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CY62148ESL-55ZAXI

Infineon Technologies

CY62148ESL-55ZAXI by Infineon Technologies

Infineon Technologies' CY62148ESL-55ZAXI is a 512KX8 SRAM with an operating mode of asynchronous and common input/output type. It has a memory density of 4Mbit and max access time of 55ns. This memory IC is suitable for industrial applications requiring fast and reliable data storage.

Median Price

$3.656

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 356 parts In-Stock

1+ parts

$3.742

100+ parts

$3.244

1k+ parts

-

10k+ parts

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356

$3.742

$3.244

-

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Chip1Stop

Japan . 860 parts In-Stock

1+ parts

$4.690

100+ parts

-

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-

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860

$4.690

-

-

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Arrow

USA . 631 parts In-Stock

1+ parts

$5.207

100+ parts

$4.095

1k+ parts

-

10k+ parts

$3.513

631

$5.207

$4.095

-

$3.513

Mouser Electronics

USA . 911 parts In-Stock

1+ parts

$5.750

100+ parts

$4.810

1k+ parts

$4.760

10k+ parts

$3.750

911

$5.750

$4.810

$4.760

$3.750

Flip Electronics (Authorized)

USA . 14,996 parts In-Stock

1+ parts

-

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14,996

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-

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DigiKey

USA . 7,880 parts In-Stock

1+ parts

-

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$2.850

10k+ parts

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7,880

-

-

$2.850

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Verical

USA . 5,535 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.290

10k+ parts

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5,535

-

-

$3.290

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Rochester

USA . 4,129 parts In-Stock

1+ parts

-

100+ parts

$3.570

1k+ parts

$3.200

10k+ parts

$3.010

4,129

-

$3.570

$3.200

$3.010

Future Electronics

Canada . 640 parts In-Stock

1+ parts

-

100+ parts

$3.210

1k+ parts

$3.150

10k+ parts

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640

-

$3.210

$3.150

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 584 parts In-Stock

1+ parts

$2.919

100+ parts

-

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584

$2.919

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$7.157

100+ parts

-

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50

$7.157

-

-

-

Chip Stock

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

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7,500

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Flip Electronics

USA . 5,540 parts In-Stock

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5,540

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Vyrian

USA . 4,784 parts In-Stock

1+ parts

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4,784

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ACDS - Activité Composants Distribution Service

France . 1,170 parts In-Stock

1+ parts

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1,170

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-

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IBS Electronics

USA . 936 parts In-Stock

1+ parts

-

100+ parts

$4.502

1k+ parts

$4.418

10k+ parts

$4.179

936

-

$4.502

$4.418

$4.179

PC Components Company LLC

USA . 2 parts In-Stock

1+ parts

-

100+ parts

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2

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Bristol Electronics

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,488 parts In-Stock

1+ parts

$2.390

100+ parts

-

1k+ parts

-

10k+ parts

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4,488

$2.390

-

-

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Corphita

USA . 962 parts In-Stock

1+ parts

$2.766

100+ parts

-

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-

10k+ parts

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962

$2.766

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Modulus Dynamics

Lithuania . 4,900 parts In-Stock

1+ parts

$3.008

100+ parts

$2.888

1k+ parts

$2.767

10k+ parts

-

4,900

$3.008

$2.888

$2.767

-

Aztec Data Supply Inc.

USA . 799 parts In-Stock

1+ parts

$4.203

100+ parts

-

1k+ parts

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799

$4.203

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Semicontronic

India . 4,709 parts In-Stock

1+ parts

$5.200

100+ parts

$5.070

1k+ parts

$5.044

10k+ parts

-

4,709

$5.200

$5.070

$5.044

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Corohmni

South Africa . 787 parts In-Stock

1+ parts

$5.522

100+ parts

-

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787

$5.522

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$7.157

100+ parts

$7.014

1k+ parts

-

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1,000

$7.157

$7.014

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Continental Prestige Electronics

USA . 374 parts In-Stock

1+ parts

$7.157

100+ parts

-

1k+ parts

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10k+ parts

$7.014

374

$7.157

-

-

$7.014

CoreStaff

Japan . 1,170 parts In-Stock

1+ parts

$7.870

100+ parts

$5.920

1k+ parts

-

10k+ parts

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1,170

$7.870

$5.920

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QUARKTWIN TECHNOLOGY LTD

USA . 6,160 parts In-Stock

1+ parts

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6,160

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A-Z Elektronik GmbH

Germany . 4,224 parts In-Stock

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4,224

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Alle Elektronik GmbH

Germany . 3,850 parts In-Stock

1+ parts

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3,850

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-

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Argo Parts USA

USA . 3,806 parts In-Stock

1+ parts

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3,806

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-

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

-

-

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Perfect Parts

USA . 524 parts In-Stock

1+ parts

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524

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

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100+ parts

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450

-

-

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Metaverse IC Inc.

Canada . 265 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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265

-

-

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-

ChipstoGo Electronic ltd

UK . 101 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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101

-

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Overview

Discover the CY62148ESL-55ZAXI by Infineon Technologies, a high-quality SRAM that offers exceptional performance and reliability. As a leading manufacturer, Infineon Technologies is known for delivering cutting-edge solutions. With its compact design and wide temperature range, this SRAM is perfect for industrial applications. Experience fast access times and low power consumption, allowing for seamless operation. Whether you're building IoT devices or implementing data storage systems, the CY62148ESL-55ZAXI provides the value and advantages you need. Trust in Infineon Technologies for superior technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures a lightweight and durable design, making it suitable for various applications.

