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CY7C1051DV33-10ZSXIT

Infineon Technologies

CY7C1051DV33-10ZSXIT by Infineon Technologies

CY7C1051DV33-10ZSXIT by Infineon Technologies is a 512Kx16 SRAM with 3.3V supply, operating at -40 to 85°C. It features asynchronous mode, 10ns access time, and 44 terminals in a small outline package. Ideal for industrial applications requiring fast and reliable memory performance.

Median Price

$18.480

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 111,278 parts In-Stock

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DigiKey

USA . 13,442 parts In-Stock

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$16.000

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Verical

USA . 12,067 parts In-Stock

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$18.480

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$18.480

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Rochester

USA . 11,534 parts In-Stock

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$24.940

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$22.310

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$21.000

11,534

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$24.940

$22.310

$21.000

Distributors (In-Stock)

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Digiode

USA . 393 parts In-Stock

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$26.391

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393

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Vyrian

USA . 42,194 parts In-Stock

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USA . 16,854 parts In-Stock

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Chip Stock

USA . 9,710 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,797 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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Aztec Data Supply Inc.

USA . 78 parts In-Stock

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$2.283

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78

$2.283

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Modulus Dynamics

Lithuania . 2,439 parts In-Stock

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$2.773

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$2.662

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$2.551

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2,439

$2.773

$2.662

$2.551

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Corohmni

South Africa . 9 parts In-Stock

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$2.942

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Ampacity Inc.

Singapore . 42,057 parts In-Stock

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$13.600

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Corphita

USA . 62 parts In-Stock

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$25.002

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62

$25.002

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Semicontronic

India . 41,704 parts In-Stock

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$29.600

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$28.860

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$28.712

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41,704

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$28.860

$28.712

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Lixinc

USA . 10,624 parts In-Stock

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Futuretech Components

Singapore . 10,000 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 4,760 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,173 parts In-Stock

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Perfect Parts

USA . 1,196 parts In-Stock

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iodParts Technologies Inc.

India . 983 parts In-Stock

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Continental Prestige Electronics

USA . 726 parts In-Stock

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Kepictronics

USA . 500 parts In-Stock

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Argo Parts USA

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Microchip USA

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Bastille Electronics

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Overview

Experience unparalleled quality and reliability with the CY7C1051DV33-10ZSXIT by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies offers top-of-the-line SRAM products that are perfect for a wide range of applications. From industrial to consumer electronics, this SRAM memory device provides exceptional value, benefits, and advantages to customers looking for high-performance solutions. Trust in Infineon Technologies to deliver cutting-edge technology that exceeds expectations and helps you stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and resilience, making this product suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, saving space and simplifying the manufacturing process.

Operating Mode: ASYNCHRONOUS

Asynchronous operation provides flexibility and dynamic performance, making this SRAM suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V offers energy efficiency and compatibility with standard power sources.

No. of Terminals: 44

44 terminals allow for versatile connectivity options and support complex data transfer requirements.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance in demanding industrial environments.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable operation, making this SRAM a cost-effective and efficient choice.

Maximum Access Time: 10 ns

Fast access time of 10 ns ensures quick data retrieval and processing, suitable for high-performance computing applications.

Technical Specifications

SRAM CY7C1051DV33-10ZSXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

10 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3

Length:

18.415 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.194 mm

Maximum Standby Current:

.02 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

110 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10.16 mm

Trade Compliance

CY7C1051DV33-10ZSXIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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