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CY14V101QS-SF108XI

Infineon Technologies

CY14V101QS-SF108XI by Infineon Technologies

Infineon's CY14V101QS-SF108XI is a 128Kx8 SRAM with synchronous operation and 3V nominal voltage. Ideal for industrial applications, it offers non-volatile memory, GULL WING terminals, and operates in serial mode.

Median Price

$13.290

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 28 parts In-Stock

1+ parts

$5.640

100+ parts

-

1k+ parts

-

10k+ parts

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28

$5.640

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-

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Element14

Singapore . 28 parts In-Stock

1+ parts

$13.290

100+ parts

-

1k+ parts

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10k+ parts

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28

$13.290

-

-

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Chip1Stop

Japan . 101 parts In-Stock

1+ parts

$18.300

100+ parts

-

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101

$18.300

-

-

-

DigiKey

USA . 410 parts In-Stock

1+ parts

$18.360

100+ parts

$15.743

1k+ parts

$14.740

10k+ parts

-

410

$18.360

$15.743

$14.740

-

Mouser Electronics

USA . 246 parts In-Stock

1+ parts

$20.210

100+ parts

$17.290

1k+ parts

$16.300

10k+ parts

-

246

$20.210

$17.290

$16.300

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Flip Electronics (Authorized)

USA . 27,758 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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27,758

-

-

-

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Verical

USA . 4,410 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.512

10k+ parts

-

4,410

-

-

$8.512

-

Rochester

USA . 1,453 parts In-Stock

1+ parts

-

100+ parts

$11.120

1k+ parts

$9.950

10k+ parts

$9.370

1,453

-

$11.120

$9.950

$9.370

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 270 parts In-Stock

1+ parts

$8.484

100+ parts

-

1k+ parts

-

10k+ parts

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270

$8.484

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$10.324

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$10.324

-

-

-

Bristol Electronics

USA . 22 parts In-Stock

1+ parts

$15.600

100+ parts

-

1k+ parts

-

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22

$15.600

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Flip Electronics

USA . 24,758 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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24,758

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-

-

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Chip Stock

USA . 5,993 parts In-Stock

1+ parts

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5,993

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Vyrian

USA . 5,637 parts In-Stock

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5,637

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-

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DigiKey Marketplace

USA . 158 parts In-Stock

1+ parts

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158

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GLYN GmbH & Co. KG

Germany . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 5,933 parts In-Stock

1+ parts

$2.537

100+ parts

$2.436

1k+ parts

$2.334

10k+ parts

-

5,933

$2.537

$2.436

$2.334

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Ampacity Inc.

Singapore . 5,741 parts In-Stock

1+ parts

$7.900

100+ parts

-

1k+ parts

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10k+ parts

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5,741

$7.900

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Corphita

USA . 229 parts In-Stock

1+ parts

$8.037

100+ parts

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1k+ parts

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10k+ parts

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229

$8.037

-

-

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Continental Prestige Electronics

USA . 6,786 parts In-Stock

1+ parts

$10.324

100+ parts

-

1k+ parts

-

10k+ parts

$10.117

6,786

$10.324

-

-

$10.117

Component Stockers USA

USA . 930 parts In-Stock

1+ parts

$14.370

100+ parts

$11.360

1k+ parts

-

10k+ parts

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930

$14.370

$11.360

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Argo Parts USA

USA . 2,228 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,228

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-

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$10.117

1k+ parts

$9.808

10k+ parts

$9.601

500

-

$10.117

$9.808

$9.601

Overview

Unlock the power of reliable and high-quality memory solutions with the CY14V101QS-SF108XI by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies brings you a cutting-edge SRAM product that is perfect for a wide range of applications. With its synchronous operation and small outline package style, this memory device offers exceptional performance and versatility. Experience the benefits of fast data access, low power consumption, and industrial-grade reliability with the CY14V101QS-SF108XI. Upgrade your systems today and discover the value that this innovative product can bring to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection to the internal components of the product.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards, saving space and improving overall reliability.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and coordination between different components in the system, resulting in optimized performance.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V provides a good balance between power consumption and performance for various applications.

No. of Terminals: 16

Having 16 terminals allows for a more stable and secure connection within the circuit, reducing the chances of loose connections or signal interference.

Maximum Operating Temperature: 85 °C

Being able to operate at temperatures up to 85°C makes this product suitable for industrial environments where high temperatures are common.

Organization: 128KX8

The 128Kx8 organization provides a good balance between memory capacity and data access speed, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can also function reliably in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures excellent conductivity and resistance to corrosion, enhancing the product's overall reliability and longevity.

Maximum Seated Height: 2.667 mm

Having a maximum seated height of 2.667mm allows for easy integration into compact devices and systems with limited space.

Width: 7.4925 mm

The compact width of 7.4925mm allows for efficient placement of the product on circuit boards, enabling optimized layout design.

Minimum Supply Voltage (Vsup): 2.7 V

Operating at a minimum supply voltage of 2.7V ensures compatibility with a wide range of power sources while maintaining stable performance.

Parallel or Serial: SERIAL

Serial communication allows for efficient data transfer and simplified wiring, making the product suitable for applications requiring streamlined connectivity.

Terminal Form: GULL WING

The gull wing terminal form provides secure mounting and easy soldering onto circuit boards, ensuring reliable connections and signal integrity.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product can withstand moderate exposure to moisture during storage or operation without compromising performance.

Technical Specifications

SRAM CY14V101QS-SF108XI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2865 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.667 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.4925 mm

Trade Compliance

CY14V101QS-SF108XI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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