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CY14B108M-ZSP45XI

Infineon Technologies

CY14B108M-ZSP45XI by Infineon Technologies

Infineon's CY14B108M-ZSP45XI is a 512Kx16 SRAM with 3V nominal voltage. Operating in industrial temperature range, it offers fast access time of 45ns and low standby current of 0.01Amp. Ideal for applications requiring high-speed non-volatile memory storage.

Median Price

$49.337

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 271 parts In-Stock

1+ parts

$71.770

100+ parts

$60.940

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$71.770

$60.940

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Verical

USA . 31 parts In-Stock

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$49.337

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$44.612

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$49.337

$44.612

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Rochester

USA . 11 parts In-Stock

1+ parts

-

100+ parts

$41.560

1k+ parts

$37.190

10k+ parts

$35.000

11

-

$41.560

$37.190

$35.000

Distributors (In-Stock)

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Digiode

USA . 212 parts In-Stock

1+ parts

$39.890

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212

$39.890

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$44.905

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100

$44.905

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Flip Electronics

USA . 13,176 parts In-Stock

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Chip Stock

USA . 989 parts In-Stock

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Vyrian

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,363 parts In-Stock

1+ parts

$2.245

100+ parts

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3,363

$2.245

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Corohmni

South Africa . 183 parts In-Stock

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$3.509

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183

$3.509

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Modulus Dynamics

Lithuania . 3,978 parts In-Stock

1+ parts

$5.463

100+ parts

$5.244

1k+ parts

$5.026

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-

3,978

$5.463

$5.244

$5.026

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AZTECH Wire

Italy . 215 parts In-Stock

1+ parts

$9.622

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215

$9.622

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Ampacity Inc.

Singapore . 50 parts In-Stock

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$35.690

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50

$35.690

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Semicontronic

India . 50 parts In-Stock

1+ parts

$35.690

100+ parts

$34.798

1k+ parts

$34.619

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50

$35.690

$34.798

$34.619

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Corphita

USA . 354 parts In-Stock

1+ parts

$37.791

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354

$37.791

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Continental Prestige Electronics

USA . 1,008 parts In-Stock

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$44.905

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$44.007

1,008

$44.905

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$44.007

Netroflash

USA . 100 parts In-Stock

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$44.905

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$44.007

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100

$44.905

$44.007

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Component Stockers USA

USA . 240 parts In-Stock

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$520.520

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$520.520

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Lixinc

USA . 12,025 parts In-Stock

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12,025

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Argo Parts USA

USA . 1,519 parts In-Stock

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RC Electronics

USA . 1,438 parts In-Stock

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$17.120

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$15.620

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$15.150

1,438

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$17.120

$15.620

$15.150

Perfect Parts

USA . 54 parts In-Stock

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ChipstoGo Electronic ltd

UK . 10 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the CY14B108M-ZSP45XI by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies ensures top-notch quality and innovation in every product. This SRAM device offers seamless integration into various applications, providing customers with exceptional value and benefits. Trust in the superior technology of Infineon Technologies to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving time and effort.

No. of Functions: 1

With a single function, this product is straightforward and easy to use, perfect for basic memory storage needs.

Package Shape: RECTANGULAR

The rectangular package shape maximizes space efficiency on the circuit board, making it a practical choice for compact designs.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode ensures reliable performance and seamless integration with different systems.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal voltage of 3V ensures stable and efficient power delivery, optimizing overall performance.

Power Supplies (V): 3/3.3

The multiple power supply options provide flexibility in voltage requirements, accommodating a range of system configurations.

No. of Terminals: 54

With 54 terminals, this product offers ample connectivity options for versatile integration within various electronic devices.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile package style save space on the circuit board, making it suitable for compact designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in challenging environmental conditions.

Organization: 512KX16

The 512KX16 organization provides a balanced memory configuration, suitable for a wide range of data storage applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance in extreme cold environments without compromising functionality.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers excellent solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position enhances connectivity options and facilitates efficient installation within different system layouts.

Maximum Seated Height: 1.2 mm

The low maximum seated height minimizes space requirements, making it ideal for slim electronic devices.

Width: 10.16 mm

The compact 10.16mm width allows for versatile placement on the circuit board, optimizing layout flexibility.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage of 2.7V ensures compatibility with a wide range of power sources for versatile use.

Maximum Time At Peak Reflow Temperature (s): 20

The maximum time at peak reflow temperature of 20 seconds ensures safe and efficient soldering during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C enables secure solder joints and reliable connections for long-term usage.

Length: 22.415 mm

The 22.415mm length strikes a balance between compact size and functional design, suitable for various electronic applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments with consistent performance.

Technology: CMOS

CMOS technology offers low power consumption and high-speed processing, making it an energy-efficient and reliable choice.

Parallel or Serial: PARALLEL

Operating in parallel mode provides fast data transfer speeds and efficient memory access for seamless performance.

Terminal Form: GULL WING

Gull wing terminal form simplifies installation and enhances solder joint integrity, ensuring stable connections.

Maximum Supply Current: 57 mA

The maximum supply current of 57mA ensures efficient power consumption, making it suitable for energy-conscious applications.

No. of Words: 524288 words

With 524,288 words capacity, this product offers ample memory storage for data-intensive applications.

Memory Width: 16

The 16-bit memory width provides sufficient data handling capability for diverse computing tasks, ensuring efficient operation.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch allows for precise alignment and secure connections, promoting reliability in circuit board integration.

No. of Words Code: 512K

The 512K words code simplifies memory addressing and management, ensuring easy configuration and optimization.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, making this product suitable for controlled environmental conditions.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V provides a safety margin for voltage fluctuations, ensuring stable performance over time.

Memory Density: 8388608 bit

With a memory density of 8,388,608 bits, this product offers ample storage capacity for data-intensive applications.

Memory IC Type: NON-VOLATILE SRAM

Non-volatile SRAM technology retains data even without power, ensuring data integrity and persistence in critical applications.

Maximum Standby Current: 0.01 Amp

The low maximum standby current of 0.01A minimizes power consumption in standby mode, saving energy and prolonging battery life.

Maximum Access Time: 45 ns

The fast maximum access time of 45ns ensures quick data retrieval and processing, enhancing system performance and responsiveness.

Technical Specifications

SRAM CY14B108M-ZSP45XI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e3

Length:

22.415 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

54

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP54,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.01 Amp

Sub-Category:

SRAMs

Maximum Supply Current:

57 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

10.16 mm

Trade Compliance

CY14B108M-ZSP45XI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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