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CY14B101LA-SZ45XIT

Infineon Technologies

CY14B101LA-SZ45XIT by Infineon Technologies

Infineon Technologies' CY14B101LA-SZ45XIT is a 128Kx8 SRAM with 3V nominal voltage. Operating in industrial temperature range, it offers fast access time of 45ns and low standby current of 0.005A. Ideal for applications requiring high-speed data storage in compact designs.

Median Price

$21.270

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 25,340 parts In-Stock

1+ parts

-

100+ parts

$21.270

1k+ parts

$19.030

10k+ parts

$17.910

25,340

-

$21.270

$19.030

$17.910

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 299 parts In-Stock

1+ parts

$22.515

100+ parts

-

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299

$22.515

-

-

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Flip Electronics

USA . 26,000 parts In-Stock

1+ parts

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26,000

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Vyrian

USA . 25,715 parts In-Stock

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25,715

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Chip Stock

USA . 11,500 parts In-Stock

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11,500

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 4,707 parts In-Stock

1+ parts

$2.372

100+ parts

-

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-

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-

4,707

$2.372

-

-

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Modulus Dynamics

Lithuania . 6,243 parts In-Stock

1+ parts

$3.036

100+ parts

$2.915

1k+ parts

$2.793

10k+ parts

-

6,243

$3.036

$2.915

$2.793

-

Corohmni

South Africa . 483 parts In-Stock

1+ parts

$3.882

100+ parts

-

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-

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483

$3.882

-

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$5.767

100+ parts

$5.248

1k+ parts

$4.729

10k+ parts

-

1,000

$5.767

$5.248

$4.729

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Ampacity Inc.

Singapore . 25,990 parts In-Stock

1+ parts

$20.140

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25,990

$20.140

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Semicontronic

India . 25,846 parts In-Stock

1+ parts

$20.140

100+ parts

$19.636

1k+ parts

$19.536

10k+ parts

-

25,846

$20.140

$19.636

$19.536

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Corphita

USA . 796 parts In-Stock

1+ parts

$21.330

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796

$21.330

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Component Stockers USA

USA . 443 parts In-Stock

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$99.990

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443

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 27,177 parts In-Stock

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27,177

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Lixinc

USA . 10,822 parts In-Stock

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Futuretech Components

Singapore . 5,853 parts In-Stock

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5,853

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A-Z Elektronik GmbH

Germany . 5,109 parts In-Stock

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Continental Prestige Electronics

USA . 4,526 parts In-Stock

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4,526

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Perfect Parts

USA . 4,480 parts In-Stock

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4,480

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Alle Elektronik GmbH

Germany . 3,406 parts In-Stock

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3,406

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Argo Parts USA

USA . 2,727 parts In-Stock

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2,727

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GreenTree Electronics

Israel . 2,611 parts In-Stock

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Metaverse IC Inc.

Canada . 607 parts In-Stock

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Microchip USA

USA . 338 parts In-Stock

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338

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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iodParts Technologies Inc.

India . 9 parts In-Stock

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9

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Overview

Experience seamless performance and reliability with the CY14B101LA-SZ45XIT from Infineon Technologies, a leader in innovative semiconductor solutions. This SRAM device offers unmatched quality and efficiency, making it ideal for a wide range of applications. Whether you're looking to enhance the performance of your industrial equipment or boost the capabilities of your automotive systems, this product delivers exceptional value and benefits. Trust in the expertise of Infineon Technologies to provide you with cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring reliable performance.

Surface Mount: YES

Enables easy and secure installation on circuit boards.

Operating Mode: ASYNCHRONOUS

Allows for independent operation without the need for synchronization signals.

Nominal Supply Voltage / Vsup (V): 3

Compatible with common power supply standards, making it easy to integrate into existing systems.

Memory IC Type: NON-VOLATILE SRAM

Combines the speed of SRAM with the non-volatile nature of flash memory, ideal for applications requiring fast access times and data retention during power loss.

Technical Specifications

SRAM CY14B101LA-SZ45XIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

20.726 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP32,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.54 mm

Maximum Standby Current:

.005 Amp

Sub-Category:

SRAMs

Maximum Supply Current:

52 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

7.5 mm

Trade Compliance

CY14B101LA-SZ45XIT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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