Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
CY7C1061G30-10BVJXIT by Infineon Technologies is a 1MX16 SRAM with 10ns access time, operating at 3V. It features a very thin profile grid array package and operates in industrial temperature range. Ideal for high-speed parallel memory applications requiring fast data access and reliable performance.
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Vyrian
Nova Conductors
Digiode
Modulus Dynamics
$3.522
$3.381
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Aztec Data Supply Inc.
$5.058
Corohmni
$5.846
Semicontronic
$7.000
$6.825
$6.790
Ampacity Inc.
$23.000
Continental Prestige Electronics
Argo Parts USA
Bastille Electronics
Corphita
Provides durability and protection for the internal components of the SRAM, ensuring reliable performance over time.
Allows for easy installation on a circuit board, making it ideal for manufacturing processes.
Can operate effectively in high temperature environments, increasing versatility in usage.
Offers a large memory capacity of 1 Megabyte with a width of 16 bits, suitable for data-intensive applications.
Provides excellent conductivity and reliability for signal transmission between the SRAM and other components.
Utilizes CMOS technology for low power consumption and high speed performance, enhancing overall efficiency.
Provides fast access to stored data, ensuring quick and efficient operations for the user.
SRAM CY7C1061G30-10BVJXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies
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JESD-30 Code:
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Organization:
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Parallel or Serial:
Peak Reflow Temperature (C):
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CY7C1061G30-10BVJXIT Memory ICs trade compliance attributes, and parameters.
ECCN
3A991.B.2.A
ECCN Governance
EAR
HTS
8542.32.00.41
SB
8542.32.00.40
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
2N2222A
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
Philips Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WT
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
MMBT3904-7-F
Diodes Incorporated
Diodes Inc. MMBT3904-7-F is a NPN BJT transistor for switching applications. Features include VCEsat of 0.3V, hFE of 30, and IC of 0.2A. With a max operating temp of 150°C, it's ideal for small outline SMT designs in automotive electronics.
MBRS140T3G
Onsemi
MBRS140T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.6V and max output current of 1A. It operates b/w -65°C to 125°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package style. The diode's matte tin terminal finish and dual position terminals enhance its performance in surface mount configurations.
FDV304P
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
Ksl Microdevices
BAV99-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Alpha & Omega Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
2N7002
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
CRGCQ0805F10K
TE Connectivity
TE Connectivity's CRGCQ0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance.
ULN-2803A
Sprague Electric
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148W-7-F
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
BSS138
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Minimum DS Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
MBR0530T1G
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
1N4148
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
ULN2803A
YOUTAI SEMICONDUCTOR CO LTD
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 18; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G18;
IDT71V3576S150PFGI8
Renesas Electronics
The Renesas Electronics IDT71V3576S150PFGI8 is a 128Kx36 SRAM with synchronous operation at 150 MHz. It features a 3-STATE output and operates at an industrial temperature range of -40 to 85°C. Ideal for applications requiring fast access times and high memory density.
71V124SA12TYGI8
Integrated Device Technology
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOJ; Package Shape: RECTANGULAR; JESD-609 Code: e3;
CY62177EV30LL-55ZXI
Cypress Semiconductor
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE;
CY7C1059DV33-10ZSXI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Width: 10.16 mm;
M5M51008DVP-70H
Renesas Electronics M5M51008DVP-70H is a 128Kx8 SRAM with 70ns access time, operating at 5V. It features common I/O type and 3-STATE output characteristics. Ideal for commercial applications requiring fast and reliable memory storage in a small outline package.
AS6C62256-55PCN
Alliance Memory
Alliance Memory's AS6C62256-55PCN is a 32Kx8 SRAM with 55ns access time, operating at 3.3V. Ideal for commercial applications, it features a common I/O type and 3-state output characteristics in a rectangular package style.
CY7C1041GN-10ZSXIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Terminal Pitch: .8 mm;
IDT71V416S12PHGI8
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Surface Mount: YES;
IS61WV102416BLL-10TLI-TR
Integrated Silicon Solution
SRAMs; JESD-609 Code: e3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 10; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
71321SA55JG8
Renesas Electronics 71321SA55JG8 is a 2Kx8 MULTI-PORT SRAM with 55ns access time, operating at 5V. It features a 3-STATE output and supports asynchronous mode. Ideal for commercial applications requiring fast memory access and low standby current consumption.
CY7C1059DV33-10ZSXIT
Infineon Technologies
Infineon's CY7C1059DV33-10ZSXIT is a 3.3V SRAM with 1MX8 organization, 10ns access time, and 8388608-bit memory density. It operates in industrial temperatures and features a small outline package for space-constrained applications. Ideal for high-speed parallel data processing needs.
71V424S10PHGI8
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;
CY7C1441KV33-133AXM
Infineon's CY7C1441KV33-133AXM is a 3.3V, 1MX36 CACHE SRAM with synchronous operation and 6.5ns access time. Ideal for military applications due to its low profile flatpack design, operating b/w -55°C to 125°C temperature range.
