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CY62167EV30LL-45ZXA

Infineon Technologies

CY62167EV30LL-45ZXA by Infineon Technologies

CY62167EV30LL-45ZXA by Infineon Technologies is a 1MX16 SRAM with 3.6V max supply voltage, 45ns access time, and 30mA max supply current. It's ideal for industrial applications requiring high-speed data storage in a compact package with common I/O type and asynchronous operation mode.

Median Price

$17.600

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 332 parts In-Stock

1+ parts

$17.600

100+ parts

-

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332

$17.600

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DigiKey

USA . 448 parts In-Stock

1+ parts

$17.700

100+ parts

$15.160

1k+ parts

$14.194

10k+ parts

-

448

$17.700

$15.160

$14.194

-

Mouser Electronics

USA . 258 parts In-Stock

1+ parts

$17.700

100+ parts

$14.790

1k+ parts

$14.190

10k+ parts

-

258

$17.700

$14.790

$14.190

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Rochester

USA . 1,066 parts In-Stock

1+ parts

-

100+ parts

$9.750

1k+ parts

$8.720

10k+ parts

$8.210

1,066

-

$9.750

$8.720

$8.210

Verical

USA . 887 parts In-Stock

1+ parts

-

100+ parts

$12.188

1k+ parts

$10.900

10k+ parts

$10.262

887

-

$12.188

$10.900

$10.262

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 947 parts In-Stock

1+ parts

$11.884

100+ parts

-

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947

$11.884

-

-

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Nova Conductors

Japan . 57 parts In-Stock

1+ parts

$14.644

100+ parts

-

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57

$14.644

-

-

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Chip Stock

USA . 810 parts In-Stock

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810

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Vyrian

USA . 140 parts In-Stock

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140

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Flip Electronics

USA . 15 parts In-Stock

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 2,182 parts In-Stock

1+ parts

$3.171

100+ parts

$3.044

1k+ parts

$2.917

10k+ parts

-

2,182

$3.171

$3.044

$2.917

-

Aztec Data Supply Inc.

USA . 450 parts In-Stock

1+ parts

$3.450

100+ parts

-

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450

$3.450

-

-

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Corohmni

South Africa . 78 parts In-Stock

1+ parts

$3.928

100+ parts

-

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78

$3.928

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Semicontronic

India . 521 parts In-Stock

1+ parts

$10.630

100+ parts

$10.364

1k+ parts

$10.311

10k+ parts

-

521

$10.630

$10.364

$10.311

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Ampacity Inc.

Singapore . 422 parts In-Stock

1+ parts

$10.630

100+ parts

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422

$10.630

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Corphita

USA . 49 parts In-Stock

1+ parts

$11.259

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49

$11.259

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Continental Prestige Electronics

USA . 5,909 parts In-Stock

1+ parts

$14.644

100+ parts

-

1k+ parts

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10k+ parts

$14.351

5,909

$14.644

-

-

$14.351

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$16.987

100+ parts

$15.628

1k+ parts

$14.644

10k+ parts

-

2,500

$16.987

$15.628

$14.644

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iodParts Technologies Inc.

India . 8,016 parts In-Stock

1+ parts

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8,016

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Alle Elektronik GmbH

Germany . 3,845 parts In-Stock

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3,845

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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3,700

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Microchip USA

USA . 2,452 parts In-Stock

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2,452

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Argo Parts USA

USA . 1,718 parts In-Stock

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1,718

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RC Electronics

USA . 1,325 parts In-Stock

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1,325

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ChipstoGo Electronic ltd

UK . 500 parts In-Stock

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500

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Kepictronics

USA . 60 parts In-Stock

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60

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Overview

Unlock the power of reliable data storage with the CY62167EV30LL-45ZXA by Infineon Technologies. As a leader in SRAM technology, Infineon delivers a high-quality product perfect for industrial applications. With a compact design and wide operating temperature range, this asynchronous memory solution offers exceptional performance and durability. Trust Infineon to provide the innovation and excellence you need for your projects. Choose the CY62167EV30LL-45ZXA for seamless integration and superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the body material makes this product lightweight and durable.

Surface Mount: YES

Being surface mountable makes the installation of this product easier and more efficient.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V ensures compatibility with a wide range of systems.

Operating Mode: ASYNCHRONOUS

The asynchronous operation mode allows for faster data access and processing.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity.

Maximum Access Time: 45 ns

The fast access time of 45 ns ensures quick data retrieval and processing.

Technical Specifications

SRAM CY62167EV30LL-45ZXA attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Alternate Memory Width:

8

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

18.4 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Trade Compliance

CY62167EV30LL-45ZXA Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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