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CY7C1049G30-10VXIT

Infineon Technologies

CY7C1049G30-10VXIT by Infineon Technologies

CY7C1049G30-10VXIT by Infineon is a 512Kx8 SRAM with 10ns access time, operating at 3V. It features a small outline package and is ideal for industrial applications requiring fast and reliable parallel memory storage. With a memory density of 4Mbit, it offers high performance in a compact form factor.

Median Price

$5.260

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 460 parts In-Stock

1+ parts

$4.100

100+ parts

$3.270

1k+ parts

$3.160

10k+ parts

-

460

$4.100

$3.270

$3.160

-

Chip1Stop

Japan . 50 parts In-Stock

1+ parts

$4.440

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$4.440

-

-

-

Newark

USA . 456 parts In-Stock

1+ parts

$5.260

100+ parts

$4.540

1k+ parts

$3.770

10k+ parts

-

456

$5.260

$4.540

$3.770

-

Mouser Electronics

USA . 625 parts In-Stock

1+ parts

$5.560

100+ parts

$4.790

1k+ parts

$4.170

10k+ parts

-

625

$5.560

$4.790

$4.170

-

DigiKey

USA . 529 parts In-Stock

1+ parts

$5.560

100+ parts

$4.789

1k+ parts

$4.407

10k+ parts

$4.341

529

$5.560

$4.789

$4.407

$4.341

Element14

Singapore . 500 parts In-Stock

1+ parts

$6.800

100+ parts

$5.430

1k+ parts

$5.190

10k+ parts

-

500

$6.800

$5.430

$5.190

-

Flip Electronics (Authorized)

USA . 3,539 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,539

-

-

-

-

Verical

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Rochester

USA . 48 parts In-Stock

1+ parts

-

100+ parts

$3.230

1k+ parts

$2.890

10k+ parts

$2.720

48

-

$3.230

$2.890

$2.720

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 824 parts In-Stock

1+ parts

$4.788

100+ parts

-

1k+ parts

-

10k+ parts

-

824

$4.788

-

-

-

Nova Conductors

Japan . 98 parts In-Stock

1+ parts

$6.079

100+ parts

-

1k+ parts

-

10k+ parts

-

98

$6.079

-

-

-

Flip Electronics

USA . 8,169 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,169

-

-

-

-

Vyrian

USA . 344 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

344

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,782 parts In-Stock

1+ parts

$3.113

100+ parts

-

1k+ parts

-

10k+ parts

-

1,782

$3.113

-

-

-

Ampacity Inc.

Singapore . 358 parts In-Stock

1+ parts

$3.480

100+ parts

-

1k+ parts

-

10k+ parts

-

358

$3.480

-

-

-

Modulus Dynamics

Lithuania . 4,492 parts In-Stock

1+ parts

$3.924

100+ parts

$3.767

1k+ parts

$3.610

10k+ parts

-

4,492

$3.924

$3.767

$3.610

-

Corphita

USA . 692 parts In-Stock

1+ parts

$4.536

100+ parts

-

1k+ parts

-

10k+ parts

-

692

$4.536

-

-

-

Corohmni

South Africa . 802 parts In-Stock

1+ parts

$5.052

100+ parts

-

1k+ parts

-

10k+ parts

-

802

$5.052

-

-

-

Component Stockers USA

USA . 1,639 parts In-Stock

1+ parts

$5.210

100+ parts

$5.610

1k+ parts

$5.000

10k+ parts

-

1,639

$5.210

$5.610

$5.000

-

Continental Prestige Electronics

USA . 4,159 parts In-Stock

1+ parts

$6.079

100+ parts

-

1k+ parts

-

10k+ parts

$5.957

4,159

$6.079

-

-

$5.957

Netroflash

USA . 100 parts In-Stock

1+ parts

$6.079

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$6.079

-

-

-

Perfect Parts

USA . 5,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,600

-

-

-

-

Argo Parts USA

USA . 3,625 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,625

-

-

-

-

Overview

Discover the power of Infineon Technologies with the innovative CY7C1049G30-10VXIT SRAM memory chip. Boasting a high-quality plastic/epoxy package, this asynchronous memory device offers a seamless 512Kx8 organization for reliable performance in industrial applications. With a wide operating temperature range and low nominal supply voltage, this versatile memory solution delivers unparalleled value and efficiency. Upgrade your systems with Infineon's cutting-edge technology and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable package for this product.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving on the PCB.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a standardized form factor for compatibility with various systems.

Operating Mode: ASYNCHRONOUS

The asynchronous operation allows for efficient and flexible data access in real-time applications.

Nominal Supply Voltage / Vsup (V): 3

The 3V nominal supply voltage offers a balance between power efficiency and performance for the device.

No. of Terminals: 36

With 36 terminals, this product provides sufficient connectivity options for interfacing with other components.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in various environmental conditions.

Organization: 512KX8

The 512KX8 organization allows for efficient data storage and retrieval in byte-wide operations.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables the product to function reliably in extreme cold conditions.

Terminal Finish: PURE TIN

The use of pure tin for terminal finish provides good conductivity and solderability for a reliable connection.

Terminal Position: DUAL

The dual terminal position offers flexibility in PCB layout and component placement.

Maximum Seated Height: 3.7592 mm

The low maximum seated height allows for the product to be used in slim and compact devices.

Width: 10.16 mm

The 10.16mm width of the product ensures compatibility with standard PCB layouts and designs.

Minimum Supply Voltage (Vsup): 2.2 V

The 2.2V minimum supply voltage allows for operation in low-power applications while maintaining functionality.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and reliability during assembly processes.

Length: 23.495 mm

The 23.495mm length of the product provides a standardized form factor for easy integration into various systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes this product suitable for use in harsh environmental conditions.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity.

Parallel or Serial: PARALLEL

Utilizing parallel operation allows for fast and efficient data transfer within the system.

Terminal Form: J BEND

The J bend terminal form simplifies the soldering process and improves mechanical stability.

No. of Words: 524288 words

With 524288 words, this product offers ample data storage capacity for various applications.

Memory Width: 8

The 8-bit memory width provides compatibility with standard data bus architectures for seamless integration.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and secure connections on the PCB.

No. of Words Code: 512K

The 512K words code simplifies memory addressing and management in the device.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the level of protection against moisture-related damage, ensuring product reliability.

Maximum Supply Voltage (Vsup): 3.6 V

The 3.6V maximum supply voltage offers flexibility in power supply options while ensuring device performance.

Memory Density: 4194304 bit

With 4194304 bits of memory density, this product can store a large amount of data efficiently.

Memory IC Type: STANDARD SRAM

The use of standard SRAM technology ensures reliable and high-speed data storage and retrieval.

Maximum Access Time: 10 ns

The fast maximum access time of 10ns allows for quick data processing and response times.

Technical Specifications

SRAM CY7C1049G30-10VXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

10 ns

JESD-30 Code:

R-PDSO-J36

Length:

23.495 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOJ

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

3.7592 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

CY7C1049G30-10VXIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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