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IS61LV25616AL-10TL-TR

Integrated Silicon Solution

IS61LV25616AL-10TL-TR by Integrated Silicon Solution

IS61LV25616AL-10TL-TR by Integrated Silicon Solution is a 256KX16 SRAM with 3.3V supply, 10ns access time, and 44 terminals. It operates asynchronously in commercial temperature range and has a memory density of 4Mbit. Ideal for applications requiring fast and reliable data storage in compact electronic devices.

Median Price

$3.312

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 5,712 parts In-Stock

1+ parts

$4.640

100+ parts

$4.010

1k+ parts

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10k+ parts

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5,712

$4.640

$4.010

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DigiKey

USA . 1,017 parts In-Stock

1+ parts

$4.640

100+ parts

$4.005

1k+ parts

$3.687

10k+ parts

$3.594

1,017

$4.640

$4.005

$3.687

$3.594

Chip1Stop

Japan . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.936

10k+ parts

$2.831

2,000

-

-

$2.936

$2.831

Arrow

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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$3.312

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1,000

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$3.312

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Verical

USA . 1,000 parts In-Stock

1+ parts

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$3.312

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1,000

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$3.312

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$3.034

100+ parts

-

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100

$3.034

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Chip Stock

USA . 11,200 parts In-Stock

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11,200

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Vyrian

USA . 729 parts In-Stock

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729

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Inventory MP

USA . 411 parts In-Stock

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411

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Bristol Electronics

USA . 411 parts In-Stock

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411

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$3.034

100+ parts

$2.973

1k+ parts

-

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1,000

$3.034

$2.973

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QUARKTWIN TECHNOLOGY LTD

USA . 13,835 parts In-Stock

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13,835

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Overview

Elevate your electronics with the IS61LV25616AL-10TL-TR by Integrated Silicon Solution. As a leading manufacturer in the industry, ISS delivers top-quality SRAM products that guarantee reliable performance and durability. Whether you're designing industrial equipment, telecommunications systems, or consumer electronics, this memory IC offers unmatched value, benefits, and advantages to enhance your applications. Trust ISS to provide the cutting-edge technology you need for seamless operations and optimal functionality. Experience the difference with ISS today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material is durable and can protect the internal components of the product effectively.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration of the product onto a circuit board.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures compatibility with a wide range of systems and devices.

Organization: 256KX16

The 256KX16 organization provides a good balance between memory capacity and data width for efficient data storage and retrieval.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can operate reliably in a variety of environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

SRAM IS61LV25616AL-10TL-TR attributes and parameters. Explore more SRAM devices from Integrated Silicon Solution

Specs

Maximum Access Time:

10 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3

Length:

18.415 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256KX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.01 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

90 mA

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10.16 mm

Trade Compliance

IS61LV25616AL-10TL-TR Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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