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CY7C1079DV33-12BAXI

Infineon Technologies

CY7C1079DV33-12BAXI by Infineon Technologies

CY7C1079DV33-12BAXI by Infineon Technologies is a 3.3V SRAM with 4MX8 organization, operating in asynchronous mode. It features a max access time of 12ns and is ideal for industrial applications requiring high-speed memory solutions. The package style is grid array, thin profile, fine pitch, making it suitable for surface mount designs.

Median Price

$136.740

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 352 parts In-Stock

1+ parts

$136.740

100+ parts

$126.770

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352

$136.740

$126.770

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Flip Electronics (Authorized)

USA . 196 parts In-Stock

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196

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DigiKey

USA . 114 parts In-Stock

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114

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Verical

USA . 104 parts In-Stock

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104

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Digiode

USA . 132 parts In-Stock

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$112.014

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132

$112.014

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Flip Electronics

USA . 1,784 parts In-Stock

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1,784

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Chip Stock

USA . 285 parts In-Stock

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285

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Nova Conductors

Japan . 60 parts In-Stock

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60

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Vyrian

USA . 5 parts In-Stock

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Electronics Depot

USA . 2 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 80 parts In-Stock

1+ parts

$2.824

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80

$2.824

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Aztec Data Supply Inc.

USA . 3,391 parts In-Stock

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$3.580

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$3.580

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Modulus Dynamics

Lithuania . 2,849 parts In-Stock

1+ parts

$5.477

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$5.258

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$5.039

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2,849

$5.477

$5.258

$5.039

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Advanced Electronics

New Zealand . 43 parts In-Stock

1+ parts

$6.229

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$5.668

1k+ parts

$5.108

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43

$6.229

$5.668

$5.108

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AZTECH Wire

Italy . 512 parts In-Stock

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$14.489

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$14.489

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Ampacity Inc.

Singapore . 145 parts In-Stock

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$100.220

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$100.220

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Semicontronic

India . 50 parts In-Stock

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$100.220

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$97.714

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$97.213

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$100.220

$97.714

$97.213

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Corphita

USA . 418 parts In-Stock

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$106.119

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418

$106.119

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Component Stockers USA

USA . 142 parts In-Stock

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$123.080

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$106.100

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142

$123.080

$106.100

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Microchip USA

USA . 1,477 parts In-Stock

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$189.578

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1,477

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Continental Prestige Electronics

USA . 6,246 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 4,427 parts In-Stock

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Bastille Electronics

Australia . 68 parts In-Stock

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Overview

Unlock unparalleled performance and reliability with the CY7C1079DV33-12BAXI by Infineon Technologies. As a leader in semiconductor manufacturing, Infineon Technologies delivers cutting-edge SRAM technology that is ideal for industrial applications. Experience seamless operation with a 3.3V nominal supply voltage and a maximum access time of just 12ns. Trust in the quality and innovation of Infineon Technologies to elevate your projects to new heights of efficiency. Choose the CY7C1079DV33-12BAXI for unparalleled value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Operating Mode: ASYNCHRONOUS

Allows for independent operation without the need for a synchronized clock signal, providing flexibility in data transfer.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal supply voltage for efficient performance and power consumption.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature conditions, making it suitable for a wide range of applications.

Memory IC Type: STANDARD SRAM

Utilizes Static Random Access Memory technology, providing fast and reliable data storage and access.

Maximum Access Time: 12 ns

Ensures quick access to stored data, reducing latency and improving overall system performance.

Technical Specifications

SRAM CY7C1079DV33-12BAXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

12 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

9.5 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.05 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

250 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

CY7C1079DV33-12BAXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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