Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
CY14B101PA-SFXI by Infineon Technologies is a 128Kx8 non-volatile SRAM with synchronous operation and 3V nominal voltage. It comes in a small outline package, suitable for industrial applications requiring reliable memory storage. With a memory density of 1048576 bits and serial interface, it offers high performance in a compact form factor.
Median Price
$13.315
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21
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Arrow
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$5.268
100+ parts
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Chip1Stop
$7.290
Mouser Electronics
$20.780
$17.770
$17.190
DigiKey
$23.650
$20.271
$19.038
Flip Electronics (Authorized)
Rochester
$10.400
$9.310
$8.760
Verical
$13.000
$11.637
RS (Exports)
$14.494
Master Electronics
$13.630
$12.600
Digiode
$4.522
Nova Conductors
$12.350
Chip Stock
Vyrian
Flip Electronics
Martec Srl
Bristol Electronics
Inventory MP
IBS Electronics
$15.217
Atlantic Semiconductor
Cyclops Electronics Ltd
ComSIT Distribution GmbH
Corohmni
$2.523
Corphita
$4.284
Aztec Data Supply Inc.
$4.813
Modulus Dynamics
$5.891
$5.655
$5.420
Component Stockers USA
$6.140
$9.750
$9.410
Semicontronic
$6.200
$6.045
$6.014
Ampacity Inc.
Andel Nordic
$8.417
$8.080
Aranea Global
$12.103
$11.619
Continental Prestige Electronics
Lixinc
Authorized Procurement Solutions
Argo Parts USA
A-Z Elektronik GmbH
Alle Elektronik GmbH
Perfect Parts
The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.
The synchronous operating mode ensures efficient and synchronized data transfers, making it suitable for high-performance applications.
The nominal supply voltage of 3V provides a standard power source for the product to function reliably.
The industrial temperature grade ensures that the product can operate effectively in a wide range of temperature environments, making it suitable for industrial applications.
The non-volatile SRAM type ensures that data is retained even when power is lost, providing reliable data storage.
SRAM CY14B101PA-SFXI attributes and parameters. Explore more SRAM devices from Infineon Technologies
JESD-30 Code:
JESD-609 Code:
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Organization:
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Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
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CY14B101PA-SFXI Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.41
SB
8542.32.00.40
PCN Assembly/Origin - Mult Dev A/T Chgs 27/Oct/2022
PCN Packaging - Ship Label REV Date Code/Shelf Life Chgs 18/Jul/2019
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
LM317T
Sgs-ates Componenti Electronici S P A
Other Regulators; No. of Terminals: 3; JESD-609 Code: e0; Terminal Position: SINGLE; Adjustability: ADJUSTABLE; Maximum Load Regulation (%): 1.5 %;
BSS84-7-F
Diodes Incorporated
Diodes Inc. BSS84-7-F is a P-channel FET with 50V DS breakdown voltage, 0.13A max drain current, and 10 ohm RDS(on). Ideal for switching applications, it features a single configuration with built-in diode in a small outline package. Operating in enhancement mode at up to 150°C, it has Gull Wing terminals and matte tin finish.
1N4148WS
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
Onsemi
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
BAV99
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
SPC TECHNOLOGY/ MULTICOMP
Surge Components
SS14+
Multicomp Pro
SS14+ by Multicomp Pro is a Schottky rectifier diode with a max output current of 1A and a reverse test voltage of 40V. It is designed for surface mount applications in electronic circuits, offering a small outline package style and dual terminal position. With a temperature range from -65°C to 150°C, it is suitable for various industrial and consumer electronics.
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Swampscott Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Fairchild Semiconductor
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Terminals: 3;
RC0402JR-070RL
Yageo
Yageo's RC0402JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. It features METAL GLAZE/THICK FILM tech, WRAPAROUND terminals, and 0.0625 W power dissipation. Ideal for jumper applications in electronics requiring compact surface mount components.
CC0603KRX7R9BB103
Yageo CC0603KRX7R9BB103 is a 0603 SMT ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
M/a-com Technology Solutions
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Terminal Position: BOTTOM; Package Style (Meter): CYLINDRICAL;
AH180-WG-7
AH180-WG-7 by Diodes Inc. is a magnetic field sensor with 1.5mT hysteresis, 0.30V output range, and 9mA max operating current. Ideal for applications requiring non-inverting analog voltage output in a compact rectangular package suitable for surface mount installations.
STM32H743IIT6
STMicroelectronics
STM32H743IIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications due to its wide temperature range (-40°C to 85°C) and various connectivity options (CAN, I2C, UART, USB).
IS61LV25616AL-10TLI-TR
Integrated Silicon Solution
IS61LV25616AL-10TLI-TR by Integrated Silicon Solution is a 256KX16 SRAM with 10 ns access time, operating at 3.3V. It features a small outline package and operates in industrial temperature range. Ideal for applications requiring fast and reliable memory storage in harsh environments.
CY62128EV30LL-45SXIT
Cypress Semiconductor
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Standby Current: .000003 Amp;
2606B
Signetics
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Access Time: 750 ns;
IDT71024S15TYGI8
Integrated Device Technology
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOJ; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
CY62167DV30LL-55ZXI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; JESD-609 Code: e3;
7038L20PFGI8
Renesas Electronics
Renesas Electronics 7038L20PFGI8 is a 64Kx18 DUAL-PORT SRAM with 1179648-bit memory density. It operates at 5V, has an access time of 20ns, and features a low profile flatpack package style. Ideal for industrial applications requiring fast and efficient data storage and retrieval.
