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CY14B101LA-SP25XIT

Infineon Technologies

CY14B101LA-SP25XIT by Infineon Technologies

Infineon's CY14B101LA-SP25XIT is a 128Kx8 non-volatile SRAM with 3V nominal voltage. Operating in industrial temperature range, it offers 25ns access time and consumes max 70mA supply current. Ideal for applications requiring fast, reliable data storage in compact form factor.

Median Price

$33.995

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 70 parts In-Stock

1+ parts

$24.450

100+ parts

$21.350

1k+ parts

-

10k+ parts

-

70

$24.450

$21.350

-

-

Arrow

USA . 740 parts In-Stock

1+ parts

$33.290

100+ parts

$24.060

1k+ parts

$22.850

10k+ parts

-

740

$33.290

$24.060

$22.850

-

Chip1Stop

Japan . 39 parts In-Stock

1+ parts

$34.700

100+ parts

-

1k+ parts

-

10k+ parts

-

39

$34.700

-

-

-

Newark

USA . 70 parts In-Stock

1+ parts

$38.650

100+ parts

$32.910

1k+ parts

$28.610

10k+ parts

-

70

$38.650

$32.910

$28.610

-

Mouser Electronics

USA . 1,251 parts In-Stock

1+ parts

$39.270

100+ parts

$33.430

1k+ parts

$29.830

10k+ parts

-

1,251

$39.270

$33.430

$29.830

-

DigiKey

USA . 1,281 parts In-Stock

1+ parts

$43.040

100+ parts

$36.621

1k+ parts

$33.613

10k+ parts

-

1,281

$43.040

$36.621

$33.613

-

Element14

Singapore . 70 parts In-Stock

1+ parts

$52.220

100+ parts

$44.480

1k+ parts

-

10k+ parts

-

70

$52.220

$44.480

-

-

Master Electronics

USA . 1,000 parts In-Stock

1+ parts

$63.050

100+ parts

$24.420

1k+ parts

$22.570

10k+ parts

-

1,000

$63.050

$24.420

$22.570

-

Future Electronics

Canada . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$26.860

10k+ parts

-

1,000

-

-

$26.860

-

Avnet

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$22.934

10k+ parts

$22.091

1,000

-

-

$22.934

$22.091

Verical

USA . 425 parts In-Stock

1+ parts

-

100+ parts

$30.625

1k+ parts

$27.400

10k+ parts

$25.788

425

-

$30.625

$27.400

$25.788

Rochester

USA . 425 parts In-Stock

1+ parts

-

100+ parts

$24.500

1k+ parts

$21.920

10k+ parts

$20.630

425

-

$24.500

$21.920

$20.630

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 628 parts In-Stock

1+ parts

$25.346

100+ parts

-

1k+ parts

-

10k+ parts

-

628

$25.346

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$26.200

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$26.200

-

-

-

Chip Stock

USA . 6,490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,490

-

-

-

-

IBS Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$37.671

10k+ parts

-

2,000

-

-

$37.671

-

Rapid Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Vyrian

USA . 375 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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375

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 6,415 parts In-Stock

1+ parts

$3.881

100+ parts

$3.726

1k+ parts

$3.571

10k+ parts

-

6,415

$3.881

$3.726

$3.571

-

Ampacity Inc.

Singapore . 223 parts In-Stock

1+ parts

$18.940

100+ parts

-

1k+ parts

-

10k+ parts

-

223

$18.940

-

-

-

Continental Prestige Electronics

USA . 6,371 parts In-Stock

1+ parts

$23.701

100+ parts

-

1k+ parts

-

10k+ parts

$23.227

6,371

$23.701

-

-

$23.227

Corphita

USA . 518 parts In-Stock

1+ parts

$24.012

100+ parts

-

1k+ parts

-

10k+ parts

-

518

$24.012

-

-

-

Component Stockers USA

USA . 7,513 parts In-Stock

1+ parts

$31.080

100+ parts

$23.670

1k+ parts

$21.770

10k+ parts

-

7,513

$31.080

$23.670

$21.770

-

Lixinc

USA . 12,635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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12,635

-

-

-

-

Futuretech Components

Singapore . 6,378 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,378

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,068 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,068

-

-

-

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Alle Elektronik GmbH

Germany . 4,045 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,045

-

-

-

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Argo Parts USA

USA . 2,972 parts In-Stock

1+ parts

-

100+ parts

-

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2,972

-

-

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Kepictronics

USA . 1,503 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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1,503

-

-

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Perfect Parts

USA . 1,221 parts In-Stock

1+ parts

-

100+ parts

-

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1,221

-

-

-

-

Authorized Procurement Solutions

USA . 874 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

874

-

-

-

-

Overview

Experience unparalleled quality with the CY14B101LA-SP25XIT by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies offers top-of-the-line SRAM products that deliver exceptional performance and reliability. Ideal for industrial applications requiring high-speed data storage, this non-volatile SRAM provides customers with a seamless and efficient solution. Trust in the value, benefits, and advantages that the CY14B101LA-SP25XIT brings to the table, and elevate your projects to new heights with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for applications where weight and durability are important.

Surface Mount: YES

Being surface mountable allows for easy installation on circuit boards, saving space and making the assembly process more efficient.

Operating Mode: ASYNCHRONOUS

Asynchronous operation provides flexibility and enables the device to function independently of a clock signal, making it versatile for various applications.

Nominal Supply Voltage: 3V

Operating at a nominal supply voltage of 3V, this SRAM is energy-efficient and compatible with many common power systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this SRAM can withstand extended use in demanding industrial environments without overheating.

No. of Terminals: 48

Having 48 terminals allows for a high level of connectivity and interfacing with other components, making it versatile for a wide range of applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and fast switching speeds, making this SRAM efficient and reliable for various data storage and retrieval tasks.

Technical Specifications

SRAM CY14B101LA-SP25XIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

25 ns

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.794 mm

Maximum Standby Current:

.005 Amp

Sub-Category:

SRAMs

Maximum Supply Current:

70 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

7.5 mm

Trade Compliance

CY14B101LA-SP25XIT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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