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CY62148ESL-55ZAXIT

Infineon Technologies

CY62148ESL-55ZAXIT by Infineon Technologies

Infineon's CY62148ESL-55ZAXIT is a 512Kx8 SRAM with 55ns access time, operating at 3.6V max supply voltage. It features common I/O type, 3-state output characteristics, and operates in industrial temperature range. Ideal for applications requiring fast and reliable memory storage in compact electronic devices.

Median Price

$3.570

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 7,500 parts In-Stock

1+ parts

$2.817

100+ parts

-

1k+ parts

-

10k+ parts

$2.307

7,500

$2.817

-

-

$2.307

DigiKey

USA . 1,485 parts In-Stock

1+ parts

$6.130

100+ parts

$5.282

1k+ parts

$4.985

10k+ parts

$4.787

1,485

$6.130

$5.282

$4.985

$4.787

Mouser Electronics

USA . 2,442 parts In-Stock

1+ parts

$6.750

100+ parts

$5.810

1k+ parts

$5.350

10k+ parts

$5.210

2,442

$6.750

$5.810

$5.350

$5.210

Flip Electronics (Authorized)

USA . 14,996 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,996

-

-

-

-

Verical

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.307

7,500

-

-

-

$2.307

Rochester

USA . 1,170 parts In-Stock

1+ parts

-

100+ parts

$3.570

1k+ parts

$3.200

10k+ parts

$3.010

1,170

-

$3.570

$3.200

$3.010

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$6.593

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$6.593

-

-

-

Digiode

USA . 504 parts In-Stock

1+ parts

$7.666

100+ parts

-

1k+ parts

-

10k+ parts

-

504

$7.666

-

-

-

Vyrian

USA . 6,195 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,195

-

-

-

-

Flip Electronics

USA . 5,540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,540

-

-

-

-

Chip Stock

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 1,418 parts In-Stock

1+ parts

$2.323

100+ parts

$2.230

1k+ parts

$2.137

10k+ parts

-

1,418

$2.323

$2.230

$2.137

-

Corohmni

South Africa . 1,119 parts In-Stock

1+ parts

$2.341

100+ parts

-

1k+ parts

-

10k+ parts

-

1,119

$2.341

-

-

-

Semicontronic

India . 6,753 parts In-Stock

1+ parts

$2.650

100+ parts

$2.584

1k+ parts

$2.570

10k+ parts

-

6,753

$2.650

$2.584

$2.570

-

Ampacity Inc.

Singapore . 6,525 parts In-Stock

1+ parts

$2.650

100+ parts

-

1k+ parts

-

10k+ parts

-

6,525

$2.650

-

-

-

Aztec Data Supply Inc.

USA . 340 parts In-Stock

1+ parts

$4.184

100+ parts

-

1k+ parts

-

10k+ parts

-

340

$4.184

-

-

-

Continental Prestige Electronics

USA . 1,770 parts In-Stock

1+ parts

$6.030

100+ parts

-

1k+ parts

-

10k+ parts

$5.909

1,770

$6.030

-

-

$5.909

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$6.593

100+ parts

$6.263

1k+ parts

$5.950

10k+ parts

$5.868

300

$6.593

$6.263

$5.950

$5.868

Corphita

USA . 474 parts In-Stock

1+ parts

$7.263

100+ parts

-

1k+ parts

-

10k+ parts

-

474

$7.263

-

-

-

Component Stockers USA

USA . 4,156 parts In-Stock

1+ parts

$7.730

100+ parts

$6.220

1k+ parts

$5.660

10k+ parts

-

4,156

$7.730

$6.220

$5.660

-

Microchip USA

USA . 1,680 parts In-Stock

1+ parts

$19.700

100+ parts

$19.420

1k+ parts

$19.280

10k+ parts

$19.140

1,680

$19.700

$19.420

$19.280

$19.140

QUARKTWIN TECHNOLOGY LTD

USA . 26,671 parts In-Stock

1+ parts

-

100+ parts

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26,671

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-

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Futuretech Components

Singapore . 5,500 parts In-Stock

1+ parts

-

100+ parts

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5,500

-

-

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Argo Parts USA

USA . 1,648 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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1,648

-

-

-

-

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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100

-

-

-

-

Overview

Unlock unparalleled performance and reliability with the CY62148ESL-55ZAXIT by Infineon Technologies. A leader in the industry, Infineon delivers top-notch quality SRAM memory solutions suitable for a wide range of applications. With a compact design and versatile operating modes, this memory module offers exceptional value and benefits to customers seeking seamless integration and optimized performance. Upgrade your system today with the superior technology of Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic material ensures the product is resistant to physical damage and can withstand harsh operating conditions.

Surface Mount: YES

Surface mounting capability allows for easy integration into circuit boards, saving space and simplifying assembly.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance even in extreme temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows the product to function effectively even in cold environments.

Memory Density: 4194304 bit

High memory density provides ample storage capacity for data-intensive applications.

Maximum Access Time: 55 ns

Fast access time ensures quick retrieval of data, enhancing overall performance.

Technical Specifications

SRAM CY62148ESL-55ZAXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

55 ns

Additional Features:

IT ALSO OPERATES AT 5V SUPPLY

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e4

Length:

11.8 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.56,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.000007 Amp

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

8 mm

Trade Compliance

CY62148ESL-55ZAXIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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