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CY14E256LA-SZ45XI

Infineon Technologies

CY14E256LA-SZ45XI by Infineon Technologies

Infineon's CY14E256LA-SZ45XI is a 32Kx8 SRAM with 3-STATE output, operating at 5V. It features a small outline package and industrial temperature grade, suitable for applications requiring fast access times like industrial automation and networking equipment.

Median Price

$16.580

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 23 parts In-Stock

1+ parts

$16.300

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23

$16.300

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Rochester

USA . 1 parts In-Stock

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$16.860

100+ parts

$15.850

1k+ parts

$14.330

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-

1

$16.860

$15.850

$14.330

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Distributors (In-Stock)

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Digiode

USA . 87 parts In-Stock

1+ parts

$15.485

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87

$15.485

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Nova Conductors

Japan . 88 parts In-Stock

1+ parts

$20.788

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88

$20.788

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Flip Electronics

USA . 5,610 parts In-Stock

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5,610

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Chip Stock

USA . 2,820 parts In-Stock

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2,820

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ACDS - Activité Composants Distribution Service

France . 22 parts In-Stock

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Vyrian

USA . 12 parts In-Stock

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Inventory MP

USA . 2 parts In-Stock

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Bristol Electronics

USA . 2 parts In-Stock

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2

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NAC Semi

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 258 parts In-Stock

1+ parts

$3.140

100+ parts

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258

$3.140

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Advanced Electronics

New Zealand . 62 parts In-Stock

1+ parts

$6.131

100+ parts

$5.579

1k+ parts

$5.027

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62

$6.131

$5.579

$5.027

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AZTECH Wire

Italy . 882 parts In-Stock

1+ parts

$8.654

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882

$8.654

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Ampacity Inc.

Singapore . 12 parts In-Stock

1+ parts

$13.850

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12

$13.850

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Semicontronic

India . 12 parts In-Stock

1+ parts

$13.850

100+ parts

$13.504

1k+ parts

$13.434

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12

$13.850

$13.504

$13.434

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Corphita

USA . 791 parts In-Stock

1+ parts

$14.670

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791

$14.670

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Modulus Dynamics

Lithuania . 1,345 parts In-Stock

1+ parts

$16.930

100+ parts

$16.253

1k+ parts

$15.576

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1,345

$16.930

$16.253

$15.576

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Corohmni

South Africa . 238 parts In-Stock

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$16.930

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238

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Continental Prestige Electronics

USA . 2,323 parts In-Stock

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$20.788

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$20.372

2,323

$20.788

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$20.372

Netroflash

USA . 500 parts In-Stock

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$20.788

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$19.749

10k+ parts

$19.333

500

$20.788

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$19.749

$19.333

Microchip USA

USA . 2,273 parts In-Stock

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$50.853

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2,273

$50.853

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,970 parts In-Stock

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4,970

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Perfect Parts

USA . 3,328 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,313 parts In-Stock

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Kepictronics

USA . 1,562 parts In-Stock

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Argo Parts USA

USA . 1,303 parts In-Stock

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iodParts Technologies Inc.

India . 350 parts In-Stock

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350

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Overview

Experience unparalleled performance and reliability with the CY14E256LA-SZ45XI by Infineon Technologies, a leading manufacturer in the industry. As a cutting-edge SRAM product, this memory device offers seamless operation in various applications with its common input/output type, asynchronous operating mode, and 32Kx8 organization. Enjoy the benefits of a small outline package design, 3-state output characteristics, and a wide temperature range, perfect for industrial use. Trust in Infineon's expertise to deliver high-quality solutions that exceed expectations. Unlock the power of innovation and efficiency with the CY14E256LA-SZ45XI.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components.

Surface Mount: YES

Easy to integrate onto circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage supply for easy compatibility with other components.

Organization: 32KX8

Optimal organization for storing and accessing data efficiently.

Output Enable: YES

Allows for the control of output data, enhancing flexibility in operations.

Technical Specifications

SRAM CY14E256LA-SZ45XI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

20.726 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

32

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP32,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.54 mm

Maximum Standby Current:

.008 Amp

Minimum Standby Voltage:

4.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

52 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

7.505 mm

Trade Compliance

CY14E256LA-SZ45XI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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