Loading...

CY7C1062G30-10BGXIT

Infineon Technologies

CY7C1062G30-10BGXIT by Infineon Technologies

Infineon's CY7C1062G30-10BGXIT is a 512Kx32 SRAM with 10ns access time, operating at 3V. It features asynchronous mode, parallel interface, and industrial temperature grade. Ideal for applications requiring fast and reliable memory storage in compact electronic devices.

Median Price

$52.212

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$48.200

10k+ parts

$45.970

500

-

-

$48.200

$45.970

Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$56.223

10k+ parts

-

500

-

-

$56.223

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$58.201

100+ parts

-

1k+ parts

-

10k+ parts

-

600

$58.201

-

-

-

Flip Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Vyrian

USA . 445 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

445

-

-

-

-

Digiode

USA . 253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

253

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,233 parts In-Stock

1+ parts

$2.015

100+ parts

-

1k+ parts

-

10k+ parts

-

1,233

$2.015

-

-

-

Semicontronic

India . 174 parts In-Stock

1+ parts

$37.300

100+ parts

$36.368

1k+ parts

$36.181

10k+ parts

-

174

$37.300

$36.368

$36.181

-

Ampacity Inc.

Singapore . 41 parts In-Stock

1+ parts

$37.300

100+ parts

-

1k+ parts

-

10k+ parts

-

41

$37.300

-

-

-

Modulus Dynamics

Lithuania . 4,076 parts In-Stock

1+ parts

$47.190

100+ parts

$45.302

1k+ parts

$43.415

10k+ parts

-

4,076

$47.190

$45.302

$43.415

-

Corohmni

South Africa . 1,238 parts In-Stock

1+ parts

$47.190

100+ parts

-

1k+ parts

-

10k+ parts

-

1,238

$47.190

-

-

-

Continental Prestige Electronics

USA . 5,626 parts In-Stock

1+ parts

$58.201

100+ parts

-

1k+ parts

-

10k+ parts

$57.037

5,626

$58.201

-

-

$57.037

Netroflash

USA . 100 parts In-Stock

1+ parts

$58.201

100+ parts

$57.037

1k+ parts

-

10k+ parts

-

100

$58.201

$57.037

-

-

Component Stockers USA

USA . 185 parts In-Stock

1+ parts

$519.180

100+ parts

-

1k+ parts

-

10k+ parts

-

185

$519.180

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Argo Parts USA

USA . 893 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

893

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Corphita

USA . 8 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8

-

-

-

-

Overview

Discover the cutting-edge CY7C1062G30-10BGXIT by Infineon Technologies, a top-tier SRAM memory chip designed to elevate your electronic devices to the next level. With a reputation for excellence in semiconductor technology, Infineon delivers unrivaled quality and reliability. Ideal for industrial applications requiring fast access times, this memory chip offers a seamless user experience and optimized performance. Upgrade your devices with the CY7C1062G30-10BGXIT and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product.

Surface Mount: YES

Ease of installation and space-saving design.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard voltage level for efficient power management.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures making it suitable for industrial applications.

Technology: CMOS

CMOS technology provides low power consumption and high speed performance.

Memory IC Type: STANDARD SRAM

Standard SRAM offers reliable and fast memory access.

Maximum Access Time: 10 ns

Provides quick access to data for improved system performance.

Technical Specifications

SRAM CY7C1062G30-10BGXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

10 ns

JESD-30 Code:

R-PBGA-B119

JESD-609 Code:

e1

Length:

22 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

32

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

119

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX32

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.4 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

14 mm

Trade Compliance

CY7C1062G30-10BGXIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20