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CY62167GN30-45ZXI

Infineon Technologies

CY62167GN30-45ZXI by Infineon Technologies

Infineon's CY62167GN30-45ZXI is a 1MX16 SRAM with 16-bit memory width and 16777216 bit density. Operating at 3V, it offers fast access time of 45ns for industrial applications. With parallel interface and small outline package, it suits high-speed data processing needs.

Median Price

$17.235

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 82 parts In-Stock

1+ parts

$17.000

100+ parts

$13.900

1k+ parts

$13.000

10k+ parts

-

82

$17.000

$13.900

$13.000

-

Flip Electronics (Authorized)

USA . 4,420 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,420

-

-

-

-

DigiKey

USA . 2,692 parts In-Stock

1+ parts

-

100+ parts

$17.470

1k+ parts

-

10k+ parts

-

2,692

-

$17.470

-

-

Verical

USA . 2,692 parts In-Stock

1+ parts

-

100+ parts

$20.174

1k+ parts

-

10k+ parts

-

2,692

-

$20.174

-

-

Rochester

USA . 2,133 parts In-Stock

1+ parts

-

100+ parts

$9.790

1k+ parts

$8.760

10k+ parts

$8.240

2,133

-

$9.790

$8.760

$8.240

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$17.190

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$17.190

-

-

-

Digiode

USA . 937 parts In-Stock

1+ parts

$19.038

100+ parts

-

1k+ parts

-

10k+ parts

-

937

$19.038

-

-

-

Flip Electronics

USA . 8,644 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,644

-

-

-

-

Vyrian

USA . 2,168 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,168

-

-

-

-

Chip Stock

USA . 131 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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131

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 2,938 parts In-Stock

1+ parts

$7.230

100+ parts

$6.941

1k+ parts

$6.652

10k+ parts

-

2,938

$7.230

$6.941

$6.652

-

Corohmni

South Africa . 6 parts In-Stock

1+ parts

$7.230

100+ parts

-

1k+ parts

-

10k+ parts

-

6

$7.230

-

-

-

Semicontronic

India . 1,671 parts In-Stock

1+ parts

$12.990

100+ parts

$12.665

1k+ parts

$12.600

10k+ parts

-

1,671

$12.990

$12.665

$12.600

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Ampacity Inc.

Singapore . 2,261 parts In-Stock

1+ parts

$14.850

100+ parts

-

1k+ parts

-

10k+ parts

-

2,261

$14.850

-

-

-

Continental Prestige Electronics

USA . 5,069 parts In-Stock

1+ parts

$17.190

100+ parts

-

1k+ parts

-

10k+ parts

$16.846

5,069

$17.190

-

-

$16.846

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$17.190

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$17.190

-

-

-

Corphita

USA . 35 parts In-Stock

1+ parts

$18.036

100+ parts

-

1k+ parts

-

10k+ parts

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35

$18.036

-

-

-

Argo Parts USA

USA . 4,755 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,755

-

-

-

-

iodParts Technologies Inc.

India . 2,773 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,773

-

-

-

-

Kepictronics

USA . 999 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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999

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Overview

Experience unparalleled performance and reliability with the CY62167GN30-45ZXI by Infineon Technologies, a leading manufacturer in the industry. This Small Outline Thin Profile SRAM offers fast access times of 45 ns, making it ideal for industrial applications where speed is essential. With a memory density of 16,777,216 bits and a wide operating temperature range, this chip provides exceptional value and versatility for your projects. Upgrade to the CY62167GN30-45ZXI today and elevate your system's performance to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

The ability to be surface mounted allows for efficient and compact PCB design, saving space and making installation easier.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes the product energy efficient and compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product is suitable for industrial environments where temperature fluctuations may occur.

Memory Width: 16

The memory width of 16 allows for efficient data processing and storage, making the product ideal for high-performance applications.

Technical Specifications

SRAM CY62167GN30-45ZXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

JESD-30 Code:

R-PDSO-G48

Length:

18.4 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

CY62167GN30-45ZXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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