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CY62177EV30LL-55BAXI

Infineon Technologies

CY62177EV30LL-55BAXI by Infineon Technologies

Infineon's CY62177EV30LL-55BAXI is a 2MX16 SRAM with 3.3V supply, operating at -40 to 85°C. Featuring a parallel interface, it offers fast access time of 55ns and low standby current of 0.000017A. Ideal for industrial applications requiring high-speed memory in compact form factor.

Median Price

$44.775

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,012 parts In-Stock

1+ parts

$49.200

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1,012

$49.200

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Arrow

USA . 840 parts In-Stock

1+ parts

$49.300

100+ parts

$41.710

1k+ parts

$39.840

10k+ parts

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840

$49.300

$41.710

$39.840

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Mouser Electronics

USA . 72 parts In-Stock

1+ parts

$53.440

100+ parts

$44.600

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-

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72

$53.440

$44.600

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DigiKey

USA . 1,690 parts In-Stock

1+ parts

$56.110

100+ parts

$48.915

1k+ parts

$46.385

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1,690

$56.110

$48.915

$46.385

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Flip Electronics (Authorized)

USA . 11,234 parts In-Stock

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Rochester

USA . 6,220 parts In-Stock

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$32.280

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$28.880

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$27.180

6,220

-

$32.280

$28.880

$27.180

Verical

USA . 6,200 parts In-Stock

1+ parts

-

100+ parts

$40.350

1k+ parts

$36.100

10k+ parts

$33.975

6,200

-

$40.350

$36.100

$33.975

Future Electronics

Canada . 2,100 parts In-Stock

1+ parts

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$29.700

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2,100

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$29.700

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Avnet

USA . 210 parts In-Stock

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$33.708

210

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$33.708

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 575 parts In-Stock

1+ parts

$27.740

100+ parts

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575

$27.740

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$45.185

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100

$45.185

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IBS Electronics

USA . 10,010 parts In-Stock

1+ parts

$50.700

100+ parts

$48.288

1k+ parts

$48.288

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10,010

$50.700

$48.288

$48.288

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Flip Electronics

USA . 10,500 parts In-Stock

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Vyrian

USA . 2,708 parts In-Stock

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2,708

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ComSIT Distribution GmbH

Germany . 725 parts In-Stock

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725

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ComSIT USA

USA . 725 parts In-Stock

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725

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Rutronik

Germany . 350 parts In-Stock

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$48.800

350

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$48.800

Electronics Depot

USA . 18 parts In-Stock

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18

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Rebound Electronics

UK . 8 parts In-Stock

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8

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Bristol Electronics

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 174 parts In-Stock

1+ parts

$2.607

100+ parts

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174

$2.607

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Aztec Data Supply Inc.

USA . 4,148 parts In-Stock

1+ parts

$2.670

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4,148

$2.670

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Modulus Dynamics

Lithuania . 622 parts In-Stock

1+ parts

$5.399

100+ parts

$5.183

1k+ parts

$4.967

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622

$5.399

$5.183

$4.967

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Corphita

USA . 169 parts In-Stock

1+ parts

$26.280

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169

$26.280

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Ampacity Inc.

Singapore . 2,613 parts In-Stock

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$29.110

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2,613

$29.110

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Semicontronic

India . 3,239 parts In-Stock

1+ parts

$29.410

100+ parts

$28.675

1k+ parts

$28.528

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3,239

$29.410

$28.675

$28.528

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Component Stockers USA

USA . 19,591 parts In-Stock

1+ parts

$33.580

100+ parts

$31.980

1k+ parts

$31.980

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19,591

$33.580

$31.980

$31.980

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Continental Prestige Electronics

USA . 6,637 parts In-Stock

1+ parts

$45.185

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$44.281

6,637

$45.185

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$44.281

Bastille Electronics

Australia . 900 parts In-Stock

1+ parts

$45.190

100+ parts

$42.930

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$40.219

900

$45.190

$42.930

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$40.219

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$47.351

100+ parts

$43.563

1k+ parts

$40.820

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2,000

$47.351

$43.563

$40.820

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A-Z Elektronik GmbH

Germany . 6,540 parts In-Stock

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Kepictronics

USA . 5,151 parts In-Stock

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Argo Parts USA

USA . 4,538 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,360 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Perfect Parts

USA . 1,304 parts In-Stock

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RC Electronics

USA . 927 parts In-Stock

1+ parts

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100+ parts

$41.640

1k+ parts

$38.000

10k+ parts

$36.860

927

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$41.640

$38.000

$36.860

GreenTree Electronics

Israel . 350 parts In-Stock

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350

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Futuretech Components

Singapore . 300 parts In-Stock

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300

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ChipstoGo Electronic ltd

UK . 6 parts In-Stock

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6

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Overview

Unlock the power of reliable and high-performance memory with the CY62177EV30LL-55BAXI from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers exceptional quality and cutting-edge technology in every product. This SRAM device is perfect for a wide range of applications, offering seamless operation and fast access times. Experience the value and benefits of this top-notch memory solution, providing customers with the advantage they need for their projects. Choose Infineon for superior performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and flexibility, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount capability allows for easy installation and compact design, ideal for space-constrained projects.

Package Shape: RECTANGULAR

The rectangular shape offers convenient handling and integration into circuit designs.

Operating Mode: ASYNCHRONOUS

The asynchronous operation enables quick and efficient data access, enhancing overall performance.

Input/Output Type: COMMON

The common input/output type simplifies circuit connection and communication, making it user-friendly.

Nominal Supply Voltage / Vsup (V): 3

The 3V nominal supply voltage provides sufficient power for reliable operation in a variety of applications.

Power Supplies (V): 2.5/3.3

The availability of multiple power supply options allows for flexibility in different voltage environments.

No. of Terminals: 48

The ample number of terminals facilitates easy connectivity and integration within complex systems.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style combines grid array technology with thin profile and fine pitch for efficient space utilization and performance.

Alternate Memory Width: 8

The alternate memory width offers versatility in data storage capacities, catering to different memory requirements.

Technical Specifications

SRAM CY62177EV30LL-55BAXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

55 ns

Alternate Memory Width:

8

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

9.5 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.000017 Amp

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

45 mA

Maximum Supply Voltage (Vsup):

3.7 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

CY62177EV30LL-55BAXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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