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IS61LV25616AL-10TLI

Integrated Silicon Solution

IS61LV25616AL-10TLI by Integrated Silicon Solution

IS61LV25616AL-10TLI by Integrated Silicon Solution is a 256KX16 SRAM with 3.3V supply, operating at -40 to 85 °C. It features 10ns access time, 110mA max supply current, and GULL WING terminals. Ideal for industrial applications requiring fast and reliable memory storage in compact form factor.

Median Price

$5.220

Lifecycle Status

Suppliers In-Stock

25

In-Stock Inventory

1k+

Distributors (Authorized)

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Adafruit Industries

USA . 40 parts In-Stock

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$3.856

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$3.664

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$3.856

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Arrow

USA . 30 parts In-Stock

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$4.225

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$3.540

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$3.404

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$4.225

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Chip1Stop

Japan . 270 parts In-Stock

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$5.200

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$4.560

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DigiKey

USA . 1,842 parts In-Stock

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$5.220

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$4.606

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$4.234

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$4.127

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$5.220

$4.606

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$4.127

Mouser Electronics

USA . 291 parts In-Stock

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RS (Exports)

UK . 176 parts In-Stock

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$5.396

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$4.977

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$4.863

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Newark

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$6.740

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EBV Elektronik

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Verical

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Nova Conductors

Japan . 500 parts In-Stock

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$4.259

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$4.259

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TME

Poland . 16 parts In-Stock

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$5.860

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$4.090

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Chip Stock

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NAC Semi

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Vyrian

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Component Sense

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LIBRA Elektronik GmbH

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Cyclops Electronics Ltd

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J2 Sourcing AB

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A&K Electronics

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Rotakorn

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Bristol Electronics

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Right Parts Inc.

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ACDS - Activité Composants Distribution Service

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ComSIT Distribution GmbH

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Corohmni

South Africa . 32 parts In-Stock

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$2.737

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Component Stockers USA

USA . 3,086 parts In-Stock

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$3.570

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$3.300

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$3.250

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$3.856

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$3.664

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Continental Prestige Electronics

USA . 4,753 parts In-Stock

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$4.259

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$4.174

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Argo Parts USA

USA . 554 parts In-Stock

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$4.259

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Aztec Data Supply Inc.

USA . 2,766 parts In-Stock

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$5.549

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S.R.D Solutions

India . 30,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Metaverse IC Inc.

Canada . 6,526 parts In-Stock

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GreenTree Electronics

Israel . 6,000 parts In-Stock

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Authorized Procurement Solutions

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Netroflash

USA . 2,000 parts In-Stock

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$4.174

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$4.046

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$3.961

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Eastek

USA . 1,157 parts In-Stock

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Assy Fe

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iodParts Technologies Inc.

India . 384 parts In-Stock

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Robosynatics

Brazil . 300 parts In-Stock

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Lucentia Tech

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Computer Components Inc. - USA

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Kepictronics

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Overview

Unlock the power of fast and reliable data storage with the IS61LV25616AL-10TLI from Integrated Silicon Solution. As a top-tier manufacturer in the industry, ISS delivers high-quality SRAM memory solutions that are perfect for a wide range of applications. Whether you need quick access to critical data in industrial settings or seamless performance in embedded systems, this product offers unmatched value, benefits, and advantages. Trust ISS to provide cutting-edge technology that enhances your products and boosts overall performance. Choose the IS61LV25616AL-10TLI for superior quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for efficient packaging of the memory module.

Surface Mount: YES

Easy to install and secure on a circuit board.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal voltage for reliable performance and power efficiency.

No. of Terminals: 44

Sufficient terminals for connecting the memory module to external devices.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures in industrial environments.

Organization: 256KX16

Efficient organization of memory cells for fast and reliable data access.

Technology: CMOS

Low power consumption and high speed operation.

Memory IC Type: STANDARD SRAM

Reliable and widely compatible memory technology for various applications.

Maximum Access Time: 10 ns

Quick access time for fast data retrieval.

Technical Specifications

SRAM IS61LV25616AL-10TLI attributes and parameters. Explore more SRAM devices from Integrated Silicon Solution

Specs

Maximum Access Time:

10 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3

Length:

18.415 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.015 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

110 mA

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

IS61LV25616AL-10TLI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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