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CY62158EV30LL-45BVXIT

Infineon Technologies

CY62158EV30LL-45BVXIT by Infineon Technologies

Infineon's CY62158EV30LL-45BVXIT is a 1MX8 SRAM with 3.6V max supply voltage, 45ns access time, and 85°C operating temp. Ideal for industrial applications requiring high-speed memory in a compact GRID ARRAY package with very thin profile and fine pitch terminals.

Median Price

$3.960

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 9,694 parts In-Stock

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9,694

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Verical

USA . 3,081 parts In-Stock

1+ parts

-

100+ parts

$4.400

1k+ parts

$3.938

10k+ parts

$3.700

3,081

-

$4.400

$3.938

$3.700

Rochester

USA . 3,081 parts In-Stock

1+ parts

-

100+ parts

$3.520

1k+ parts

$3.150

10k+ parts

$2.960

3,081

-

$3.520

$3.150

$2.960

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 7,582 parts In-Stock

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7,582

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Vyrian

USA . 5,737 parts In-Stock

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5,737

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Digiode

USA . 484 parts In-Stock

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484

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Resion

USA . 246 parts In-Stock

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246

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,135 parts In-Stock

1+ parts

$4.378

100+ parts

-

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2,135

$4.378

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Semicontronic

India . 5,758 parts In-Stock

1+ parts

$4.480

100+ parts

$4.368

1k+ parts

$4.346

10k+ parts

-

5,758

$4.480

$4.368

$4.346

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Modulus Dynamics

Lithuania . 1,239 parts In-Stock

1+ parts

$5.179

100+ parts

$4.972

1k+ parts

$4.765

10k+ parts

-

1,239

$5.179

$4.972

$4.765

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Corohmni

South Africa . 12 parts In-Stock

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$5.761

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12

$5.761

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Ampacity Inc.

Singapore . 5,747 parts In-Stock

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$9.750

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$9.750

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Component Stockers USA

USA . 1,491 parts In-Stock

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$80.980

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1,491

$80.980

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Continental Prestige Electronics

USA . 5,642 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,878 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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3,700

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Alle Elektronik GmbH

Germany . 3,252 parts In-Stock

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Argo Parts USA

USA . 2,518 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Lixinc

USA . 1,942 parts In-Stock

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Advanced Electronics

New Zealand . 750 parts In-Stock

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750

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Corphita

USA . 260 parts In-Stock

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260

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unlock the power of high-quality SRAM technology with the CY62158EV30LL-45BVXIT by Infineon Technologies. Designed with precision and reliability in mind, this product offers unparalleled performance in a wide range of applications. With a focus on value and efficiency, customers can trust in the benefits and advantages that this memory IC type brings to their projects. Upgrade your technology today with the CY62158EV30LL-45BVXIT and experience the difference that top-notch manufacturing and cutting-edge design can make for your business.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the SRAM chip, making it resistant to physical damage and environmental factors.

Surface Mount : YES

Surface mount capability allows for easy installation on PCBs, saving space and reducing assembly time.

Package Shape : RECTANGULAR

Rectangular package shape is commonly used and facilitates easy integration into electronic devices.

Nominal Supply Voltage / Vsup (V) : 3

Operating at a nominal supply voltage of 3V ensures compatibility with standard power sources.

Operating Mode : ASYNCHRONOUS

Asynchronous operation allows for independent and versatile memory access, enhancing performance and flexibility.

Technical Specifications

SRAM CY62158EV30LL-45BVXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Standby Current:

.000005 Amp

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

6 mm

Trade Compliance

CY62158EV30LL-45BVXIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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