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IS66WVH8M8ALL-166B1LI

Integrated Silicon Solution

IS66WVH8M8ALL-166B1LI by Integrated Silicon Solution

IS66WVH8M8ALL-166B1LI by Integrated Silicon Solution is an 8MX8 SRAM with 67108864-bit memory density. Operating at 1.8V, it features a synchronous mode and industrial temperature grade. Ideal for applications requiring high-speed parallel memory access in compact electronic devices.

Median Price

$6.270

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,238 parts In-Stock

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$6.270

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Nova Conductors

Japan . 29 parts In-Stock

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$3.600

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Vyrian

USA . 1,625 parts In-Stock

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Bristol Electronics

USA . 6 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3 parts In-Stock

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ComSIT USA

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Corohmni

South Africa . 86 parts In-Stock

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$2.979

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Argo Parts USA

USA . 3,933 parts In-Stock

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$3.570

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Continental Prestige Electronics

USA . 2,364 parts In-Stock

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$3.570

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$3.498

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Netroflash

USA . 1,000 parts In-Stock

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$3.600

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$3.641

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$3.641

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Aztec Data Supply Inc.

USA . 240 parts In-Stock

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$4.180

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RC Electronics

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Lixinc

USA . 5,590 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Overview

Elevate your devices with the cutting-edge IS66WVH8M8ALL-166B1LI from Integrated Silicon Solution. As a leader in SRAM technology, ISS delivers top-quality memory solutions that guarantee superior performance and reliability. With its synchronous operation and industrial-grade temperature range, this grid array package offers unparalleled speed and durability for a wide range of applications. Experience seamless data processing and enhanced efficiency with the innovative features of this pseudo static RAM. Upgrade to ISS and unlock limitless possibilities for your electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material for the package body makes the product durable and lightweight, ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easier PCB assembly and more efficient use of space on the board.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures that data is transferred and processed in a synchronized manner, improving overall performance.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage of 1.8V helps in reducing power consumption, making the product more energy-efficient.

No. of Terminals: 24

Having 24 terminals provides flexibility in connecting the product to other components, allowing for various system configurations.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand harsh environmental conditions and operate reliably.

Organization: 8MX8

The 8MX8 organization allows for efficient data storage and retrieval, enhancing the overall performance of the product.

Minimum Operating Temperature: -40 °C

The product can operate at temperatures as low as -40°C, making it suitable for use in a wide range of environments.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easy integration into the PCB design and simplifies the assembly process.

Width: 6 mm

The compact width of 6mm allows for space-efficient placement on the PCB, especially in applications with size constraints.

Minimum Supply Voltage (Vsup): 1.7 V

The low minimum supply voltage of 1.7V ensures reliable operation even under low-power conditions, making the product versatile.

Length: 8 mm

The short length of 8mm further contributes to the compact design of the product, ideal for applications where space is limited.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product reliable and energy-efficient.

Terminal Pitch: 1 mm

The small terminal pitch of 1mm allows for high-density mounting on the PCB, optimizing board space and enabling more functionalities.

Maximum Supply Voltage (Vsup): 1.95 V

The maximum supply voltage of 1.95V provides a safe operating range for the product, ensuring its longevity and reliability.

Memory Density: 67108864 bit

With a high memory density of 67108864 bits, the product offers ample storage capacity for data-intensive applications.

Memory IC Type: PSEUDO STATIC RAM

The PSEUDO STATIC RAM memory IC type combines the benefits of static RAM and DRAM, offering fast access times and non-volatility.

Technical Specifications

SRAM IS66WVH8M8ALL-166B1LI attributes and parameters. Explore more SRAM devices from Integrated Silicon Solution

Specs

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

24

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Trade Compliance

IS66WVH8M8ALL-166B1LI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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