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IS62WV25616BLL-55TLI-TR

Integrated Silicon Solution

IS62WV25616BLL-55TLI-TR by Integrated Silicon Solution

IS62WV25616BLL-55TLI-TR by Integrated Silicon Solution is a 256Kx16 SRAM with 55ns access time, operating in industrial temperature range. It features parallel interface, CMOS technology, and operates at supply voltage b/w 2.5V to 3.6V. Ideal for applications requiring fast and reliable memory storage in compact electronic devices.

Median Price

$4.833

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,292 parts In-Stock

1+ parts

$4.640

100+ parts

$4.005

1k+ parts

$3.687

10k+ parts

$3.594

1,292

$4.640

$4.005

$3.687

$3.594

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.026

10k+ parts

$4.158

1,000

-

-

$5.026

$4.158

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 67 parts In-Stock

1+ parts

$3.021

100+ parts

-

1k+ parts

-

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67

$3.021

-

-

-

Chip Stock

USA . 42,300 parts In-Stock

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42,300

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ComSIT Distribution GmbH

Germany . 20,171 parts In-Stock

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20,171

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Vyrian

USA . 923 parts In-Stock

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923

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,403 parts In-Stock

1+ parts

$3.021

100+ parts

-

1k+ parts

-

10k+ parts

$2.960

4,403

$3.021

-

-

$2.960

Argo Parts USA

USA . 1,224 parts In-Stock

1+ parts

$3.021

100+ parts

-

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1,224

$3.021

-

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Bastille Electronics

Australia . 800 parts In-Stock

1+ parts

$3.021

100+ parts

$2.870

1k+ parts

$2.726

10k+ parts

$2.689

800

$3.021

$2.870

$2.726

$2.689

Component Stockers USA

USA . 1,283 parts In-Stock

1+ parts

$3.940

100+ parts

$3.120

1k+ parts

$2.850

10k+ parts

-

1,283

$3.940

$3.120

$2.850

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Perfect Parts

USA . 4,581 parts In-Stock

1+ parts

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4,581

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Futuretech Components

Singapore . 869 parts In-Stock

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869

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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iodParts Technologies Inc.

India . 100 parts In-Stock

1+ parts

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100+ parts

$3.662

1k+ parts

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10k+ parts

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100

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$3.662

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Overview

Experience superior performance with the IS62WV25616BLL-55TLI-TR by Integrated Silicon Solution. This top-of-the-line SRAM boasts cutting-edge technology and industrial-grade materials, ensuring reliability and longevity. Perfect for a wide range of applications, this memory chip offers lightning-fast access time and a generous memory density. Trust in ISS's reputation for quality and innovation, and elevate your projects with the unbeatable value and benefits of the IS62WV25616BLL-55TLI-TR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB assembly, saving space and reducing overall product size.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexible and independent memory access, enhancing performance and versatility.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in a variety of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function in cold environments without any issues.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and excellent noise immunity, making the product efficient and reliable.

Memory IC Type: STANDARD SRAM

Standard SRAM offers fast access times, high data retention, and easy interfacing, making the product suitable for various memory-intensive applications.

Maximum Access Time: 55 ns

The fast access time ensures quick data retrieval and processing, enhancing overall system performance.

Technical Specifications

SRAM IS62WV25616BLL-55TLI-TR attributes and parameters. Explore more SRAM devices from Integrated Silicon Solution

Specs

Maximum Access Time:

55 ns

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3

Length:

18.41 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

44

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

IS62WV25616BLL-55TLI-TR Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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