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IS62WV51216BLL-55TLI

Integrated Silicon Solution

IS62WV51216BLL-55TLI by Integrated Silicon Solution

IS62WV51216BLL-55TLI by Integrated Silicon Solution is a 512Kx16 SRAM with 55ns access time, operating at 3.3V. It features asynchronous mode, 44 terminals in small outline package, and industrial temperature grade. Ideal for applications requiring fast and reliable memory storage in harsh environments.

Median Price

$9.116

Lifecycle Status

Suppliers In-Stock

25

In-Stock Inventory

1k+

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Verical

USA . 580 parts In-Stock

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$8.303

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$7.447

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Chip1Stop

Japan . 135 parts In-Stock

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$9.080

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$6.260

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Arrow

USA . 119 parts In-Stock

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$9.102

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$7.804

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Newark

USA . 98 parts In-Stock

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$9.130

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$6.530

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$5.290

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$9.130

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DigiKey

USA . 135 parts In-Stock

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$9.610

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$8.454

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$7.759

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$7.563

135

$9.610

$8.454

$7.759

$7.563

Mouser Electronics

USA . 1,932 parts In-Stock

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$9.980

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$8.570

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Element14

Singapore . 98 parts In-Stock

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$11.320

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RS (Exports)

UK . 755 parts In-Stock

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Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

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$6.425

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$6.425

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TME

Poland . 2,527 parts In-Stock

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$8.470

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$7.310

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$6.960

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Chip Stock

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Component Sense

UK . 4,366 parts In-Stock

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ComSIT Distribution GmbH

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ComSIT USA

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Vyrian

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EMSNET

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Cyclops Electronics Ltd

UK . 510 parts In-Stock

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LWI Electronics Inc

India . 138 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 131 parts In-Stock

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RLX Solution Inc.

Canada . 68 parts In-Stock

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Bristol Electronics

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Sensible Micro Corp

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Classic Components Corporation

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Corel Iberica Componentes, S.L.

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NAC Semi

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Aztec Data Supply Inc.

USA . 1,634 parts In-Stock

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$4.960

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Corohmni

South Africa . 298 parts In-Stock

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$5.684

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Continental Prestige Electronics

USA . 1,606 parts In-Stock

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$6.425

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$6.297

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Perfect Parts

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Formix International (Excess)

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Kepictronics

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RC Electronics

USA . 6,261 parts In-Stock

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$6.380

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$5.820

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$5.640

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$5.640

Futuretech Components

Singapore . 5,400 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

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Lixinc

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S.R.D Solutions

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GreenTree Electronics

Israel . 485 parts In-Stock

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Computer Components Inc. - USA

USA . 478 parts In-Stock

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iodParts Technologies Inc.

India . 316 parts In-Stock

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Infinite Electronics LLP (Excess)

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Speed Components Ltd (Excess)

Israel . 83 parts In-Stock

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Eastek

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Overview

Experience unparalleled speed and reliability with the IS62WV51216BLL-55TLI by Integrated Silicon Solution. This high-quality SRAM offers a seamless performance in various applications, thanks to its innovative design and advanced technology. With a wide operating temperature range and low power consumption, this memory IC is a game-changer for your projects. Trust ISS to deliver cutting-edge solutions that exceed your expectations and elevate your experience. Elevate your projects with the IS62WV51216BLL-55TLI.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures the package will withstand environmental conditions, making it a reliable choice for various applications.

Surface Mount: YES

Easily mountable on PCBs, saving space and facilitating efficient assembly processes.

Nominal Supply Voltage / Vsup (V): 3

Operates at a common voltage level, ensuring compatibility with other components in the system.

Operating Mode: ASYNCHRONOUS

Provides flexibility in data transfer operations, allowing for independent control of read and write operations.

Maximum Operating Temperature: 85 °C

Can function reliably in a wide range of temperature conditions, suitable for industrial environments.

Technical Specifications

SRAM IS62WV51216BLL-55TLI attributes and parameters. Explore more SRAM devices from Integrated Silicon Solution

Specs

Maximum Access Time:

55 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3

Length:

18.415 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.00002 Amp

Minimum Standby Voltage:

1.2 V

Sub-Category:

SRAMs

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

IS62WV51216BLL-55TLI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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