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CY62167DV30LL-55BVXI

Infineon Technologies

CY62167DV30LL-55BVXI by Infineon Technologies

Infineon's CY62167DV30LL-55BVXI is a 1MX16 SRAM with 3.3V supply, 55ns access time, and 16-bit memory width. Ideal for industrial applications requiring fast and reliable data storage in a compact GRID ARRAY package with very thin profile and fine pitch design.

Median Price

$7.480

Lifecycle Status

Suppliers In-Stock

27

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 140 parts In-Stock

1+ parts

$5.369

100+ parts

$5.068

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-

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140

$5.369

$5.068

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Chip1Stop

Japan . 280 parts In-Stock

1+ parts

$11.100

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280

$11.100

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Mouser Electronics

USA . 467 parts In-Stock

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$15.000

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$12.270

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$9.720

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467

$15.000

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$9.720

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Flip Electronics (Authorized)

USA . 55,753 parts In-Stock

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DigiKey

USA . 33,256 parts In-Stock

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$6.080

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$6.080

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Verical

USA . 29,256 parts In-Stock

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$5.264

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Future Electronics

Canada . 1,517 parts In-Stock

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$7.480

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1,517

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$7.480

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Rochester

USA . 54 parts In-Stock

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$8.740

1k+ parts

$7.820

10k+ parts

$7.360

54

-

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$7.820

$7.360

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 23 parts In-Stock

1+ parts

$9.130

100+ parts

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23

$9.130

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Nova Conductors

Japan . 53 parts In-Stock

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$11.336

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53

$11.336

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Flip Electronics

USA . 29,256 parts In-Stock

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29,256

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Vyrian

USA . 22,053 parts In-Stock

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Chip Stock

USA . 7,500 parts In-Stock

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7,500

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IBS Electronics

USA . 1,517 parts In-Stock

1+ parts

-

100+ parts

$8.738

1k+ parts

$10.491

10k+ parts

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1,517

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$8.738

$10.491

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VRG Components

USA . 840 parts In-Stock

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840

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Cyclops Electronics Ltd

UK . 211 parts In-Stock

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Sensible Micro Corp

USA . 171 parts In-Stock

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Electronics Depot

USA . 112 parts In-Stock

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Prism Electronics

USA . 95 parts In-Stock

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Zilex Electronics Inc.

Canada . 82 parts In-Stock

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Dan-Mar Components

USA . 31 parts In-Stock

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Holdelec - ElecDif-Pro

France . 30 parts In-Stock

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Halfin

Belgium . 28 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 21 parts In-Stock

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Bristol Electronics

USA . 18 parts In-Stock

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Resion

USA . 5 parts In-Stock

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Classic Components Corporation

USA . 4 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 105 parts In-Stock

1+ parts

$3.189

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105

$3.189

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Ampacity Inc.

Singapore . 18,657 parts In-Stock

1+ parts

$4.030

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18,657

$4.030

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Aztec Data Supply Inc.

USA . 2,698 parts In-Stock

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$5.521

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2,698

$5.521

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Modulus Dynamics

Lithuania . 5,386 parts In-Stock

1+ parts

$5.835

100+ parts

$5.602

1k+ parts

$5.368

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5,386

$5.835

$5.602

$5.368

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Corphita

USA . 926 parts In-Stock

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$8.649

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926

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Component Stockers USA

USA . 7,706 parts In-Stock

1+ parts

$8.690

100+ parts

$8.420

1k+ parts

$8.280

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7,706

$8.690

$8.420

$8.280

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Semicontronic

India . 18,305 parts In-Stock

1+ parts

$8.770

100+ parts

$8.551

1k+ parts

$8.507

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18,305

$8.770

$8.551

$8.507

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Continental Prestige Electronics

USA . 1,770 parts In-Stock

1+ parts

$11.336

100+ parts

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$11.110

1,770

$11.336

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$11.110

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$11.340

100+ parts

$10.773

1k+ parts

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10k+ parts

$10.093

100

$11.340

$10.773

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$10.093

A-Z Elektronik GmbH

Germany . 5,459 parts In-Stock

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5,459

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Argo Parts USA

USA . 4,615 parts In-Stock

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,639 parts In-Stock

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3,639

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Perfect Parts

USA . 2,984 parts In-Stock

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2,984

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Lixinc

USA . 2,291 parts In-Stock

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ChipstoGo Electronic ltd

UK . 1,050 parts In-Stock

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Futuretech Components

Singapore . 570 parts In-Stock

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570

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Kepictronics

USA . 224 parts In-Stock

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224

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Lucentia Tech

USA . 100 parts In-Stock

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$2.716

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$2.716

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$2.716

100

-

$2.716

$2.716

$2.716

ChipTracer

USA . 11 parts In-Stock

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Overview

Unlock unparalleled performance and reliability with the CY62167DV30LL-55BVXI by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies guarantees top-notch quality in their products. This SRAM device offers lightning-fast access times, making it ideal for high-speed applications in various industries. With a memory density of 16777216 bits and a maximum access time of 55 ns, this product ensures seamless operations and efficient data processing. Trust Infineon Technologies to deliver cutting-edge solutions that exceed expectations. Elevate your projects with the CY62167DV30LL-55BVXI and experience unmatched performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Operating Mode: ASYNCHRONOUS

Enables independent and simultaneous access to multiple memory locations, increasing efficiency in data retrieval.

Nominal Supply Voltage / Vsup (V): 3

Standard voltage level ensures compatibility with a wide range of systems and devices.

Power Supplies (V): 2.5/3.3

Versatile power supply options allow for flexibility in different operating conditions and environments.

No. of Terminals: 48

Sufficient number of terminals for efficient data transfer and connectivity within the system.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Compact and efficient package design saves space on the PCB and enhances overall system performance.

Maximum Operating Temperature: 85 °C

Wide temperature range ensures reliable operation in various industrial environments.

Organization: 1MX16

High memory organization allows for storing large amounts of data efficiently and accessing it quickly.

Output Characteristics: 3-STATE

Three-state output allows for flexible control of the data bus, enabling multi-device communication without bus contention.

Minimum Standby Voltage: 1.5 V

Low standby voltage helps conserve power when the device is not in active use, promoting energy efficiency.

Terminal Finish: TIN SILVER COPPER

Quality terminal finish ensures reliable electrical connections and signal integrity.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range makes the product suitable for rugged and demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, contributing to overall efficiency.

Memory Width: 16

Wide memory width enables faster data transfer and processing speeds, enhancing system performance.

Maximum Access Time: 55 ns

Fast access time ensures quick retrieval of data, reducing latency and improving overall system responsiveness.

Technical Specifications

SRAM CY62167DV30LL-55BVXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

55 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

9.5 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Standby Current:

.00001 Amp

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

8 mm

Trade Compliance

CY62167DV30LL-55BVXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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