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CY62147EV30LL-45ZSXI

Infineon Technologies

CY62147EV30LL-45ZSXI by Infineon Technologies

Infineon's CY62147EV30LL-45ZSXI is a 256Kx16 SRAM with 3.6V max supply voltage, 45ns access time, and operates in industrial temperature range. It features common I/O type, 2.5/3.3V power supplies, and 44 terminals in a small outline package. Ideal for applications requiring fast and reliable memory storage in harsh environments.

Median Price

$3.114

Lifecycle Status

Suppliers In-Stock

27

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 19 parts In-Stock

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$1.050

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$1.050

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$1.050

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Chip1Stop

Japan . 206 parts In-Stock

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$4.230

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$3.710

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Mouser Electronics

USA . 1,168 parts In-Stock

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$4.310

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$3.630

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$3.370

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$4.310

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DigiKey

USA . 1,648 parts In-Stock

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$4.650

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$4.111

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$3.779

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$3.685

1,648

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$4.111

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$3.685

Flip Electronics (Authorized)

USA . 83,303 parts In-Stock

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RS (Exports)

UK . 1,350 parts In-Stock

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Verical

USA . 1,098 parts In-Stock

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$3.114

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$2.999

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$2.800

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$2.800

Rochester

USA . 296 parts In-Stock

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$2.430

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$2.050

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Distributors (In-Stock)

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Digiode

USA . 2 parts In-Stock

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$0.998

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$0.998

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Nova Conductors

Japan . 10 parts In-Stock

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$4.046

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Flip Electronics

USA . 77,353 parts In-Stock

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Vyrian

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DigiKey Marketplace

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Rutronik

Germany . 1,350 parts In-Stock

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$2.520

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1,350

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IBS Electronics

USA . 1,070 parts In-Stock

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$3.248

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$3.164

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$3.066

1,070

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$3.248

$3.164

$3.066

J2 Sourcing AB

Sweden . 116 parts In-Stock

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Ashlea Components Ltd

UK . 57 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 40 parts In-Stock

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Bristol Electronics

USA . 40 parts In-Stock

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$1.575

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ComSIT Distribution GmbH

Germany . 40 parts In-Stock

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ComSIT USA

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Dan-Mar Components

USA . 40 parts In-Stock

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Micros

Poland . 25 parts In-Stock

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$4.043

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Partservice

France . 25 parts In-Stock

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$3.793

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$3.721

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$3.721

25

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$3.721

Micros sp.j. W. Kędra i J. Lic

Poland . 25 parts In-Stock

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$4.063

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$3.986

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Prism Electronics

USA . 10 parts In-Stock

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Classic Components Corporation

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Semicontronic

India . 11,234 parts In-Stock

1+ parts

$0.890

100+ parts

$0.868

1k+ parts

$0.863

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$0.890

$0.868

$0.863

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Ampacity Inc.

Singapore . 10,978 parts In-Stock

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$0.890

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Corphita

USA . 780 parts In-Stock

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$0.945

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Component Stockers USA

USA . 73 parts In-Stock

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$1.020

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$1.020

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Aztec Data Supply Inc.

USA . 2,231 parts In-Stock

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$2.876

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Corohmni

South Africa . 82 parts In-Stock

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$2.943

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Continental Prestige Electronics

USA . 2,946 parts In-Stock

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$4.046

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$3.965

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Argo Parts USA

USA . 2,897 parts In-Stock

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$4.046

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Modulus Dynamics

Lithuania . 5,179 parts In-Stock

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$4.197

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$4.029

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$3.861

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$4.197

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Microchip USA

USA . 1,955 parts In-Stock

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$15.484

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Perfect Parts

USA . 24,535 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,183 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,047 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,698 parts In-Stock

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Lixinc

USA . 3,410 parts In-Stock

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Metaverse IC Inc.

Canada . 2,667 parts In-Stock

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iodParts Technologies Inc.

India . 1,175 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$3.965

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$3.844

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$3.763

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$3.763

Cyclops Electronics Ltd (Excess)

UK . 761 parts In-Stock

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Authorized Procurement Solutions

USA . 350 parts In-Stock

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Ashlea Components Ltd (Excess)

UK . 57 parts In-Stock

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Assy Fe

Spain . 45 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the CY62147EV30LL-45ZSXI by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality SRAM products that are perfect for a wide range of applications. From industrial to consumer electronics, this SRAM offers a seamless experience with its common input/output type and 256Kx16 organization. With a nominal supply voltage of 3V and a maximum access time of 45ns, this product ensures efficiency and optimal functionality. Trust Infineon Technologies to provide cutting-edge solutions for all your memory needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into circuit boards, saving space and allowing for a more compact design.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V ensures compatibility with a wide range of electronic systems.

Memory Density: 4194304 bit

High memory density of 4Mb (4194304 bits) allows for storing a large amount of data and running complex applications efficiently.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand elevated temperatures in industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the reliability and efficiency of the product.

Technical Specifications

SRAM CY62147EV30LL-45ZSXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e4

Length:

18.415 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.194 mm

Maximum Standby Current:

.000007 Amp

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

10.16 mm

Trade Compliance

CY62147EV30LL-45ZSXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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