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CY62167EV30LL-45BVI

Infineon Technologies

CY62167EV30LL-45BVI by Infineon Technologies

Infineon's CY62167EV30LL-45BVI is a 1MX16 SRAM with 3.6V max supply voltage, 45ns access time, and 1048576 words capacity. It operates in industrial temperatures and features a very thin profile grid array package for common asynchronous applications.

Median Price

$19.465

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 4,282 parts In-Stock

1+ parts

$17.930

100+ parts

$17.340

1k+ parts

$17.070

10k+ parts

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4,282

$17.930

$17.340

$17.070

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Flip Electronics (Authorized)

USA . 8,056 parts In-Stock

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8,056

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DigiKey

USA . 6,172 parts In-Stock

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$21.000

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6,172

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$21.000

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 982 parts In-Stock

1+ parts

$10.326

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982

$10.326

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$10.800

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10

$10.800

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Flip Electronics

USA . 34,296 parts In-Stock

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34,296

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Vyrian

USA . 7,296 parts In-Stock

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7,296

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Semtec, LLC

USA . 7 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,204 parts In-Stock

1+ parts

$4.812

100+ parts

-

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3,204

$4.812

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Corohmni

South Africa . 562 parts In-Stock

1+ parts

$5.182

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562

$5.182

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Modulus Dynamics

Lithuania . 5,404 parts In-Stock

1+ parts

$5.821

100+ parts

$5.588

1k+ parts

$5.355

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-

5,404

$5.821

$5.588

$5.355

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Semicontronic

India . 7,575 parts In-Stock

1+ parts

$9.240

100+ parts

$9.009

1k+ parts

$8.963

10k+ parts

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7,575

$9.240

$9.009

$8.963

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Ampacity Inc.

Singapore . 7,444 parts In-Stock

1+ parts

$9.240

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7,444

$9.240

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Corphita

USA . 914 parts In-Stock

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$9.783

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914

$9.783

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Continental Prestige Electronics

USA . 2,583 parts In-Stock

1+ parts

$10.800

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$10.584

2,583

$10.800

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-

$10.584

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$10.800

100+ parts

$10.584

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1,000

$10.800

$10.584

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QUARKTWIN TECHNOLOGY LTD

USA . 5,957 parts In-Stock

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5,957

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A-Z Elektronik GmbH

Germany . 4,997 parts In-Stock

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4,997

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Alle Elektronik GmbH

Germany . 3,331 parts In-Stock

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3,331

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Argo Parts USA

USA . 1,183 parts In-Stock

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Kepictronics

USA . 200 parts In-Stock

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200

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Perfect Parts

USA . 106 parts In-Stock

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106

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Overview

Elevate your electronics with the CY62167EV30LL-45BVI by Infineon Technologies, a top-tier manufacturer known for exceptional quality. This SRAM device offers unrivaled performance and reliability in various applications. Experience seamless operation and faster data access with this product, providing customers with unparalleled value and benefits. Say goodbye to slow response times and hello to efficient data processing with this advanced memory solution. Upgrade your devices today with the CY62167EV30LL-45BVI and elevate your technology to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection to the internal components of the product, making it long-lasting and reliable.

Surface Mount: YES

Surface mount technology allows for easier and more efficient installation on circuit boards, saving space and facilitating mass production.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables independent and simultaneous access to memory locations, increasing overall system performance.

Nominal Supply Voltage / Vsup: 3V

Stable supply voltage of 3V ensures consistent and reliable operation of the SRAM module.

Memory IC Type: STANDARD SRAM

Standard SRAM technology is proven to provide fast and efficient data storage and retrieval, making the product suitable for various applications.

Technical Specifications

SRAM CY62167EV30LL-45BVI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Additional Features:

IT ALSO OPERATES AT 2.2V TO 3.6V

Alternate Memory Width:

8

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e0

Length:

8 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

6 mm

Trade Compliance

CY62167EV30LL-45BVI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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