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CY14B104NA-BA25XI

Infineon Technologies

CY14B104NA-BA25XI by Infineon Technologies

Infineon's CY14B104NA-BA25XI is a 256Kx16 SRAM with 3V nominal voltage, operating in industrial temperature range. It features asynchronous mode, 25ns access time, and non-volatile memory IC type. Ideal for applications requiring fast parallel memory access in compact electronic devices.

Median Price

$48.185

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 17 parts In-Stock

1+ parts

$31.870

100+ parts

$27.800

1k+ parts

-

10k+ parts

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17

$31.870

$27.800

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Newark

USA . 25 parts In-Stock

1+ parts

$46.970

100+ parts

$39.940

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-

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25

$46.970

$39.940

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Chip1Stop

Japan . 294 parts In-Stock

1+ parts

$49.400

100+ parts

-

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294

$49.400

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Mouser Electronics

USA . 340 parts In-Stock

1+ parts

$49.570

100+ parts

$42.150

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-

10k+ parts

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340

$49.570

$42.150

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DigiKey

USA . 289 parts In-Stock

1+ parts

$49.570

100+ parts

$42.148

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-

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289

$49.570

$42.148

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Element14

Singapore . 17 parts In-Stock

1+ parts

$65.930

100+ parts

$56.070

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-

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17

$65.930

$56.070

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Rochester

USA . 211 parts In-Stock

1+ parts

-

100+ parts

$28.370

1k+ parts

$25.380

10k+ parts

$23.890

211

-

$28.370

$25.380

$23.890

Verical

USA . 184 parts In-Stock

1+ parts

-

100+ parts

$35.462

1k+ parts

$31.725

10k+ parts

$29.863

184

-

$35.462

$31.725

$29.863

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 854 parts In-Stock

1+ parts

$29.954

100+ parts

-

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854

$29.954

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Bristol Electronics

USA . 5 parts In-Stock

1+ parts

$31.891

100+ parts

-

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5

$31.891

-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$39.728

100+ parts

-

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50

$39.728

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-

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IBS Electronics

USA . 897 parts In-Stock

1+ parts

-

100+ parts

-

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$36.439

10k+ parts

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897

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-

$36.439

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Vyrian

USA . 437 parts In-Stock

1+ parts

-

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437

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ACDS - Activité Composants Distribution Service

France . 5 parts In-Stock

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5

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Dan-Mar Components

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 673 parts In-Stock

1+ parts

$2.389

100+ parts

$2.293

1k+ parts

$2.198

10k+ parts

-

673

$2.389

$2.293

$2.198

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Corohmni

South Africa . 133 parts In-Stock

1+ parts

$2.472

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-

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133

$2.472

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Aztec Data Supply Inc.

USA . 4,385 parts In-Stock

1+ parts

$5.175

100+ parts

-

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4,385

$5.175

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Semicontronic

India . 363 parts In-Stock

1+ parts

$26.800

100+ parts

$26.130

1k+ parts

$25.996

10k+ parts

-

363

$26.800

$26.130

$25.996

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Ampacity Inc.

Singapore . 218 parts In-Stock

1+ parts

$26.800

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-

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218

$26.800

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Corphita

USA . 559 parts In-Stock

1+ parts

$28.377

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559

$28.377

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Component Stockers USA

USA . 531 parts In-Stock

1+ parts

$32.750

100+ parts

$30.330

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531

$32.750

$30.330

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Continental Prestige Electronics

USA . 2,171 parts In-Stock

1+ parts

$39.728

100+ parts

-

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$38.933

2,171

$39.728

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$38.933

Microchip USA

USA . 1,373 parts In-Stock

1+ parts

$99.475

100+ parts

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1,373

$99.475

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Argo Parts USA

USA . 4,482 parts In-Stock

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4,482

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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3,700

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iodParts Technologies Inc.

India . 2,874 parts In-Stock

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2,874

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Kepictronics

USA . 104 parts In-Stock

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104

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Perfect Parts

USA . 12 parts In-Stock

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12

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Overview

Enhance your electronic devices with the CY14B104NA-BA25XI by Infineon Technologies, a high-quality SRAM that offers reliable performance and durability. Infineon Technologies is a trusted manufacturer known for its innovative solutions in the technology industry. This versatile component is perfect for a wide range of applications, providing customers with seamless integration and enhanced functionality. Upgrade your products with the value, benefits, and advantages that this cutting-edge SRAM has to offer. Elevate your designs with the CY14B104NA-BA25XI and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-term reliability.

Nominal Supply Voltage / Vsup (V): 3

Compatible with common supply voltages, making it easy to integrate into existing systems.

Operating Mode: ASYNCHRONOUS

Allows for flexible and independent operation of the memory, increasing efficiency and performance.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications where heat may be a concern.

Technology: CMOS

Utilizes low power consumption and offers high noise immunity, enhancing overall performance.

Technical Specifications

SRAM CY14B104NA-BA25XI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

25 ns

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

10 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.005 Amp

Sub-Category:

SRAMs

Maximum Supply Current:

70 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

6 mm

Trade Compliance

CY14B104NA-BA25XI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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