Loading...

CY7C4041KV13-667FCXC

Infineon Technologies

CY7C4041KV13-667FCXC by Infineon Technologies

Infineon's CY7C4041KV13-667FCXC is a 2MX36 QDR SRAM with 75497472-bit memory density. Operating at 1.3V, it offers synchronous operation in commercial temperature range of 0-70°C. With a grid array package style and bottom terminal position, it is ideal for high-performance computing applications.

Median Price

$202.458

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 179 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

179

-

-

-

-

Flip Electronics (Authorized)

USA . 179 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

179

-

-

-

-

Verical

USA . 179 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

179

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 73 parts In-Stock

1+ parts

$202.458

100+ parts

-

1k+ parts

-

10k+ parts

-

73

$202.458

-

-

-

Vyrian

USA . 733 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

733

-

-

-

-

DigiKey Marketplace

USA . 479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

479

-

-

-

-

Digiode

USA . 288 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

288

-

-

-

-

Flip Electronics

USA . 179 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

179

-

-

-

-

Electronics Depot

USA . 35 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

35

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 34 parts In-Stock

1+ parts

$5.531

100+ parts

$5.310

1k+ parts

$5.089

10k+ parts

-

34

$5.531

$5.310

$5.089

-

Ampacity Inc.

Singapore . 179 parts In-Stock

1+ parts

$7.000

100+ parts

-

1k+ parts

-

10k+ parts

-

179

$7.000

-

-

-

AZTECH Wire

Italy . 733 parts In-Stock

1+ parts

$17.733

100+ parts

-

1k+ parts

-

10k+ parts

-

733

$17.733

-

-

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

$198.408

100+ parts

-

1k+ parts

$190.472

10k+ parts

-

50

$198.408

-

$190.472

-

Continental Prestige Electronics

USA . 3,212 parts In-Stock

1+ parts

$202.458

100+ parts

-

1k+ parts

-

10k+ parts

$198.408

3,212

$202.458

-

-

$198.408

Argo Parts USA

USA . 1,046 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,046

-

-

-

-

Corphita

USA . 415 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

415

-

-

-

-

Overview

Experience unmatched performance and reliability with the CY7C4041KV13-667FCXC by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies ensures top-notch quality and cutting-edge technology in their products. This QDR SRAM offers high-speed synchronous operation, making it ideal for applications that demand fast and efficient data processing. With a memory density of 75497472 bits and a wide memory width of 36, this CY7C4041KV13-667FCXC provides exceptional value and benefits to customers seeking superior performance in their projects. Elevate your designs with this premium SRAM solution from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Nominal Supply Voltage / Vsup (V): 1.3

Optimal supply voltage for efficient and reliable performance.

No. of Terminals: 361

High number of terminals allows for versatile connectivity options and compatibility with various systems.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate and synchronized data processing, ideal for high-performance applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making the product energy-efficient and fast.

Memory IC Type: QDR SRAM

Quad Data Rate (QDR) SRAM technology provides increased data transfer rates, enhancing overall system performance.

Technical Specifications

SRAM CY7C4041KV13-667FCXC attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

21 mm

Memory Density:

75497472 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

361

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2MX36

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Parallel or Serial:

PARALLEL

Maximum Seated Height:

2.765 mm

Maximum Supply Voltage (Vsup):

1.34 V

Minimum Supply Voltage (Vsup):

1.26 V

Nominal Supply Voltage / Vsup (V):

1.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

21 mm

Trade Compliance

CY7C4041KV13-667FCXC Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20