CY7C4142KV13-933FCXI
QDR SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 361; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
IDT71V67803S133PFGI
The Renesas Electronics IDT71V67803S133PFGI is a 512Kx18 CACHE SRAM with synchronous operation at 133 MHz. It features a low profile flatpack package, operates at an industrial temperature grade of -40 to 85 °C, and has a max supply current of 280 mA. Ideal for high-speed memory applications requiring fast access times and reliable performance in harsh environments.
5962-8866204NA
Micross Minco
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Standby Voltage: 4.5 V;
CY7C1399BN-12VXI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOJ; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
DS1245Y-70IND+
Maxim Integrated
NON-VOLATILE SRAM MODULE; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: DIP; Package Shape: RECTANGULAR; Technology: CMOS;
DS1220Y-200
Dallas Semiconductor
NON-VOLATILE SRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDIP-T24;
5962-8685916LA
Micross Components
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC, METAL-SEALED COFIRED;
IDT7007L20JGI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE; Terminal Form: J BEND;
71V35761S200PFG
CACHE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: LQFP; Package Shape: RECTANGULAR; Package Equivalence Code: QFP100,.63X.87;
CY62147EV30LL-45B2XA
CY62147EV30LL-45B2XA by Cypress Semiconductor is a 256Kx16 SRAM with 3.6V max supply voltage, 45ns access time, and industrial temperature grade. It features a very thin profile grid array package for common asynchronous applications in parallel memory systems.
Matra Design Semiconductor
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;
CY62158EV30LL-45BVXI
Infineon Technologies
Infineon's CY62158EV30LL-45BVXI is a 1MX8 SRAM with 3.6V max supply, 45ns access time, and 85°C operating temp. Ideal for industrial applications requiring fast, low-power memory solutions in a compact grid array package.
CY7C1049GN30-10VXIT
CY7C1049GN30-10VXIT by Infineon: 512Kx8 SRAM with 10ns access time, operates at -40 to 85°C. Ideal for industrial applications, featuring common I/O type and 3-state output characteristics. Package style is small outline, with a supply voltage range of 2.2V to 3.6V.
Performance Semiconductor
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Shape: RECTANGULAR; Package Style (Meter): IN-LINE; JESD-609 Code: e0;
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CY14B116L-ZS25XIT
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Technology: CMOS;
Infineon's CY14B116L-ZS25XIT is a 2MX8 SRAM with 16777216-bit memory density, operating at 3V. It features an access time of 25ns and is ideal for industrial applications requiring non-volatile memory storage in a small outline package.
CY14B256LA-SZ45XIT
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Access Time: 45 ns;
Infineon's CY14B256LA-SZ45XIT is a 32Kx8 non-volatile SRAM with 262144-bit memory density. Operating at 3V, it offers fast access time of 45ns and low standby current of 0.005A. Ideal for industrial applications requiring reliable data storage in a compact package.
CY14E256LA-SZ25XI
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Output Enable: YES;
Infineon's CY14E256LA-SZ25XI is a 32Kx8 SRAM with 3-STATE output, operating at 5V. It features a small outline package and industrial temperature grade, suitable for applications requiring fast access times like industrial automation and automotive systems.
CY14B256LA-SZ45XI
Infineon's CY14B256LA-SZ45XI is a 32Kx8 SRAM with 262144-bit memory density. Operating at 3V, it offers fast access time of 45ns in industrial temperatures. Ideal for applications requiring non-volatile parallel memory with low standby current and high reliability.
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Memory Width: 8;
CY14B104NA-BA25XI
Infineon's CY14B104NA-BA25XI is a 256Kx16 SRAM with 3V nominal voltage, operating in industrial temperature range. It features asynchronous mode, 25ns access time, and non-volatile memory IC type. Ideal for applications requiring fast parallel memory access in compact electronic devices.
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Current: 70 mA;
CY14B104NA-BA25XIT
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Density: 4194304 bit;
Infineon's CY14B104NA-BA25XIT is a 256Kx16 SRAM with 3V nominal voltage. Operating asynchronously, it offers fast access time of 25ns and low standby current of 0.005Amp. Ideal for industrial applications requiring high-speed memory with non-volatile storage capabilities.
CY14E256LA-SZ25XIT
Infineon's CY14E256LA-SZ25XIT is a 32Kx8 SRAM with 3-STATE output, operating at 5V. It features an industrial temperature grade, parallel interface, and non-volatile memory technology. Ideal for applications requiring fast access times of up to 25ns in harsh environments.
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V;
CY14B116L-ZS25XI
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Seated Height: 1.194 mm;
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3;
CY14E256LA-SZ45XIT
Infineon's CY14E256LA-SZ45XIT is a 32Kx8 SRAM with 3-STATE output, operating at 5V. It features a small outline package, GULL WING terminals, and industrial temperature grade. Ideal for applications requiring fast access times and non-volatile memory solutions.
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
CY14B108M-ZSP45XIT
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: TSOP2; Package Shape: RECTANGULAR; Package Equivalence Code: TSOP54,.46,32;
Infineon's CY14B108M-ZSP45XIT is a 512Kx16 SRAM with 3V nominal voltage. Operating asynchronously, it offers fast access time of 45ns and low standby current of 0.01Amp. Ideal for industrial applications requiring high-speed memory with non-volatile storage capabilities.
Supply Digital Components
$106.00
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Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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