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IS61LV25616AL-10TLI-TR

Integrated Silicon Solution

IS61LV25616AL-10TLI-TR by Integrated Silicon Solution

IS61LV25616AL-10TLI-TR by Integrated Silicon Solution is a 256KX16 SRAM with 10 ns access time, operating at 3.3V. It features a small outline package and operates in industrial temperature range. Ideal for applications requiring fast and reliable memory storage in harsh environments.

Median Price

$3.435

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,114 parts In-Stock

1+ parts

$5.220

100+ parts

$4.497

1k+ parts

$4.139

10k+ parts

$4.034

1,114

$5.220

$4.497

$4.139

$4.034

Mouser Electronics

USA . 775 parts In-Stock

1+ parts

$5.220

100+ parts

$4.610

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-

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775

$5.220

$4.610

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Chip1Stop

Japan . 22 parts In-Stock

1+ parts

-

100+ parts

$2.930

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22

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$2.930

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Arrow

USA . 20 parts In-Stock

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$3.435

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20

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$3.435

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Verical

USA . 20 parts In-Stock

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$3.435

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20

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$3.435

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 47 parts In-Stock

1+ parts

$3.632

100+ parts

-

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47

$3.632

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Chip Stock

USA . 14,780 parts In-Stock

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14,780

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Sensible Micro Corp

USA . 680 parts In-Stock

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680

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Vyrian

USA . 662 parts In-Stock

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ComSIT Distribution GmbH

Germany . 510 parts In-Stock

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510

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,433 parts In-Stock

1+ parts

$3.632

100+ parts

-

1k+ parts

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10k+ parts

$3.560

2,433

$3.632

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$3.560

Argo Parts USA

USA . 1,410 parts In-Stock

1+ parts

$3.632

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1,410

$3.632

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$3.632

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1,000

$3.632

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Corohmni

South Africa . 362 parts In-Stock

1+ parts

$5.576

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362

$5.576

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Aztec Data Supply Inc.

USA . 1,454 parts In-Stock

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$5.642

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1,454

$5.642

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Authorized Procurement Solutions

USA . 32,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,605 parts In-Stock

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5,605

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Perfect Parts

USA . 3,366 parts In-Stock

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3,366

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XScomponents

USA . 1,341 parts In-Stock

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1,341

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Overview

Unlock the power of high-quality memory with the IS61LV25616AL-10TLI-TR by Integrated Silicon Solution. This SRAM chip offers reliable performance, versatility, and speed for a wide range of applications. With a focus on innovation and cutting-edge technology, ISS ensures top-notch products that meet the needs of today's demanding market. Experience seamless operation and enhanced efficiency with this outstanding memory solution. Upgrade your devices with the IS61LV25616AL-10TLI-TR and enjoy the benefits of superior quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards.

Operating Mode: ASYNCHRONOUS

Asynchronous operation provides flexibility and independence in data transfer.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage level, ensuring compatibility with most systems.

No. of Words: 262144 words

Large capacity for storing a significant amount of data.

Maximum Access Time: 10 ns

Fast access time for quick data retrieval and processing.

Technical Specifications

SRAM IS61LV25616AL-10TLI-TR attributes and parameters. Explore more SRAM devices from Integrated Silicon Solution

Specs

Maximum Access Time:

10 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3

Length:

18.415 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.015 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10.16 mm

Trade Compliance

IS61LV25616AL-10TLI-TR Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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