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CY62177EV30LL-55ZXI

Infineon Technologies

CY62177EV30LL-55ZXI by Infineon Technologies

Infineon's CY62177EV30LL-55ZXI is a 2MX16 SRAM with 3.3V supply, 55ns access time, and 16-bit memory width. Ideal for industrial applications requiring fast and reliable data storage in a compact package.

Median Price

$47.700

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 362 parts In-Stock

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$47.700

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362

$47.700

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Verical

USA . 329 parts In-Stock

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$63.657

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$55.277

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329

$63.657

$55.277

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Arrow

USA . 8 parts In-Stock

1+ parts

$75.140

100+ parts

$59.780

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8

$75.140

$59.780

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Mouser Electronics

USA . 320 parts In-Stock

1+ parts

$75.870

100+ parts

$62.620

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$75.870

$62.620

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Flip Electronics (Authorized)

USA . 4,693 parts In-Stock

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4,693

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Avnet

USA . 480 parts In-Stock

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$47.351

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$44.688

480

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$47.351

$44.688

Rochester

USA . 126 parts In-Stock

1+ parts

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$44.690

1k+ parts

$39.980

10k+ parts

$37.630

126

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$44.690

$39.980

$37.630

Future Electronics

Canada . 96 parts In-Stock

1+ parts

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$46.240

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DigiKey

USA . 5 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 782 parts In-Stock

1+ parts

$40.850

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782

$40.850

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Nova Conductors

Japan . 10 parts In-Stock

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$59.831

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10

$59.831

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Chip Stock

USA . 1,085 parts In-Stock

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Vyrian

USA . 772 parts In-Stock

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Rutronik

Germany . 480 parts In-Stock

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$67.570

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480

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$67.570

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NexGen Digital

USA . 177 parts In-Stock

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IBS Electronics

USA . 162 parts In-Stock

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$70.069

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162

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Flip Electronics

USA . 5 parts In-Stock

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5

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Cogito LLC

Ukraine . 5 parts In-Stock

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5

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Fibra_Brandt Electronic GMBH

Germany . 4 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 530 parts In-Stock

1+ parts

$4.004

100+ parts

-

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530

$4.004

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Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$6.619

100+ parts

$6.023

1k+ parts

$5.428

10k+ parts

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15

$6.619

$6.023

$5.428

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Semicontronic

India . 507 parts In-Stock

1+ parts

$38.600

100+ parts

$37.635

1k+ parts

$37.442

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507

$38.600

$37.635

$37.442

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Corphita

USA . 494 parts In-Stock

1+ parts

$38.700

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494

$38.700

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Modulus Dynamics

Lithuania . 882 parts In-Stock

1+ parts

$57.088

100+ parts

$54.804

1k+ parts

$52.521

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882

$57.088

$54.804

$52.521

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Corohmni

South Africa . 58 parts In-Stock

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$57.088

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58

$57.088

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Continental Prestige Electronics

USA . 5,436 parts In-Stock

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$59.831

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$58.635

5,436

$59.831

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$58.635

Ampacity Inc.

Singapore . 504 parts In-Stock

1+ parts

$84.010

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504

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QUARKTWIN TECHNOLOGY LTD

USA . 23,460 parts In-Stock

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Microchip USA

USA . 6,972 parts In-Stock

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Argo Parts USA

USA . 2,192 parts In-Stock

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Alle Elektronik GmbH

Germany . 2,082 parts In-Stock

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2,082

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A-Z Elektronik GmbH

Germany . 1,092 parts In-Stock

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GreenTree Electronics

Israel . 960 parts In-Stock

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960

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Perfect Parts

USA . 597 parts In-Stock

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597

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Netroflash

USA . 500 parts In-Stock

1+ parts

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100+ parts

$58.635

1k+ parts

$56.840

10k+ parts

$55.643

500

-

$58.635

$56.840

$55.643

Assy Fe

Spain . 9 parts In-Stock

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9

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Overview

Unleash unparalleled performance with the CY62177EV30LL-55ZXI by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality SRAM products that guarantee reliability and efficiency. Ideal for industrial applications, this SRAM offers a seamless user experience with its 2MX16 organization and lightning-fast 55 ns maximum access time. Trust Infineon to provide cutting-edge technology that exceeds expectations and propels your projects to new heights of success. Elevate your designs with the CY62177EV30LL-55ZXI and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the SRAM, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology enables easy and efficient installation of the SRAM onto circuit boards, making it suitable for automated assembly processes.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexible and independent access to memory locations, making it suitable for applications that require fast and simultaneous data retrieval.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V ensures compatibility with standard power sources and provides stable performance.

No. of Words: 2097152 words

High word count allows for storing large amounts of data, making the SRAM suitable for applications that require extensive memory capacity.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the SRAM efficient and reliable for various applications.

Technical Specifications

SRAM CY62177EV30LL-55ZXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

55 ns

Alternate Memory Width:

8

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e3

Length:

18.4 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.000017 Amp

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

45 mA

Maximum Supply Voltage (Vsup):

3.7 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Trade Compliance

CY62177EV30LL-55ZXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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