Surface Mount: YES

Being surface mountable, this product offers easy and convenient installation, saving time and effort during assembly.

No. of Functions: 1

With a single function, this SRAM product simplifies integration and reduces complexity in circuit design, enhancing overall system efficiency.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization, making it versatile for both compact and larger electronic devices.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode provides flexibility and improved performance by allowing independent access to individual memory locations.

Input/Output Type: COMMON

The common input/output type simplifies communication and compatibility with other components, facilitating seamless integration into a variety of systems.

Nominal Supply Voltage / Vsup (V): 3

The 3V nominal supply voltage ensures reliable and stable operation, meeting the power requirements of modern electronic devices.

Power Supplies (V): 2.5/3.3/5

With multiple power supply options, this SRAM product offers versatility and compatibility with different system requirements.

No. of Terminals: 32

The 32 terminals enable efficient data transfer and connectivity, providing a reliable and robust connection between the SRAM and other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style optimize space utilization, making it ideal for compact devices with limited board space.

Maximum Operating Temperature: 85 °C

The ability to withstand a maximum operating temperature of 85°C ensures reliable performance in demanding environments.

Organization: 512KX8

With an organization of 512KX8, this SRAM product offers a high memory capacity and efficient data storage capabilities.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide a flexible and efficient interface, allowing for multiple devices to share the same data lines.

Minimum Standby Voltage: 1.5 V

The low minimum standby voltage of 1.5V ensures power efficiency during idle periods, conserving energy and extending battery life.

Minimum Operating Temperature: -40 °C

The ability to operate in temperatures as low as -40°C makes this SRAM product suitable for use in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability and signal integrity.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit board layout, accommodating different design requirements and optimizing signal routing.

Maximum Seated Height: 1.2 mm

With a maximum seated height of 1.2mm, this SRAM product is compatible with low-profile designs, enabling its use in slim devices.

Width: 8 mm

The compact width of 8mm allows for easy integration into space-constrained designs, enhancing the versatility and adaptability of the product.

Minimum Supply Voltage (Vsup): 2.2 V

The minimum supply voltage of 2.2V ensures compatibility with a wide range of power sources, enabling reliable operation in various applications.

Maximum Time At Peak Reflow Temperature (s): 20

With a maximum time of 20 seconds at peak reflow temperature, this SRAM product facilitates efficient and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper solder reflow and bonding, resulting in a reliable connection and improved product durability.

Length: 11.8 mm

The length of 11.8mm provides a compact footprint, allowing for efficient space allocation and easy integration in different system designs.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this SRAM product maintains performance and reliability across a wide temperature range, making it suitable for rugged industrial applications.

Technology: CMOS

The use of CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Parallel or Serial: PARALLEL

The parallel operation mode allows for fast and simultaneous data access, making this SRAM product ideal for applications that require high-speed read/write operations.

Terminal Form: GULL WING

The gull wing terminal form ensures secure and reliable solder connections, minimizing the risk of solder joint failure and enhancing product reliability.

Maximum Supply Current: 20 mA

With a maximum supply current of 20mA, this SRAM product operates efficiently within a specified power range, minimizing power consumption and reducing heat generation.

No. of Words: 524288 words

The high number of words (524288) provides a large memory capacity, offering ample storage for complex data-intensive applications.

Memory Width: 8

With a memory width of 8 bits, this SRAM product enables simultaneous storage and retrieval of 8 bits of data, enhancing data processing efficiency.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5mm enables reliable and compact connections, accommodating fine-pitch circuit board designs and optimizing data transfer rates.

No. of Words Code: 512K

The 512K words code indicates a significant memory capacity, allowing for extensive data storage and retrieval capabilities.

Moisture Sensitivity Level (MSL): 3

With an MSL rating of 3, this SRAM product has a moderate level of moisture sensitivity, ensuring proper handling and storage requirements to maintain quality and reliability.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V provides compatibility with various power sources and allows for stable and reliable operation across different applications.

Memory Density: 4194304 bit

With a memory density of 4194304 bits, this SRAM product offers substantial storage capacity, accommodating the needs of data-intensive applications.

Memory IC Type: STANDARD SRAM

As a standard SRAM memory IC, this product provides a proven and reliable solution for various memory requirements, ensuring compatibility and ease of integration.

Maximum Standby Current: 0.000007 Amp

The extremely low standby current of 0.000007 Amp minimizes power consumption during idle periods, maximizing energy efficiency and battery life.

Maximum Access Time: 55 ns

With a fast maximum access time of 55ns, this SRAM product enables quick data retrieval, supporting high-performance applications that demand rapid access to memory.

Technical Specifications

SRAM CY62148ESL-55ZAXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

55 ns

Additional Features:

IT ALSO OPERATES AT 5V SUPPLY

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e4

Length:

11.8 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.56,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.000007 Amp

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

8 mm

Trade Compliance

CY62148ESL-55ZAXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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