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IS66WVH8M8BLL-100B1LI

Integrated Silicon Solution

IS66WVH8M8BLL-100B1LI by Integrated Silicon Solution

IS66WVH8M8BLL-100B1LI by Integrated Silicon Solution is an 8MX8 SRAM with 100 MHz clock frequency, operating at 3.6V max. It features a thin profile grid array package and is ideal for industrial applications requiring fast access times of 40ns in synchronous mode.

Median Price

$6.270

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 726 parts In-Stock

1+ parts

$6.270

100+ parts

$5.510

1k+ parts

-

10k+ parts

-

726

$6.270

$5.510

-

-

DigiKey

USA . 513 parts In-Stock

1+ parts

$6.270

100+ parts

$5.396

1k+ parts

$4.972

10k+ parts

$4.898

513

$6.270

$5.396

$4.972

$4.898

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$3.815

100+ parts

-

1k+ parts

-

10k+ parts

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50

$3.815

-

-

-

Chip Stock

USA . 3,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,100

-

-

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Bristol Electronics

USA . 1,155 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,155

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-

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Vyrian

USA . 989 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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989

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 43,581 parts In-Stock

1+ parts

$2.640

100+ parts

-

1k+ parts

-

10k+ parts

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43,581

$2.640

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-

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Argo Parts USA

USA . 3,367 parts In-Stock

1+ parts

$3.815

100+ parts

-

1k+ parts

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10k+ parts

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3,367

$3.815

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Continental Prestige Electronics

USA . 3,131 parts In-Stock

1+ parts

$3.815

100+ parts

-

1k+ parts

-

10k+ parts

$3.739

3,131

$3.815

-

-

$3.739

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.815

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

$3.815

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Corohmni

South Africa . 172 parts In-Stock

1+ parts

$5.354

100+ parts

-

1k+ parts

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10k+ parts

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172

$5.354

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Perfect Parts

USA . 3,360 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,360

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Overview

Experience superior performance and reliability with the IS66WVH8M8BLL-100B1LI by Integrated Silicon Solution. As a leading manufacturer in the industry, ISS delivers high-quality SRAM solutions that are perfect for a wide range of applications. Whether you're looking to enhance the speed and efficiency of your system or improve overall performance, this product offers unmatched value and benefits. Trust ISS to provide cutting-edge technology and innovative solutions that meet and exceed your expectations. Elevate your projects with the IS66WVH8M8BLL-100B1LI and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to physical damage, making this product a reliable choice for various applications.

Surface Mount: YES

The surface mount feature makes it easy to integrate this product onto circuit boards, saving space and simplifying the assembly process.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures efficient data processing and communication between different components, enhancing overall system performance.

Nominal Supply Voltage / Vsup (V): 3

The 3V supply voltage allows for compatibility with a wide range of electronic devices and systems, offering flexibility in application design.

Maximum Clock Frequency (fCLK): 100 MHz

The high clock frequency of 100 MHz enables fast data transfer and processing speeds, making this product suitable for high-performance computing tasks.

Memory Density: 67108864 bit

The high memory density allows for storing a large amount of data in a compact form factor, making this product ideal for applications requiring extensive data storage.

Maximum Access Time: 40 ns

The fast access time of 40 ns ensures quick retrieval of data, reducing latency and improving system responsiveness.

Technical Specifications

SRAM IS66WVH8M8BLL-100B1LI attributes and parameters. Explore more SRAM devices from Integrated Silicon Solution

Specs

Maximum Access Time:

40 ns

Maximum Clock Frequency (fCLK):

100 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

24

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.00002 Amp

Minimum Standby Voltage:

2.7 V

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Trade Compliance

IS66WVH8M8BLL-100B1LI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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