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CY14B104LA-ZS45XIT

Infineon Technologies

CY14B104LA-ZS45XIT by Infineon Technologies

Infineon's CY14B104LA-ZS45XIT is a 512Kx8 SRAM with 3V supply, operating in industrial temperature range. It features parallel interface, 45ns access time, and low standby current of 0.005A. Ideal for applications requiring fast and reliable non-volatile memory storage in compact form factor.

Median Price

$34.930

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,205 parts In-Stock

1+ parts

$41.480

100+ parts

$35.280

1k+ parts

$33.940

10k+ parts

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1,205

$41.480

$35.280

$33.940

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DigiKey

USA . 65 parts In-Stock

1+ parts

-

100+ parts

$30.240

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65

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$30.240

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Flip Electronics (Authorized)

USA . 65 parts In-Stock

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65

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Verical

USA . 65 parts In-Stock

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$34.930

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65

-

$34.930

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Distributors (In-Stock)

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Digiode

USA . 66 parts In-Stock

1+ parts

$28.994

100+ parts

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66

$28.994

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Chip Stock

USA . 5,300 parts In-Stock

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5,300

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Flip Electronics

USA . 1,415 parts In-Stock

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1,415

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Vyrian

USA . 546 parts In-Stock

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DigiKey Marketplace

USA . 65 parts In-Stock

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65

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Sensible Micro Corp

USA . 35 parts In-Stock

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35

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Bristol Electronics

USA . 35 parts In-Stock

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Atlantic Semiconductor

USA . 35 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,367 parts In-Stock

1+ parts

$4.523

100+ parts

-

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1,367

$4.523

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AZTECH Wire

Italy . 313 parts In-Stock

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$12.467

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313

$12.467

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Modulus Dynamics

Lithuania . 2,070 parts In-Stock

1+ parts

$25.515

100+ parts

$24.494

1k+ parts

$23.474

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2,070

$25.515

$24.494

$23.474

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Corohmni

South Africa . 843 parts In-Stock

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$25.515

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$25.515

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Ampacity Inc.

Singapore . 340 parts In-Stock

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$25.700

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340

$25.700

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Semicontronic

India . 215 parts In-Stock

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$25.700

100+ parts

$25.058

1k+ parts

$24.929

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215

$25.700

$25.058

$24.929

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Corphita

USA . 979 parts In-Stock

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$27.468

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979

$27.468

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Microchip USA

USA . 2,695 parts In-Stock

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$68.465

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$68.465

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Component Stockers USA

USA . 132 parts In-Stock

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$341.420

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$341.420

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Lixinc

USA . 16,495 parts In-Stock

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Futuretech Components

Singapore . 9,045 parts In-Stock

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Argo Parts USA

USA . 4,069 parts In-Stock

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Continental Prestige Electronics

USA . 1,731 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Overview

Experience superior quality and reliability with the CY14B104LA-ZS45XIT by Infineon Technologies, a leading manufacturer in the industry. This SRAM memory module offers exceptional performance in various applications, thanks to its advanced technology and innovative design. With a compact package body and low power consumption, this product provides customers with value, efficiency, and seamless operation. Choose the CY14B104LA-ZS45XIT for your memory needs and elevate your projects to the next level with its unmatched benefits and advantages.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the SRAM, making it suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 3

Provides a stable power supply for the SRAM, ensuring reliable performance and data storage.

Organization: 512KX8

Offers a high memory capacity and data organization, making it suitable for storing large amounts of information efficiently.

Temperature Grade: INDUSTRIAL

Designed to operate effectively in industrial environments with varying temperature conditions, ensuring reliability and performance.

Memory IC Type: NON-VOLATILE SRAM

Combines the speed of SRAM with the non-volatile properties, allowing for data retention even when power is removed, ideal for critical applications.

Technical Specifications

SRAM CY14B104LA-ZS45XIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e4

Length:

18.415 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.194 mm

Maximum Standby Current:

.005 Amp

Sub-Category:

SRAMs

Maximum Supply Current:

52 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

10.16 mm

Trade Compliance

CY14B104LA-ZS45XIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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