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CY62158EV30LL-45ZSXIT

Infineon Technologies

CY62158EV30LL-45ZSXIT by Infineon Technologies

Infineon's CY62158EV30LL-45ZSXIT is a 1MX8 SRAM with 3.6V max supply voltage, 45ns access time, and 8388608-bit memory density. It operates in industrial temperatures and features a small outline package for applications requiring high-speed parallel memory solutions.

Median Price

$6.090

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,003 parts In-Stock

1+ parts

$6.080

100+ parts

$5.330

1k+ parts

-

10k+ parts

-

1,003

$6.080

$5.330

-

-

DigiKey

USA . 2,406 parts In-Stock

1+ parts

$6.100

100+ parts

$5.256

1k+ parts

$4.836

10k+ parts

$4.714

2,406

$6.100

$5.256

$4.836

$4.714

Mouser Electronics

USA . 550 parts In-Stock

1+ parts

$6.100

100+ parts

$5.260

1k+ parts

$3.280

10k+ parts

$3.230

550

$6.100

$5.260

$3.280

$3.230

Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.313

10k+ parts

$3.263

4,000

-

-

$3.313

$3.263

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 214 parts In-Stock

1+ parts

$6.850

100+ parts

-

1k+ parts

-

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214

$6.850

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$7.040

100+ parts

-

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50

$7.040

-

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Chip Stock

USA . 4,310 parts In-Stock

1+ parts

-

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4,310

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Vyrian

USA . 1,193 parts In-Stock

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-

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1,193

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 139 parts In-Stock

1+ parts

$4.360

100+ parts

-

1k+ parts

-

10k+ parts

-

139

$4.360

-

-

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Modulus Dynamics

Lithuania . 4,224 parts In-Stock

1+ parts

$5.794

100+ parts

$5.562

1k+ parts

$5.330

10k+ parts

-

4,224

$5.794

$5.562

$5.330

-

Corohmni

South Africa . 484 parts In-Stock

1+ parts

$5.794

100+ parts

-

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10k+ parts

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484

$5.794

-

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Advanced Electronics

New Zealand . 48 parts In-Stock

1+ parts

$5.968

100+ parts

$5.669

1k+ parts

$5.669

10k+ parts

-

48

$5.968

$5.669

$5.669

-

Ampacity Inc.

Singapore . 1,028 parts In-Stock

1+ parts

$6.270

100+ parts

-

1k+ parts

-

10k+ parts

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1,028

$6.270

-

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Semicontronic

India . 1,001 parts In-Stock

1+ parts

$6.270

100+ parts

$6.113

1k+ parts

$6.082

10k+ parts

-

1,001

$6.270

$6.113

$6.082

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Corphita

USA . 413 parts In-Stock

1+ parts

$6.489

100+ parts

-

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10k+ parts

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413

$6.489

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Continental Prestige Electronics

USA . 2,935 parts In-Stock

1+ parts

$6.700

100+ parts

-

1k+ parts

-

10k+ parts

$6.566

2,935

$6.700

-

-

$6.566

RC Electronics

USA . 7,039 parts In-Stock

1+ parts

-

100+ parts

$7.210

1k+ parts

$6.800

10k+ parts

$6.660

7,039

-

$7.210

$6.800

$6.660

A-Z Elektronik GmbH

Germany . 4,860 parts In-Stock

1+ parts

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4,860

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Lixinc

USA . 4,355 parts In-Stock

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4,355

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Alle Elektronik GmbH

Germany . 3,240 parts In-Stock

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3,240

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S.R.D Solutions

India . 2,000 parts In-Stock

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2,000

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Argo Parts USA

USA . 627 parts In-Stock

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627

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Kepictronics

USA . 470 parts In-Stock

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470

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Authorized Procurement Solutions

USA . 425 parts In-Stock

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425

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Overview

Unlock unparalleled performance and reliability with the CY62158EV30LL-45ZSXIT by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality SRAM products that excel in a wide range of applications. With a focus on innovation and cutting-edge technology, this SRAM memory module offers customers exceptional value, benefits, and advantages. Experience seamless operation and enhanced efficiency with the CY62158EV30LL-45ZSXIT, setting new standards for high-performance memory solutions. Elevate your projects to new heights with Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Convenient installation process and saves space on the circuit board.

Operating Mode: ASYNCHRONOUS

Allows for independent operation of the memory without requiring synchronization with external clock signals.

Nominal Supply Voltage / Vsup (V): 3

Operates efficiently at a standard voltage, ensuring consistent performance.

No. of Terminals: 44

Provides multiple connection points for integration into larger electronic systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, making it suitable for industrial applications.

Memory IC Type: STANDARD SRAM

Reliable and widely used memory type known for fast read and write operations.

Technical Specifications

SRAM CY62158EV30LL-45ZSXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e4

Length:

18.415 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.36,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.194 mm

Maximum Standby Current:

.000005 Amp

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

10.16 mm

Trade Compliance

CY62158EV30LL-45ZSXIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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