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CY62167DV30LL-55BVXIT

Infineon Technologies

CY62167DV30LL-55BVXIT by Infineon Technologies

CY62167DV30LL-55BVXIT by Infineon Technologies is a 1MX16 SRAM with 3.6V max supply voltage, 55ns access time, and 16-bit memory width. It is ideal for industrial applications requiring high-speed parallel memory operations in a compact grid array package with very thin profile and fine pitch terminals.

Median Price

$9.910

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 133 parts In-Stock

1+ parts

$3.665

100+ parts

$3.407

1k+ parts

-

10k+ parts

-

133

$3.665

$3.407

-

-

DigiKey

USA . 40 parts In-Stock

1+ parts

$15.930

100+ parts

$13.633

1k+ parts

$12.851

10k+ parts

$12.204

40

$15.930

$13.633

$12.851

$12.204

Mouser Electronics

USA . 1,373 parts In-Stock

1+ parts

$17.460

100+ parts

$14.940

1k+ parts

$13.660

10k+ parts

$13.370

1,373

$17.460

$14.940

$13.660

$13.370

Newark

USA . 1,998 parts In-Stock

1+ parts

$20.500

100+ parts

$18.200

1k+ parts

$17.420

10k+ parts

-

1,998

$20.500

$18.200

$17.420

-

Chip1Stop

Japan . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$8.894

2,000

-

-

-

$8.894

Farnell

UK . 1,970 parts In-Stock

1+ parts

-

100+ parts

$8.660

1k+ parts

-

10k+ parts

-

1,970

-

$8.660

-

-

Verical

USA . 767 parts In-Stock

1+ parts

-

100+ parts

$10.925

1k+ parts

$9.775

10k+ parts

$9.200

767

-

$10.925

$9.775

$9.200

Rochester

USA . 767 parts In-Stock

1+ parts

-

100+ parts

$8.740

1k+ parts

$7.820

10k+ parts

$7.360

767

-

$8.740

$7.820

$7.360

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 79 parts In-Stock

1+ parts

$9.443

100+ parts

-

1k+ parts

-

10k+ parts

-

79

$9.443

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$11.340

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$11.340

-

-

-

Chip Stock

USA . 6,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,980

-

-

-

-

IBS Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$9.035

2,000

-

-

-

$9.035

Vyrian

USA . 1,331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,331

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 2,099 parts In-Stock

1+ parts

$4.392

100+ parts

$4.216

1k+ parts

$4.041

10k+ parts

-

2,099

$4.392

$4.216

$4.041

-

Corohmni

South Africa . 1,010 parts In-Stock

1+ parts

$5.558

100+ parts

-

1k+ parts

-

10k+ parts

-

1,010

$5.558

-

-

-

Aztec Data Supply Inc.

USA . 290 parts In-Stock

1+ parts

$5.805

100+ parts

-

1k+ parts

-

10k+ parts

-

290

$5.805

-

-

-

Ampacity Inc.

Singapore . 1,637 parts In-Stock

1+ parts

$7.370

100+ parts

-

1k+ parts

-

10k+ parts

-

1,637

$7.370

-

-

-

Semicontronic

India . 1,402 parts In-Stock

1+ parts

$7.370

100+ parts

$7.186

1k+ parts

$7.149

10k+ parts

-

1,402

$7.370

$7.186

$7.149

-

Corphita

USA . 988 parts In-Stock

1+ parts

$8.946

100+ parts

-

1k+ parts

-

10k+ parts

-

988

$8.946

-

-

-

Continental Prestige Electronics

USA . 5,046 parts In-Stock

1+ parts

$11.340

100+ parts

-

1k+ parts

-

10k+ parts

$11.113

5,046

$11.340

-

-

$11.113

Netroflash

USA . 50 parts In-Stock

1+ parts

$11.340

100+ parts

$11.113

1k+ parts

-

10k+ parts

-

50

$11.340

$11.113

-

-

Component Stockers USA

USA . 9,606 parts In-Stock

1+ parts

$12.790

100+ parts

$9.880

1k+ parts

$9.320

10k+ parts

-

9,606

$12.790

$9.880

$9.320

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A-Z Elektronik GmbH

Germany . 5,501 parts In-Stock

1+ parts

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5,501

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Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

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3,790

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-

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Alle Elektronik GmbH

Germany . 3,667 parts In-Stock

1+ parts

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3,667

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-

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Perfect Parts

USA . 3,192 parts In-Stock

1+ parts

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3,192

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Authorized Procurement Solutions

USA . 2,300 parts In-Stock

1+ parts

-

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2,300

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-

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Argo Parts USA

USA . 967 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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967

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-

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Robosynatics

Brazil . 100 parts In-Stock

1+ parts

-

100+ parts

$0.303

1k+ parts

$0.303

10k+ parts

$0.303

100

-

$0.303

$0.303

$0.303

Lucentia Tech

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$0.303

1k+ parts

$0.303

10k+ parts

$0.303

100

-

$0.303

$0.303

$0.303

Advanced Electronics

New Zealand . 66 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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66

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-

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-

Overview

Discover the cutting-edge CY62167DV30LL-55BVXIT SRAM by Infineon Technologies, a top-tier manufacturer known for exceptional quality. This versatile memory solution offers unparalleled performance and reliability for a wide range of applications. With a nominal supply voltage of 3V and impressive features like 3-STATE output characteristics and a lightning-fast access time of 55ns, this product provides immense value to customers looking for high-speed data storage solutions. Upgrade your systems with this industrial-grade SRAM and experience enhanced performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this SRAM lightweight and durable.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and allows for easy integration into various electronic devices.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode provides faster data access and improved performance.

Input/Output Type: COMMON

The common input/output type simplifies the interface with other components in the system.

Nominal Supply Voltage / Vsup (V): 3

The 3V nominal supply voltage ensures compatibility with a wide range of systems and power sources.

Power Supplies (V): 2.5/3.3

The availability of multiple power supply options provides flexibility in system design and operation.

No. of Terminals: 48

The 48 terminals offer ample connectivity for various system configurations and requirements.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch enhances space efficiency and reliability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this SRAM suitable for industrial applications with challenging environmental conditions.

Technical Specifications

SRAM CY62167DV30LL-55BVXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

55 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

9.5 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Standby Current:

.00001 Amp

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

CY62167DV30LL-55BVXIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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