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48LM01T-I/SM

Microchip Technology

48LM01T-I/SM by Microchip Technology

48LM01T-I/SM by Microchip Technology is a 128KX8 SRAM with 66 MHz clock frequency, operating at -40 to 85 °C. It features synchronous operation, 3-STATE output, and common I/O type. Ideal for industrial applications requiring high-speed memory access in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,224 parts In-Stock

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4,224

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VNN

France . 4,066 parts In-Stock

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4,066

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J2 Sourcing AB

Sweden . 3,400 parts In-Stock

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3,400

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Nova Conductors

Japan . 97 parts In-Stock

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97

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Distributors (Availability)

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Corohmni

South Africa . 1,011 parts In-Stock

1+ parts

$2.166

100+ parts

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1,011

$2.166

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Aztec Data Supply Inc.

USA . 1,193 parts In-Stock

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$2.760

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$2.760

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AZTECH Wire

Italy . 866 parts In-Stock

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$8.870

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866

$8.870

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Semicontronic

India . 1,440 parts In-Stock

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$23.000

100+ parts

$22.425

1k+ parts

$22.310

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1,440

$23.000

$22.425

$22.310

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Ampacity Inc.

Singapore . 1,241 parts In-Stock

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$26.000

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$26.000

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Microchip USA

USA . 6,523 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,234 parts In-Stock

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Argo Parts USA

USA . 4,122 parts In-Stock

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West Coast Incorporated

USA . 3,691 parts In-Stock

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Continental Prestige Electronics

USA . 1,196 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Enhance your electronic projects with the 48LM01T-I/SM by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology ensures top-notch quality and reliability in their products. With its compact design and versatile applications in SRAM category, this memory IC offers unmatched value and benefits to customers. Experience seamless performance and improved efficiency with the 48LM01T-I/SM, making it an essential component for your next project. Elevate your creations with Microchip Technology's innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for electronic components.

Surface Mount: YES

Easy to install and saves space on the PCB.

Package Shape: RECTANGULAR

Standard shape for easy integration into circuit designs.

Operating Mode: SYNCHRONOUS

Ensures data is transferred at a consistent rate, improving overall performance.

Input/Output Type: COMMON

Simplified communication between components.

No. of Terminals: 8

Optimal number of terminals for efficient connectivity.

Package Style (Meter): SMALL OUTLINE

Compact design for space-constrained applications.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with varying temperature conditions.

Organization: 128KX8

Organized memory layout for efficient data storage and retrieval.

Output Characteristics: 3-STATE

Allows for multiple output states, enhancing flexibility in data transmission.

Minimum Standby Voltage: 2.7 V

Efficient power usage in standby mode, conserving energy.

Minimum Operating Temperature: -40 °C

Suitable for harsh operating environments.

Terminal Finish: MATTE TIN

Corrosion-resistant finish for long-lasting performance.

Terminal Position: DUAL

Improved stability and connectivity.

Maximum Seated Height: 2.03 mm

Low-profile design for slim devices.

Maximum Clock Frequency (fCLK): 66 MHz

High-speed operation for faster data processing.

Width: 5.25 mm

Compact width for space-efficient PCB layout.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage requirement for energy-efficient operation.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow soldering processes.

Length: 5.26 mm

Optimal length for compact circuit designs.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with demanding temperature requirements.

Technology: CMOS

Efficient and reliable technology for memory storage.

Parallel or Serial: SERIAL

Serial communication for streamlined data transfer.

Terminal Form: GULL WING

Secure terminal form for stable connection.

Maximum Supply Current: 5 mA

Low supply current for energy-efficient operation.

No. of Words: 131072 words

High memory capacity for storing a large amount of data.

Memory Width: 8

Standard memory width for compatibility with other components.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy soldering and connection.

No. of Words Code: 128K

Identifies the memory capacity of the device.

Maximum Supply Voltage (Vsup): 3.6 V

Safe maximum supply voltage to prevent damage to the device.

Memory Density: 1048576 bit

High memory density for efficient data storage.

Memory IC Type: STANDARD SRAM

Reliable and widely-used memory IC type for various applications.

Maximum Standby Current: 0.0002 Amp

Low standby current consumption for energy efficiency.

Technical Specifications

SRAM 48LM01T-I/SM attributes and parameters. Explore more SRAM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

66 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

5.26 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Output Characteristics:

3-STATE

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.03 mm

Maximum Standby Current:

.0002 Amp

Minimum Standby Voltage:

2.7 V

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.25 mm

Trade Compliance

48LM01T-I/SM Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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