5962-8685908LA
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Screening Level: 38535Q/M;38534H;883B;
23K640-I/P
23K640-I/P by Microchip Technology is an 8Kx8 standard SRAM with 65536-bit memory density. It operates at a max clock frequency of 20 MHz and has a supply voltage range of 2.7V to 3.6V. Ideal for industrial applications requiring reliable synchronous operation in a TS16949 screening level environment.
71V3576S150PFGI8
The Renesas Electronics 71V3576S150PFGI8 is a synchronous SRAM with an organization of 128KX36 and a memory density of 4718592 bit. It operates at a max clock frequency of 150 MHz and has a min access time of 3.8 ns. This memory IC type is commonly used in cache applications.
71321LA25PFGI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
71321LA20TFG
MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Qualification: Not Qualified;
CY7C1049GN30-10VXIT
CY7C1049GN30-10VXIT by Infineon: 512Kx8 SRAM with 10ns access time, operates at -40 to 85°C. Ideal for industrial applications, featuring common I/O type and 3-state output characteristics. Package style is small outline, with a supply voltage range of 2.2V to 3.6V.
CY7C1079DV33-12BAXIT
Infineon's CY7C1079DV33-12BAXIT is a 3.3V SRAM with 4MX8 organization, 12ns access time, and 48 terminals in a thin profile grid array package. Ideal for industrial applications requiring fast and reliable parallel memory storage with common I/O type and 3-state output characteristics.
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CY7C1041GN30-10BVXI
Infineon Technologies' CY7C1041GN30-10BVXI is a 256KX16 SRAM with a package style of GRID ARRAY, VERY THIN PROFILE, FINE PITCH. It operates asynchronously at a nominal voltage of 3V and has a max access time of 10ns. This memory IC is commonly used in industrial applications requiring high-speed data storage.
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
CY7C1041GN30-10BVXIT
CY7C1041GN30-10BVXIT by Infineon: 256Kx16 SRAM with 10ns access time, operates at -40 to 85°C. Ideal for industrial applications requiring fast and reliable parallel memory storage. Package style: grid array, very thin profile, fine pitch.
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: VFBGA; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
CY7C1041GN30-10ZSXIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3;
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; JESD-609 Code: e3;
CY7C1041DV33-10ZSXI
CY7C1041DV33-10ZSXI by Cypress Semiconductor is a 256Kx16 SRAM with 3.3V supply, 10ns access time, and 85°C max temp. Ideal for industrial applications requiring fast, common I/O asynchronous memory in a small outline package.
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 36; Package Code: SOJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
CY7C1041DV33-10ZSXIT
CY7C1041DV33-10ZSXIT by Cypress Semiconductor is a 256KX16 SRAM with 3.3V supply, operating at -40 to 85°C. It features 10ns access time, 90mA max supply current, and GULL WING terminals. Ideal for industrial applications requiring fast and reliable memory storage in a compact form factor.
CY7C1041GN30-10ZSXI
CY7C1041GN30-10ZSXI by Infineon: 256KX16 SRAM with 10ns access time, 3.6V max supply voltage, and -40 to 85°C temp range. Ideal for industrial applications requiring fast and reliable memory storage in a compact 0.8mm pitch package.
CY7C1049GN30-10VXI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 36; Package Code: SOJ; Package Shape: RECTANGULAR; Width: 10.16 mm;
CY7C1049GN30-10VXI by Infineon Technologies is a 512Kx8 SRAM with 3-STATE output, operating at 3V. It features an industrial temperature grade, parallel interface, and J BEND terminal form. Ideal for applications requiring fast access times and low standby current in industrial environments.
CY7C1041G30-10ZSXIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Access Time: 10 ns;
Infineon's CY7C1041G30-10ZSXIT is a 256Kx16 SRAM with 100MHz clock frequency, 10ns access time, and 3-state output. It operates at -40 to 85°C, suitable for high-speed applications like networking equipment and industrial automation systems. The memory IC features a small outline package with gull wing terminals for surface mount assembly.
CY7C1051DV33-10ZSXI
Infineon's CY7C1051DV33-10ZSXI is a 512Kx16 SRAM with 3.3V supply, operating at -40 to 85°C. It features asynchronous mode, 10ns access time, and 44 terminals in a small outline package. Ideal for industrial applications requiring fast and reliable memory storage.
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 30;
CY7C1062G30-10BGXI
Infineon Technologies' CY7C1062G30-10BGXI is a 512KX32 SRAM with a 10 ns max access time. It operates asynchronously at a nominal voltage of 3V and has a temperature range of -40 to 85°C. This memory IC is commonly used in industrial applications requiring high-speed data storage.
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 119; Package Code: HBGA; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;
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