5962-8685908LA
Defense Logistics Agency
Defense Logistics Agency's 5962-8685908LA SRAM features 16KX4 organization, CMOS technology, and 45 ns max access time. Ideal for military applications with MIL-STD-883 screening level, this memory IC operates asynchronously at temperatures ranging from -55 to 125 °C.
AS6C8016-55ZIN
Alliance Memory
Alliance Memory's AS6C8016-55ZIN is a 512Kx16 SRAM with 55ns access time, operating at 3V. Ideal for industrial applications, it features a small outline package and common I/O type. With a max supply voltage of 5.5V, this CMOS technology memory IC offers high performance in a compact form factor.
7008L15PFG
Renesas Electronics
Renesas Electronics 7008L15PFG is a 64Kx8 SRAM with 5V supply, operating in asynchronous mode. It features 3-STATE output and GULL WING terminals on a SQUARE package. Ideal for applications requiring fast access times and high memory density.
5962-8685916LA
Pyramid Semiconductor
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Technology: CMOS;
70261L15PFG8
Integrated Device Technology
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; Technology: CMOS;
DS1225Y-200-IND
Dallas Semiconductor
DS1225Y-200-IND by Dallas Semiconductor is an 8Kx8 SRAM with 65536-bit memory density. It operates at 5V, has a max access time of 200ns, and is designed for industrial applications. The package style is in-line with through-hole terminals and a temperature range of -40 to 85°C.
5962-9461110HMA
Aeroflex Microelectronic Solutions
SRAM MODULE; Temperature Grade: MILITARY; No. of Terminals: 68; Package Code: QFP; Package Shape: SQUARE; Memory Density: 16777216 bit;
CY62167G30-45ZXIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
71321SA35TFG
Renesas Electronics 71321SA35TFG is a 2Kx8 MULTI-PORT SRAM with 35ns access time, operating at 5V. It features a low profile flatpack package and operates in asynchronous mode. Ideal for applications requiring fast memory access in commercial temperature environments.
71024S15YGI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOJ; Package Shape: RECTANGULAR; Length: 20.995 mm;
X2004J-25
Xicor
X2004J-25 by Xicor is a 512x8 NMOS SRAM chip with 3-STATE output. Operating at 5V, it has a max access time of 250ns and supports asynchronous mode. Ideal for commercial applications requiring non-volatile memory with parallel organization and output enable feature.
IS66WVS2M8BLL-104TLI
Integrated Silicon Solution
IS66WVS2M8BLL-104TLI by Integrated Silicon Solution is a 2MX8 SRAM with synchronous operation, clock frequency of 104 MHz, and memory density of 16Mb. It is ideal for industrial applications requiring fast and reliable data storage in a small outline package.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
23LC1024-I/SN
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING;
23LC1024T-I/SN
23LC1024T-I/SN by Microchip Technology is a 128Kx8 SRAM with 20MHz clock frequency, operating at -40 to 85°C. It has a serial interface, 1.27mm terminal pitch, and consumes max 10mA supply current. Ideal for industrial applications requiring fast synchronous memory access in a compact package.
23LC1024T-I/ST
23LC1024T-I/ST by Microchip Technology is a 128KX8 SRAM with 131072 words, operating at 20 MHz. It has a supply voltage range of 2.5V to 5.5V and operates in industrial temperatures from -40°C to 85°C. Ideal for applications requiring fast synchronous memory access in compact designs.
23LCV1024T-I/SN
23LCV1024T-I/SN by Microchip Technology is a 128KX8 SRAM with 131072 words, operating at 20 MHz. It has a memory density of 1048576 bit and uses SERIAL technology. Ideal for industrial applications requiring fast synchronous data storage in a compact SMALL OUTLINE package.
23LCV1024-I/SN
23LCV1024-I/SN by Microchip Technology is a 128KX8 SRAM with 3/5 V power supplies, operating at -40 to 85 °C. It features a max clock frequency of 20 MHz and offers 131072 words memory density. Ideal for industrial applications requiring small outline packages and low standby current.
23LC1024-I/ST
23LC1024-I/ST by Microchip Technology is a synchronous SRAM with an organization of 128KX8. It operates at a max clock frequency of 20 MHz and has a memory density of 1048576 bit. This memory IC type is commonly used in industrial applications requiring fast and reliable data storage.
23LC1024-I/SNVAO
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
23LCV1024-I/P
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Finish: MATTE TIN;
23LC512-I/P
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Input/Output Type: SEPARATE;
23LCV512-I/ST
23LCV512-I/ST by Microchip Technology is a 64KX8 SERIAL SRAM with 20 MHz fCLK, -40 to 85 °C temp range. Ideal for industrial applications requiring low standby current and common I/O type in a small outline package.
23LC512-I/SN
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;
23LCV1024-I/ST
23LCV1024-I/ST by Microchip Technology is a 128KX8 SRAM with 20 MHz clock frequency, operating at -40 to 85 °C. It has separate I/O, 3-STATE output, and uses 0.65 mm terminal pitch. Ideal for industrial applications requiring high-speed synchronous memory in a small outline package.
23LCV512-I/SN
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
23LC1024-I/P
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 20 MHz;
23LC512-I/ST
23LC512-I/ST by Microchip Technology is a small outline, thin profile, shrink pitch SRAM with an organization of 64KX8. It operates synchronously at a max clock frequency of 20 MHz and has a memory density of 524288 bits. This memory IC is commonly used in industrial applications requiring reliable and fast data storage.
23LC1024-E/SN
23LC1024-E/SN by Microchip is a 128KX8 SRAM with 131072 words, operating at 16 MHz. It has a supply voltage range of 2.5V to 5.5V and operates in automotive temperatures (-40 to 125 °C). Ideal for applications requiring fast synchronous memory access in compact designs.
23LCV1024T-I/ST
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
23LCV512T-I/SN
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm;
23LC1024T-E/SNVAO
STANDARD SRAM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Memory Density: 1048576 bit;
23LC1024T-I/SNVAO
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
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