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CY62128ELL-45ZXAT

Infineon Technologies

CY62128ELL-45ZXAT by Infineon Technologies

Infineon's CY62128ELL-45ZXAT is a 128Kx8 SRAM with 45ns access time, operating at 5V. It features a small outline package and operates in industrial temperature range. Ideal for applications requiring fast, common I/O type memory with low standby current and high density.

Median Price

$4.421

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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9,000

-

-

-

-

Rochester

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

$3.930

1k+ parts

$3.520

10k+ parts

$3.310

4,500

-

$3.930

$3.520

$3.310

Verical

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

$4.912

1k+ parts

$4.400

10k+ parts

$4.138

4,500

-

$4.912

$4.400

$4.138

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,701 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,701

-

-

-

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Flip Electronics

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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4,500

-

-

-

-

Digiode

USA . 699 parts In-Stock

1+ parts

-

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-

1k+ parts

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699

-

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

-

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500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 3,369 parts In-Stock

1+ parts

$3.090

100+ parts

-

1k+ parts

-

10k+ parts

-

3,369

$3.090

-

-

-

Modulus Dynamics

Lithuania . 1,138 parts In-Stock

1+ parts

$3.237

100+ parts

$3.108

1k+ parts

$2.978

10k+ parts

-

1,138

$3.237

$3.108

$2.978

-

Corohmni

South Africa . 129 parts In-Stock

1+ parts

$4.325

100+ parts

-

1k+ parts

-

10k+ parts

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129

$4.325

-

-

-

Ampacity Inc.

Singapore . 8,657 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

-

10k+ parts

-

8,657

$6.000

-

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Semicontronic

India . 8,911 parts In-Stock

1+ parts

$10.000

100+ parts

$9.750

1k+ parts

$9.700

10k+ parts

-

8,911

$10.000

$9.750

$9.700

-

Component Stockers USA

USA . 787 parts In-Stock

1+ parts

$99.990

100+ parts

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1k+ parts

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10k+ parts

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787

$99.990

-

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A-Z Elektronik GmbH

Germany . 6,293 parts In-Stock

1+ parts

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100+ parts

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6,293

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-

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Alle Elektronik GmbH

Germany . 4,195 parts In-Stock

1+ parts

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100+ parts

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4,195

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-

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Glotronic Ltd.

UK . 3,700 parts In-Stock

1+ parts

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100+ parts

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3,700

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-

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Continental Prestige Electronics

USA . 3,461 parts In-Stock

1+ parts

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100+ parts

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3,461

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-

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Argo Parts USA

USA . 1,205 parts In-Stock

1+ parts

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1,205

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Corphita

USA . 406 parts In-Stock

1+ parts

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406

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Microchip USA

USA . 121 parts In-Stock

1+ parts

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100+ parts

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121

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-

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Bastille Electronics

Australia . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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50

-

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-

-

Overview

Unlock the power of reliable data storage with the CY62128ELL-45ZXAT by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers high-quality SRAM products like this one that are perfect for a wide range of applications. From industrial automation to telecommunications, this product offers customers unparalleled value and benefits. With its fast access time and low standby current, the CY62128ELL-45ZXAT ensures optimal performance and efficiency for all your memory needs. Trust Infineon Technologies to provide you with the cutting-edge technology you need to stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring reliable performance over time.

Surface Mount: YES

Allows for easy and secure attachment to circuit boards, saving space and simplifying the assembly process.

Operating Mode: ASYNCHRONOUS

Enables independent operation without requiring strict timing coordination, offering flexibility in system design.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement compatible with many systems, making integration easier.

No. of Terminals: 32

Offers multiple connections for input/output, enhancing the functionality and versatility of the product.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments and applications that require robust performance.

Memory IC Type: STANDARD SRAM

Utilizes Static Random Access Memory technology for fast and efficient data access, ideal for high-speed operations.

Technical Specifications

SRAM CY62128ELL-45ZXAT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

18.4 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.000004 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

16 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

8 mm

Trade Compliance

CY62128ELL-45ZXAT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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